Search
the marketplace
through 230,000 Chemicals and Raw Ingredients
through 8,000+ Supplier owned storefronts
Knowde for Suppliers
Formulations
Food & Nutrition Formulations
Formulations
Cosmetics & Personal Care Formulations
Industries
Agriculture & Feed
Product Families
View All
Adhesives & Sealants
Automotive & Transportation
Building & Construction
Consumer Goods
Electrical & Electronics
Food & Nutrition
Healthcare & Pharma
HI&I Care
Industrial
Paints & Coatings
Personal Care
Printing & Packaging
Sustainability
Cosmetic Ingredients
Sustainable Cosmetic Ingredients
Food Ingredients
Plastics & Packaging
Cleaning Ingredients
CASE Ingredients
Products
Agrochemicals
Applications
View All
Animal Feed & Nutrition
Base Chemicals & Intermediates
CASE Ingredients
Cleaning Ingredients
Composite Materials
Cosmetic Ingredients
Elastomers
Fluids & Lubricants
Food Ingredients
Industrial Additives & Materials
Pharmaceuticals & Nutraceuticals
Pigments & Colorants
Plastics
Ready-to-Use Products
Cosmetic Ingredients
Food Ingredients
Most popular categories
CASE Ingredients
Plastics
Pharmaceuticals & Nutraceuticals
Knowde for Suppliers
Knowde
Composite Materials
Prepregs & Molding Compounds
Products in Prepregs & Molding Compounds: Polyimide (PI)
17 Products found in Prepregs & Molding Compounds
Browse
Applications
Show All 6 Categories
Filters
Suppliers
Applications
Processing Methods
End Uses
Reinforcement Material
Polymer Name
Products
Brands
Suppliers
Formulations
Documents
Relevance
Isola
Isola P25N
Polymer Name:
Polyimide (PI)
Functions:
Prepreg
Reinforcement Material:
Glass Fibers
End Uses:
Medical Devices
P25N consist of a polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. These products utilize a polyimide and thermoplastic blend resin, fully cured without the use of Methylenedianiline (MDA). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.
Isola
Isola P95/P25
Functions:
Laminate
Polymer Name:
Polyimide (PI)
Reinforcement Material:
Glass Fibers
P95/P25 consist of an HB flammability rated polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. These products utilize a polyimide and thermoplastic blend resin, fully cured without the use of MDA (Methylenedianiline). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.
Arlon Electronic Materials
Arlon® 35N
Polymer Name:
Polyimide (PI)
Functions:
Laminate, Prepreg
End Uses:
PCB Materials
35N is a pure polyimide laminate and prepreg system for applications requiring high temperature performance. High Tg (250°C) results in low Z-direction expansion for resistance to PTH failure during PWB processing, and minimizes risk of latent PTH defects in-service. Reduced temperature and time to cure offers improved throughput compared to traditional polyimide cycles.
Arlon Electronic Materials
Arlon® 33N
Polymer Name:
Polyimide (PI)
Functions:
Laminate, Prepreg
33N is a flame retardant (UL94 V-O) polyimide laminate and prepreg system where the excellent high performance properties of polyimide need to be combined with flame retardance. High Tg (250°C) results in low overall z-axis expansion, and minimizes risk of latent PTH defects in-service.
Axiom Materials
Axiom Materials AX-3611
Polymer Name:
Polyimide (PI)
Functions:
Prepreg
Reinforcement Material:
Glass Fibers
AX-3611 is a MDA-free Condensation Polyimide Fiberglass Prepreg.
Arlon Electronic Materials
Arlon® 38N
Polymer Name:
Polyimide (PI)
Functions:
Prepreg
End Uses:
PCB Materials, Insulators
38N is an improved polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow is required.
Arlon Electronic Materials
Arlon® 85N
Polymer Name:
Polyimide (PI)
Functions:
Laminate, Prepreg
85N is the ultimate polyimide and laminate prepreg system fo PWB's requiring resistance to high temperature, both in process and in end-use applications. Bromine-free chemistry provides Bestin-Class thermal stability for applications with sustained high in-use temperatures as well as for use in lead-free soldering applications.
Renegade Materials Corporation
Renegade Materials Corporation AFR-PE-4 Polyimide
Polymer Name:
Polyimide (PI)
Functions:
Prepreg
Processing Methods:
Prepreg Processing, Compression Molding
Renegade Materials Corporation AFR-PE-4 Polyimide produces thousands of pounds of polyimide prepregs for flight hardware every month with a perfect quality and delivery record! Renegade Materials' high temperature prepregs and adhesives are powered by next generation polyimide resin technology. As the largest production supplier of polyimide composite materials in the world, we are the industry's most-trusted commercial source for AFR-PE-4 and other aerospace grade polyimide materials. Renegade Materials is the exclusive supplier of prepregs made with proprietary RM-1100 polyimide resin technology offering the highest temperature polymeric solution for commercial and military engine/aircraft applications up to 700°F. Renegade Materials is also the exclusive supplier of prepregs made with patented MVK-14M FreeFormTM, a polyimide prepreg used in global commercial aircraft applications up to 550°F.
