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MITO Material Solutions
MITO® E-GO™ RES-1
Polymer Name:
Epoxy Resins & Compounds
Chemical Family:
Epoxy & Epoxy Derivatives
Processing Methods:
Compression Molding
End Uses:
Paddles, Snowboards, Skate Board, Golf Clubs, Skis
MITO® E-GO™ RES-1 is a laminating epoxy resin powered with our flagship product MITO® E-GO, a modified graphene oxide additive that makes graphene easy to use and accessible to all. Designed for Compression molding applications for high-performance sporting goods, it boosts the performance of fiber-reinforced applications, resulting in significantly improved durability while maintaining a lighter weight. Secondary properties such as damping, thermal conductivity, and resistivity are also expected. This product is sold as a kit consisting of 1 gallon of Resin loaded with 1% of MITO® E-GO® and 1 quart of MITO® standard accompanying hardener. Graphene Council Mito Materials provides in-resin graphene additive for composites Mito Materials provides in-resin graphene additive for composites
Wacker Chemie AG
SILRES® K
Functions:
Resins, Binders & Matrix Materials
Chemical Family:
Silicones
SILRES® K is a solution of a condensation-curing methyl silicone resin in toluene. The product can be used as a binder or as an impregnation agent for porous materials. Besides, SILRES® K is the ideal product for making tack-free prepregs with excellent storage stability. Fully cured SILRES® K has a very low carbon content and thus yields a high ash content when pyrolized. Composites made of SILRES® K show long-term stability against weathering, moisture, and UV light. They can therefore be continuously exposed to constantly changing climatic conditions, UV radiation, and temperatures significantly higher than 300 °C (572 °F). SILRES® K also provides water repellency and excellent electrical insulation properties to the respective composite materials.
Wacker Chemie AG
SILRES® H62 C
Functions:
Resins, Binders & Matrix Materials
Chemical Family:
Silicones
Processing Methods:
Vacuum Pressure Impregnation (VPI)
SILRES® H62 C is a liquid, solvent-free, one-part heat-curing phenyl silicone resin formulation. The product is ideal for impregnating the electrical coils of motors and generators. Besides, SILRES® H62 C can be used to provide hydrophobic properties to porous materials and as a binder for composites made of fibrous fillers, cloths, and woven or non-woven reinforcing materials. The formulation is ready-to-use and crosslinks under heat. While curing, SILRES® H62 C does not release chemical byproducts, so curing shrinkage is barely noticeable. The product also thermosets in thick layers, even when in contact with air. Fully cured SILRES® H62 C has excellent electrical insulation properties and outstanding long-term heat resistance. Additionally, it shows high stability against weathering, moisture, and UV light and can therefore be continuously exposed to constantly changing climatic conditions or UV radiation.
Mitsubishi Chemical Group Corporation
jER™ YX7400N
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resins, Binders & Matrix Materials, Coupling Agent, Impact Modifier, Binder & Resin, Adhesion Promoter, Resin
Chemical Family:
Epoxy & Epoxy Derivatives
End Uses:
Conformal Coating, Semiconductor Applications
Features:
Good Elasticity, Reduced Wear, Excellent Elasticity, High Impact Resistance, Improved Flexibility, Excellent Resilience, Abrasion Resistance, Improved Dimensional Stability, Impact Resistance, Good Mechanical Properties
jER™ YX7400N is an adduct formed from the reaction of epichlorohydrin and an aliphatic polyol.FeaturesAdduct formed from the reaction of epichlorohydrin and an aliphatic polyolExcellent elasticityImpact resistanceApplicationsConsumer appliances and electronicsElectrical devices, assemblies, parts and componentsElectronics adhesivesElectrical and electronic packaging and assemblySpecialty and conformal coatingsPotting compoundsPrinted circuit boards (PCBs)Semiconductor manufacturing*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YL980
Polymer Name:
Epoxy Resins & Compounds
Functions:
Binder & Resin, Adhesion Promoter, Resins, Binders & Matrix Materials, Coupling Agent, Resin
Chemical Family:
Bisphenol Epoxy Resins, Bisphenol A Type Epoxy, Epoxy & Epoxy Derivatives
End Uses:
Underfill, Semiconductor Applications
Compatible Substrates & Surfaces:
Steel, Concrete, Aluminum, Fibers & Fabrics, Plastics, Ceramic, Metal, Glass
Features:
Chemical Resistance, Improved Flexibility, Excellent Electrical Insulation, Electrically Insulating, Low Chlorine Content, Abrasion Resistance, Chemical Resistant, Good Electrical Properties, Water Resistant, Reduced Wear, Heat Resistance, Flame Retardant, Improved Dimensional Stability, Good Mechanical Properties, Water Resistance
jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YX8040
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resin, Coupling Agent, Binder & Resin, Adhesion Promoter, Resins, Binders & Matrix Materials
Chemical Family:
Epoxy & Epoxy Derivatives
Labeling Claims:
High Purity
jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YX7105
Polymer Name:
Epoxy Resins & Compounds
Functions:
Impact Modifier, Coupling Agent, Binder & Resin, Adhesion Promoter, Resin, Resins, Binders & Matrix Materials
Chemical Family:
Epoxy & Epoxy Derivatives
Compatible Substrates & Surfaces:
Ceramic, Fibers & Fabrics, Glass, Aluminum, Concrete, Steel, Plastics, Metal
jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. jER™ YX7105 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol.FeaturesExcellent adhesionGood toughnessGood mechanical, impact and crack resistanceExcellent elasticity and flexibilityApplicationsPrinted electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board)Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)Base film and sheet for wearable devicesCoatingsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ 1750
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resin, Coupling Agent, Binder & Resin, Adhesion Promoter, Resins, Binders & Matrix Materials
Chemical Family:
Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol F Type Epoxy
Labeling Claims:
High Purity
jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ Epoxy YX7110
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resin, Impact Modifier, Coupling Agent, Binder & Resin, Adhesion Promoter, Resins, Binders & Matrix Materials
Chemical Family:
Epoxy & Epoxy Derivatives
jER™ YX7110 is a tough and flexible liquid-type epoxy resin. It can be used as an impact modifier for brittle materials, as an additive to increase impact resistance, and for stress relaxation to avoid cracking and warpage. jER™ YX7110 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol. Features Adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol Crack and impact resistance Excellent flexibility and elasticity High viscosity Low warpage Maintains flexibility even after full-curing Applications Coatings Adhesives Composites Potting and encapsulation materials Base film/sheet for wearable devices *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YL983U
Polymer Name:
Epoxy Resins & Compounds
Functions:
Coupling Agent, Binder & Resin, Adhesion Promoter, Resins, Binders & Matrix Materials, Resin
Chemical Family:
Epoxy & Epoxy Derivatives, Bisphenol F Type Epoxy, Bisphenol Epoxy Resins
End Uses:
Underfill, Semiconductor Applications
Compatible Substrates & Surfaces:
Steel, Concrete, Aluminum, Fibers & Fabrics, Metal, Plastics, Glass, Ceramic
Features:
Good Elastic Recovery, Excellent Electrical Insulation, Low Chlorine Content, Abrasion Resistance, Improved Dimensional Stability, Electrically Insulating, Good Electrical Properties, Good Elastic Recovery, Improved Flexibility, Water Resistant, Reduced Wear, Heat Resistance, Good Mechanical Properties, Chemical Resistant, Low Viscosity, Water Resistance, Chemical Resistance
jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YX4000
Polymer Name:
Epoxy Resins & Compounds
Functions:
Coupling Agent, Binder & Resin, Adhesion Promoter, Resin, Resins, Binders & Matrix Materials
Chemical Family:
Epoxy & Epoxy Derivatives
Compatible Substrates & Surfaces:
Ceramic, Fibers & Fabrics, Glass, Aluminum, Concrete, Steel, Plastics, Metal
jER™ YX4000 is a biphenol-type solid epoxy resin with significantly low melt viscosity, low water absorption and a good balance between adhesiveness and rigidity against stress. It can be used for electrical and electronic applications. jERTM YX4000 is an adduct formed from the reaction of epichlorohydrin and tetramethylbiphenol FeaturesAbrasion, heat and water resistanceElectrical insulationWear resistanceProduct HighlightsSignificantly low melt viscosity (melting point: 108°C)Low chroline contentLow water absorption ApplicationsElectrical and electronic applications (EMC, solder resist, PCB)Potting and encapsulation materialsPowder coatings for ship bottomsAdhesivesComposites *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YX8000D
