Search_02
Search_02

Adhesives & Sealants

488 products found in Adhesives & Sealants

Product Families

Other Adhesives & Sealants Applications

Other Adhesives & Sealants Applications

Cows in a flower field

Industrial & Assembly Adhesives

disassembled parts of the smartphone on a brown background,the concept of computer hardware, mobile phone, electronic, repairing, upgrade and technology.

Building & Construction

Background of potato starch flour powder texture close-up.Wooden spoon scoops potato starch.

DIY & Consumer

Packaging & Paper

Packaging & Paper

bread rolls on wooden table on black background

Medical Adhesives

Product Families
keyboard_arrow_down
Functions
keyboard_arrow_down
Chemical Family
keyboard_arrow_down
End Uses
keyboard_arrow_down
Compatible Polymers & Resins
keyboard_arrow_down
Suppliers
keyboard_arrow_down
Chemical Family: Epoxy & Epoxy Derivatives
  • Products
  • Brands
  • Suppliers
  • Formulations
  • Documents
sort
Most Viewed
keyboard_arrow_down
Mitsubishi Chemical Group banner
Mitsubishi Chemical Group logo

Mitsubishi Chemical Group

jER™ YX8000D

Polymer Name: Epoxy Resins & Compounds
Function: Coupling Agent, Binder, Adhesion Promoter
Chemical Family: Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol A Type Epoxy
Compatible Substrates & Surfaces: Metal, Aluminum, Concrete & Masonry

jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group

Olin Corporation banner
Olin Corporation logo

Olin Corporation

D.E.R.™ 354

Chemical Family: Epoxy & Epoxy Derivatives, Bisphenol Epoxy Resins
End Uses: Solventless & High Solids Coating, Epoxy Adhesive & Sealant
Compatible Substrates & Surfaces: Composites
Features: Low Viscosity, Improved Flexibility

D.E.R.354 Liquid Epoxy Resin is a standard liquid epoxy resin based on the reaction products of bisphenol F and epichlorohydrin. D.E.R. 354 Liquid Epoxy Resin is an unmodified bisphenol F based liquid, low viscosity epoxy resin. It is compatible with common epoxy resins and can be blended with them in any ratio. It achieves a high degree of cure at ambient temperatures, providing improved resistance performance against solvents compared to standard bisphenol A liquid epoxy resins. D.E.R. 354 Epoxy Resin may be used alone but is more frequently used in combination with standard bisphenol A liquid epoxy resins such as D.E.R. 330 Resin or D.E.R.TM 331TM Resin. By using suitable combinations of bisphenol A and bisphenol F epoxy resins, not only is the viscosity reduced but the tendency to crystallize is almost eliminated. See the Dow technical bulletin, Crystallization of Liquid Epoxy Resins, Form No. 296-01652. A wide variety of curing agents is available to cure this resin at ambient conditions. Most frequently used are aliphatic polyamines, polyamides and modified versions of these. If anhydride or catalytic curing agents are employed, elevated temperature and long-post cures are required to develop full end properties.

Olin Corporation banner
Olin Corporation logo

Olin Corporation

D.E.R.™ 332

Chemical Family: Epoxy & Epoxy Derivatives, Bisphenol A Type Epoxy, Bisphenol Epoxy Resins
End Uses: Epoxy Adhesive & Sealant, Radiation Curable Coating
Compatible Substrates & Surfaces: Composites
Features: Low Viscosity

D.E.R.T 332 Epoxy Resin is a high purity bisphenol A diglycidylether. The uniqueness of D.E.R. 332 Liquid Epoxy Resin is reflected in its maximum epoxy equivalent weight of 176 grams/equivalent (the chemically pure diglycidylether of bisphenol A has an epoxy equivalent weight of 170 g/eq). Because of its high purity and low polymer fractions content, D.E.R. 332 Epoxy Resin assures uniform performance and exceptionally low viscosity, low chloride content and light color. Under some cure conditions this epoxy resin provides improved elevated temperature properties over standard bisphenol A based epoxy resins such as D.E.R.“ 331“ Epoxy Resin for example. D.E.R. 332 Epoxy Resin is used mainly in filament winding, electrical laminates and encapsulation applications. A wide variety of curing agents is available to cure this liquid epoxy resin at ambient conditions. Most frequently used curing agents are cycloaliphatic polyamines, polyamides, amidoamines, and modified versions of these. Curing may also be done at an elevated temperature to improve selected properties such as chemical resistance and glass transition temperature. Elevated temperature cures are necessary and long post-cures are required to develop full end properties if anhydride or catalytic curing agents are employed.