KREMPEL GmbH
PREPREG system HH (polyimide resin)
Polymer Name:
Thermoset Polyimide (PI), Polyimide (PI)
Functions:
Prepreg
Processing Methods:
Compression Molding
End Uses:
Structural Components
PREPREG system HH (polyimide resin) are based on a high temperature resistant polyimide resin . Its processing is hot pressing or PREPREG winding.
Arlon Electronic Materials
Arlon® 84N
Polymer Name:
Polyimide (PI)
Functions:
Prepreg
84N is a high performance ceramic-filled polyimide prepreg based on Arlon’s 85N pure polyimide system, designed for use in filling etched areas in polyimide multilayers that contain thick copper layers and for filling clearance holes in metal cores. The ceramic filler in the resin serves to reduce shrinkage and inhibit crack formulation during through-hole drilling in filled clearance areas.
Isola
Isola P96/P26
Functions:
Laminate
Polymer Name:
Polyimide (PI)
Reinforcement Material:
Glass Fibers
P96/P26 consist of a flame resistant, polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. These products utilize a polyimide and thermoplastic blend resin, fully cured without the use of MDA (Methylenedianiline). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.
Renegade Materials Corporation
Renegade Materials Corporation RM-1066 Polyimide
Polymer Name:
Polyimide (PI)
Functions:
Prepreg
Processing Methods:
Prepreg Processing, Compression Molding
Renegade Materials Corporation RM-1066 Polyimide produces thousands of pounds of polyimide prepregs for flight hardware every month with a perfect quality and delivery record! Renegade Materials' high temperature prepregs and adhesives are powered by next generation polyimide resin technology. As the largest production supplier of polyimide composite materials in the world, we are the industry's most-trusted commercial source for AFR-PE-4 and other aerospace grade polyimide materials. Renegade Materials is the exclusive supplier of prepregs made with proprietary RM-1100 polyimide resin technology offering the highest temperature polymeric solution for commercial and military engine/aircraft applications up to 700°F. Renegade Materials is also the exclusive supplier of prepregs made with patented MVK-14M FreeFormTM, a polyimide prepreg used in global commercial aircraft applications up to 550°F.
Renegade Materials Corporation
Renegade Materials Corporation RM-1100 Polyimide
Polymer Name:
Polyimide (PI)
Functions:
Prepreg
Processing Methods:
Prepreg Processing, Compression Molding
Renegade Materials Corporation RM-1100 Polyimide produces thousands of pounds of polyimide prepregs for flight hardware every month with a perfect quality and delivery record! Renegade Materials' high temperature prepregs and adhesives are powered by next generation polyimide resin technology. As the largest production supplier of polyimide composite materials in the world, we are the industry's most-trusted commercial source for AFR-PE-4 and other aerospace grade polyimide materials. Renegade Materials is the exclusive supplier of prepregs made with proprietary RM-1100 polyimide resin technology offering the highest temperature polymeric solution for commercial and military engine/aircraft applications up to 700°F. Renegade Materials is also the exclusive supplier of prepregs made with patented MVK-14M FreeFormTM, a polyimide prepreg used in global commercial aircraft applications up to 550°F.
Axiom Materials
Axiom Materials AX-5611
Polymer Name:
Polyimide (PI)
Functions:
Prepreg
Reinforcement Material:
Carbon Fibers
AX-5611 is a MDA-free condensation Polyimide Carbon Prepreg.
Arlon Electronic Materials
Arlon® 85HP
Polymer Name:
Polyimide (PI)
Functions:
Laminate, Prepreg
End Uses:
Semiconductor Applications
Arlon 85HP’s unique blend of pure polyimide resin and micro-fi ne proprietary fi llers results in superior performance for demanding applications. Compared to conventional polyimide systems, 85HP has a lower Z-axis expansion and twice the thermal conductivity. 85HP reduces resin cracking and wicking in designs with high density plated through holes and vias. 85HP prepreg has resin fl ow characteristics and pressed thickness matching standard polyimides.
Arlon Electronic Materials
Arlon® 37N
Polymer Name:
Polyimide (PI)
Functions:
Prepreg
37N is a polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow is required.
Arlon Electronic Materials
Arlon® 35NQ
Polymer Name:
Polyimide (PI)
Functions:
Laminate, Prepreg
35NQ is a pure polyimide laminate and prepreg system. Reinforced with woven Quartz fabric, combining the advantages of a reduced cure cycle, high temperature polyimide system (Tg >/=250°C), with low dielectric constant and loss tangent (DK = 3.5, loss 0.009 at 1 MHz) for applications requiring operation at RF/Microwave frequencies. Polyimide Quartz materials also exhibit reduced in-plane CTE for expansion matched SMT applications.