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resins, Binders & Matrix Materials, Coupling Agent, Binder & Resin, Adhesion Promoter, Resin
Chemical Family:
Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol A Type Epoxy
End Uses:
Radiation Curable Coating, Semiconductor Applications
Compatible Substrates & Surfaces:
Steel, Fibers & Fabrics, Concrete, Aluminum, Metal, Plastics, Glass, Ceramic
Features:
Transparency, Fast Cure, Radiation Curable, UV Curable, Low Chlorine Content, Faster Cure Time, LED-curable, Excellent Adhesion
jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Wacker Chemie AG
SILRES® H 44
Functions:
Resins, Binders & Matrix Materials
Chemical Family:
Silicones
SILRES® H 44 is a powdered, condensation-curing phenyl silicone resin with excellent solubility in various organic solvents. The product can be used as a binder or as an impregnation agent for porous materials. Due to its compatibility with organic resins, SILRES® H 44 can also be used to modify or partly replace phenolic resins in the respective compounds. Compared to other silicone resins, SILRES® H 44 cures relatively quickly at elevated temperatures. It is therefore particularly suitable for fully automated production lines.
Wacker Chemie AG
SILRES® MK Powder
Functions:
Resins, Binders & Matrix Materials
Chemical Family:
Silicones
SILRES® MK Powder is a condensation-curing methyl silicone resin with good solubility in various organic solvents. The product can be used as a binder or as an impregnation agent for porous materials. Additionally, SILRES® MK Powder is the ideal product for making tack-free prepregs with excellent storage stability. When fully cured, SILRES MK POWDER has the lowest carbon content among all WACKER silicone resins, resulting in a high ash content when pyrolized. Composites made of SILRES® MK Powder exhibit long-term stability against weathering, moisture, and UV light. They can be continuously exposed to changing climatic conditions, UV radiation, and temperatures exceeding 300 °C (572 °F). Furthermore, SILRES® MK Powder provides water repellency and excellent electrical insulation properties to the composite materials.
Wacker Chemie AG
SILRES® MK Flakes
Functions:
Resins, Binders & Matrix Materials
Chemical Family:
Silicones
SILRES® MK Flakes is a condensation-curing methyl silicone resin with good solubility in various organic solvents. The product can be used as a binder or as an impregnation agent for porous materials. Besides, SILRES® MK Flakes is the ideal product for making tack-free prepregs with excellent storage stability. Fully cured SILRES® MK Flakes has the lowest carbon content of all WACKER silicone resins and thus yields a very high ash content when pyrolized. Composites made of SILRES® MK Flakes show long-term stability against weathering, moisture, and UV light. They can therefore be continuously exposed to constantly changing climatic conditions, UV radiation, and temperatures significantly higher than 300 °C (572 °F). SILRES® MK Flakes also provides water repellency and excellent electrical insulation properties to the respective composite materials.
Envalior
Akulon® K224-PG8
Polymer Name:
Polyamide 6 (PA 6)
Chemical Family:
Polyamides
Reinforcement Material:
Glass Fibers
Fillers Included:
Glass Fiber
Processing Methods:
Injection Molding
Akulon® K224-PG8 is a polyamide 6 (PA 6) resin utilized in composite materials and plastics, featuring impact modification and lightweight properties. It is applied in various sectors, including consumer goods (appliances and electronics, furniture), automotive, and transportation (chassis, brakes, exterior, interior, safety systems, seating).
Envalior
Akulon® K224-HG6
Polymer Name:
Polyamide 6 (PA 6)
Chemical Family:
Polyamides
Reinforcement Material:
Glass Fibers
Additives Included:
Heat Stabilizer
Fillers Included:
Glass Fiber
Processing Methods:
Injection Molding
Akulon® K224-HG6 is a polyamide 6 (PA 6) resin that offers a cost-effective solution and is known for being heat stabilized, lightweight, and having reduced friction properties. They are UL flame-rated as well. They find applications in various markets, including automotive and transportation, building and construction, consumer goods, and industrial sectors.