Olin Corporation banner
Olin Corporation logo

Olin Corporation

D.E.R.™ 353

Chemical Family: Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives
End Uses: Epoxy Adhesive & Sealant
Compatible Substrates & Surfaces: Composites
Features: Low Viscosity, Improved Flexibility, Long Potlife

D.E.R.™ 353 Liquid Epoxy Resin is a mono-functional reactive diluent modified liquid epoxy resin. D.E.R. 353 Epoxy Resin is a C12-C14 aliphatic glycidyl ether modified bisphenol A/F based epoxy resin of low viscosity. The performance of D.E.R. 353 Liquid Epoxy Resin in ambient curing coating/flooring formulations is similar to that obtained with D.E.R. 324 Epoxy Resin. The tendency for D.E.R. 353 Epoxy Resin to crystallize, however, is much lower than for D.E.R. 324 Epoxy Resin. The enhanced crystallization resistance caused by the bisphenol A/F epoxy resin blend greatly improves the formulation stability, reduces the handling costs, and makes emptying drums easier. See the Dow technical bulletin, Crystallization of Liquid Epoxy Resins, Form No. 296-01652. The reactive diluent contained in D.E.R. 353 Epoxy Resin lowers both the viscosity and the surface tension of the resin compound which results in excellent surface wetting and adhesion. Moreover, the reactive diluent used in this resin formulation increases pot life as well as flexibility (impact resistance). Although the diluent reduces the solvent resistance somewhat versus regular unmodified bisphenol A epoxy resins, such as D.E.R.T 331Epoxy Resin, it improves the acid resistance. Compared to other C12-C14 aliphatic glycidyl ether modified epoxy resins such as D.E.R. 324 Epoxy Resin, an improved resistance against solvent has been demonstrated.

Olin Corporation banner
Olin Corporation logo

Olin Corporation

D.E.N.™ 425

Chemical Family: Phenol & Cresol Epoxy Resins (Novolac), Epoxy & Epoxy Derivatives
End Uses: Epoxy Adhesive & Sealant
Features: Chemical Resistance, Thermal Resistance

D.E.N.TM 425 Epoxy Novolac Resin is a liquid reaction product of epichlorohydrin and phenol-formaldehyde novolac. D.E.N. 425 Epoxy Novolac Resin is an epoxidized phenolic resin of higher functionality than standard bisphenol A based liquid epoxy resins. Epoxy novolac resins combine, in one molecule, the thermal stability of a phenolic backbone with the reactivity and versatility of an epoxy. They are distinguished by particular good thermal stability, mechanical strength and resistance against chemicals. They find ready acceptance for lining pipelines, storage tanks and pumps. D.E.N. 425 Epoxy Novolac Resin has been developed to fill the gap between the two functional standard bisphenol F based liquid epoxy resins and the high viscous epoxy novolac resins. It has a viscosity similar to a standard bisphenol A based liquid epoxy resin. The multi-functionality, 2.5 epoxy groups per mole, of D.E.N.425 Epoxy Novolac Resin produces a more tightly cross-linked cured system than bisphenol A based liquid epoxy resins having improved high temperature performance and improved resistance against various chemical. D.E.N. 425 Epoxy Novolac Resin can be formulated to fully cure at ambient temperatures with the corresponding curing agents without the need of additional heat cure.

Show36of 488 results per page
Go to page
For CustomersOverviewCustomer Features

© 2022 Knowde. All Rights Reserved.

Terms of Use | Cookies
Terms of UseCookies