Envalior
Akulon® S223-G6-FC BK00001
Polymer Name:
Polyamide 66 (PA 66), Polyamide Copolymer
Chemical Family:
Polyamides
Reinforcement Material:
Glass Fibers
Fillers Included:
Glass Fiber
Processing Methods:
Injection Molding
Akulon® S223-G6-FC BK00001 is a high-performance material that combines the attributes of polyamide 6 and polyamide 66. It is widely used by customers worldwide in a variety of applications, including automotive, electronics, electrical, furniture, and packaging. When employed in molded parts, this material excels in providing an outstanding balance between ease of design and processing, all while delivering exceptional mechanical properties across a wide temperature range and under diverse conditions.
Envalior
EcoPaXX® Q-KG6-FC
Polymer Name:
Polyamide 410 (PA 410)
Chemical Family:
Polyamides
Reinforcement Material:
Glass Fibers
Fillers Included:
Glass Fiber
Processing Methods:
Injection Molding
EcoPaXX® Q-KG6-FC is a bio-based, high-performance polyamide (PA410) made mainly from tropical castor beans that do not compete with the food chain. It offers excellent processability and surface quality, and it is safe for use in a broad variety of food contact applications. Belonging to the family of long-chain polyamides, it provides exceptional performance in demanding environments, including excellent chemical resistance, low moisture absorption, a very high melting point (highest among bio-plastics), and a high crystallization rate. This grade is processed using injection molding and includes 30% glass reinforcement, meeting food contact quality standards.
Envalior
Akulon® K224-TG9
Polymer Name:
Polyamide 6 (PA 6)
Chemical Family:
Polyamides
Reinforcement Material:
Glass Fibers
Fillers Included:
Glass Fiber
Processing Methods:
Injection Molding
Akulon® K224-TG9 is a polyamide 6 (PA 6) resin, a member of the polyamide chemical family. It can be reinforced with glass fibers and incorporate glass fiber fillers during its processing, primarily utilizing the injection molding method. This product is used in various markets, including automotive, transportation, and consumer goods, where it finds a wide range of applications.
Envalior
ForTii® Ace MX53
Polymer Name:
Polyphthalamide (PPA)
Reinforcement Material:
Glass Fibers
Additives Included:
Heat Stabilizer
Fillers Included:
Glass Fiber
Processing Methods:
Injection Molding
ForTii® Ace MX53 is a polyphthalamide (PPA) with unique fatigue performance and chemical resistance. Its high aromatic content and high Tg lead to excellent part stiffness and low creep, even at temperatures up to 150 °C. Moisture uptake occurs slowly, with minimal impact on dimensions. ForTii® Ace MX53 is processed using injection molding technology and is heat stabilized. It is 50% glass-reinforced and suitable for automotive applications.
Envalior
Akulon® Ultraflow K-FG6
Polymer Name:
Polyamide 6 (PA 6)
Chemical Family:
Polyamides
Reinforcement Material:
Glass Fibers
Additives Included:
Heat Stabilizer
Fillers Included:
Glass Fiber
Processing Methods:
Injection Molding
Akulon® Ultraflow K-FG6 is a high-performance polyamide 6 and polyamide 66 material trusted by customers globally in automotive, electronics, electrical, furniture, and packaging applications. It excels in molded parts, offering a superb blend of design ease and processing efficiency, delivering outstanding mechanical properties across diverse conditions and a wide temperature range. In extrusion, it establishes industry-leading standards, boasting exceptional strength, resilience, and ease of processing. Injection molding is the preferred processing technology, and notable features include 30% glass reinforcement and high flow characteristics.
Envalior
Akulon® Ultraflow K-FHG6/B
Polymer Name:
Polyamide 6 (PA 6)
Chemical Family:
Polyamides
Reinforcement Material:
Glass Fibers
Additives Included:
Heat Stabilizer
Fillers Included:
Glass Fiber
Processing Methods:
Injection Molding
Akulon® Ultraflow K-FHG6/B is a high-performance polyamide 6 and polyamide 66 material widely used in automotive, electronics, electrical, furniture, and packaging applications globally. In molded parts, it delivers an exceptional blend of design simplicity and processing ease, along with impressive mechanical properties across a broad temperature range and diverse conditions. For extrusion, it sets industry benchmarks, offering outstanding strength, resilience, and easy processing. Injection molding is the preferred method, and notable features encompass 30% glass reinforcement, heat stabilization, high flow, and enhanced processing capabilities.
Envalior
Akulon® Ultraflow K-FG0
Polymer Name:
Polyamide 6 (PA 6)
Chemical Family:
Polyamides
Reinforcement Material:
Glass Fibers
Fillers Included:
Glass Fiber
Processing Methods:
Injection Molding
Akulon® Ultraflow K-FG0 is a high-performance polyamide 6 and polyamide 66 material used worldwide in automotive, electronics, electrical, furniture, and packaging applications. It excels in molded parts, providing a fine balance between design ease and processing efficiency while delivering remarkable mechanical properties across a broad temperature range and various conditions. In extrusion, it sets industry standards with its exceptional strength, resilience, and ease of processing. Ideal for injection molding, its notable features include 50% glass reinforcement and high flow capabilities.
Envalior
Akulon® S223-G6-FC NA99001
Polymer Name:
Polyamide 66 (PA 66), Polyamide Copolymer
Chemical Family:
Polyamides
Reinforcement Material:
Glass Fibers
Fillers Included:
Glass Fiber
Processing Methods:
Injection Molding
Akulon® S223-G6-FC NA99001 is a high-performance material that blends the characteristics of polyamide 6 and polyamide 66. It is widely employed by customers worldwide in various applications, including automotive, electronics, electrical, furniture, and packaging. In molded parts, this material excels in providing an excellent balance between ease of design and processing, while delivering outstanding mechanical properties over a wide temperature range and under diverse conditions.
Envalior
EcoPaXX® Q-HG6
Polymer Name:
Polyamide 410 (PA 410)
Chemical Family:
Polyamides
Reinforcement Material:
Glass Fibers
Additives Included:
Heat Stabilizer
Fillers Included:
Glass Fiber
Processing Methods:
Injection Molding
EcoPaXX® Q-HG6 is a long aliphatic polyamide with excellent chemical and hydrolysis resistance. It is suitable for thermal management applications and other structural parts. It offers exceptional chemical resistance, low moisture absorption, a very high melting point, and a high crystallization rate. The material can be processed using injection molding technology. It is heat stabilized and contains 30% glass reinforcement.
Envalior
Akulon® K224-PG3
Polymer Name:
Polyamide 6 (PA 6)
Chemical Family:
Polyamides
Reinforcement Material:
Glass Fibers
Fillers Included:
Glass Fiber
Processing Methods:
Injection Molding
Akulon® K224-PG3 is a polyamide 6 (PA 6) resin material used in composite materials and plastics. It features impact modification, lightweight properties, and a UL flame rating. It finds applications in automotive, transportation, and consumer goods. This is typically processed using injection molding techniques.
Envalior
Akulon® RePurposed RE30 BK00003
Polymer Name:
Polyamide 6 (PA 6)
Chemical Family:
Polyamides
Reinforcement Material:
Glass Fibers
Fillers Included:
Glass Fiber
Processing Methods:
Injection Molding
Akulon® RePurposed RE30 BK00003 is a high-performance material that combines the qualities of polyamide 6 and polyamide 66. It is widely used by customers worldwide in various applications, including automotive, electronics, electrical, furniture, and packaging. In molded parts, this material excels in providing an excellent balance between ease of design and processing while delivering outstanding mechanical properties over a broad temperature range and under diverse conditions.
Envalior
Akulon® K224-HGM35
Polymer Name:
Polyamide 6 (PA 6)
Chemical Family:
Polyamides
Reinforcement Material:
Glass Fibers, Mineral
Additives Included:
Heat Stabilizer
Fillers Included:
Mineral, Glass Fiber
Processing Methods:
Injection Molding
Akulon® K224-HGM35 is a polyamide 6 (PA 6) resin that is heat stabilized and lightweight, which makes it ideal for use in various industries such as automotive and transportation, consumer goods, and electrical and electronics. They are typically processed using injection molding techniques.
Envalior
EcoPaXX® Q-DWX6
Polymer Name:
Polyamide 410 (PA 410)
Chemical Family:
Polyamides
Reinforcement Material:
Glass Fibers
Fillers Included:
Glass Fiber
Processing Methods:
Injection Molding
EcoPaXX® Q-DWX6 is a long aliphatic polyamide with excellent mechanical and flow performance, suitable for food contact and drinking water applications. It offers exceptional chemical resistance, low moisture absorption, a very high melting point, and a high crystallization rate. The material can be processed using injection molding technology. It has good surface properties and meets the requirements for drinking water contact grade. It is also 30% glass-reinforced and meets the standards for food contact quality.
Envalior
EcoPaXX® Q-HG10
Polymer Name:
Polyamide 410 (PA 410)
Chemical Family:
Polyamides
Reinforcement Material:
Glass Fibers
Additives Included:
Heat Stabilizer
Fillers Included:
Glass Fiber
Processing Methods:
Injection Molding
EcoPaXX® Q-HG10 is a long aliphatic polyamide with excellent chemical and hydrolysis resistance. It is suitable for thermal management applications and other structural parts. It offers exceptional chemical resistance, low moisture absorption, a very high melting point, and a high crystallization rate. The material can be processed using injection molding technology. It is heat stabilized and contains 50% glass reinforcement.
Envalior
ForTii® Ace MX52
Polymer Name:
Polyphthalamide (PPA)
Reinforcement Material:
Glass Fibers
Additives Included:
Heat Stabilizer
Fillers Included:
Glass Fiber
Processing Methods:
Injection Molding
ForTii® Ace MX52 is a polyphthalamide (PPA) with unique fatigue performance and chemical resistance. Its high aromatic content and high Tg lead to excellent part stiffness and low creep, even at temperatures up to 150 °C. Moisture uptake occurs slowly, with minimal impact on dimensions. ForTii® Ace MX52 is processed using injection molding technology and is heat stabilized. It is 40% glass-reinforced and suitable for automotive applications.
Envalior
Akulon® K224-G6U
Polymer Name:
Polyamide 6 (PA 6)
Chemical Family:
Polyamides
Reinforcement Material:
Glass Fibers
Fillers Included:
Glass Fiber
Processing Methods:
Injection Molding
Akulon® K224-G6U is a polyamide 6 (PA 6) resin known for its lightweight properties and finds applications in various industries, including consumer goods, particularly appliances and electronics, as well as in the automotive and transportation sectors, for both exterior and interior components.
Envalior
Akulon® K224-PG6
Polymer Name:
Polyamide 6 (PA 6)
Chemical Family:
Polyamides
Reinforcement Material:
Glass Fibers
Fillers Included:
Glass Fiber
Processing Methods:
Injection Molding
Akulon® K224-PG6 is a polyamide 6 (PA 6) resin used in composite materials and plastics. It offers features like impact modification, lightweight properties, and a UL flame rating. It finds applications in consumer goods (appliances and electronics), automotive and transportation (exterior, interior, and safety systems), and more.
Envalior
Akulon® K224-LPG6U
Polymer Name:
Polyamide 6 (PA 6)
Chemical Family:
Polyamides
Reinforcement Material:
Glass Fibers
Fillers Included:
Glass Fiber
Processing Methods:
Injection Molding
Akulon® K224-LPG6U is a polyamide 6 (PA 6) material often reinforced with glass fibers to enhance its mechanical properties. This reinforced material exhibits good UV stability and impact resistance and is lightweight. It finds applications across various markets, including automotive and transportation, consumer goods, and industrial sectors. The addition of glass fibers improves its overall performance and durability in these applications.
Envalior
Akulon® Ultraflow K-FG12
Polymer Name:
Polyamide 6 (PA 6)
Chemical Family:
Polyamides
Reinforcement Material:
Glass Fibers
Fillers Included:
Glass Fiber
Processing Methods:
Injection Molding
Akulon® Ultraflow K-FG12 is a high-performance polyamide 6 and polyamide 66 material employed worldwide in diverse applications, including automotive, electronics, electrical, furniture, and packaging. It excels in molded parts, providing an optimal blend of design flexibility and ease of processing while delivering impressive mechanical properties across a wide temperature range and various conditions. For extrusion, it establishes industry benchmarks with its exceptional strength, resilience, and ease of processing. Ideal for injection molding, its notable features include 60% glass reinforcement and high flow characteristics.
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