Products in Other Devices & Assemblies

METABLEN™ S 2130 is a silicone-acrylic-based rubber impact modifier optimized for flame retardant polycarbonate (PC) resins. It adds colorability, heat-aging resistance and impact strength to PC and polycarbonate blends in automotive, aerospace, consumer goods, and electric and electronic applications.FeaturesWeather stabilityHydrolysis resistanceImpact resistance even at low temperatures*METABLEN™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. jER™ YX7105 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol.FeaturesExcellent adhesionGood toughnessGood mechanical, impact and crack resistanceExcellent elasticity and flexibilityApplicationsPrinted electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board)Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)Base film and sheet for wearable devicesCoatingsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

METABLEN™ S 2001 is a silicone-acrylic rubber-type impact modifier with high impact strength in all temperatures and excellent weatherability. It can be used with ABS, PC, PLA, and other matrix resins in a variety of automotive, aerospace and electric and electronic applications. Features Can be used with recycled plastics Good weather stability Low temperature impact resistance *METABLEN™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

METABLEN™ S X-005 is a silicone-acrylic rubber-type impact modifier that provides flame retardance, hydrolysis resistance and impact strength. It is used for polycarbonates (PC) and polycarbonate blends in automotive, aerospace, consumer goods, and electric and electronic applications.FeaturesFlame retardantWeather stabilityHydrolysis resistanceImpact resistance even at low temperaturesLow friction*METABLEN™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

METABLEN™ S 2100 is a silicone-acrylic-based rubber impact modifier with good colorability and impact strength. It is used for polycarbonates (PC) and polycarbonate blends, polyvinyl chloride, engineering plastics and polyolefins in a variety of automotive, aerospace, consumer goods, and electric and electronic applications. METABLEN™ S-2100 provides ductility on facial impact tests, even after immersion of coating chemicals. The effect is maintained at higher molding temperatures. BenefitsEasy to processFlame retardancy for engineering plastics and polyolefins elastomersFeaturesGood colorabilityWeather stabilityHydrolysis resistanceImpact resistance even at low temperatures*METABLEN™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

METABLEN™ S 2200 is a silicone-acrylic-based rubber impact modifier with an epoxy-modified shell.Compatible with Polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyamide (PA) and alloy, it provides hydrolysis resistance, heat-aging resistance and impact strength for a wide range of automotive, aerospace and electric and electronic applications.FeaturesWeather stabilityHydrolysis resistanceImpact resistance even at low temperatures *METABLEN™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group

jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

Aegis® PIR-H35ZI resin from AdvanSix contains 100% post-industrial recycled (PIR) raw materials while providing the same top performance and processability as Aegis® H35ZI, its standard, non-recycled counterpart.Aegis® PIR-H35ZI resin is an unfilled, low viscosity, non-lubricated nylon 6 injection molding homopolymer exhibiting excellent melt flow properties for filling thin sections and reduced cycle times. Aegis® PIR-H35ZI homopolymer exhibits good strength, stiffness and toughness as well as excellent heat, chemical and abrasion resistance.

Aegis® H35ZI is an unfilled, low viscosity, non-lubricated nylon 6 injection molding homopolymer exhibiting excellent melt flow properties for filling thin sections and reduced cycle times. It exhibits good strength, stiffness and toughness as well as excellent heat, chemical and abrasion resistance.

Aegis® H8202NLB is an unfilled, low/medium viscosity, non-lubricated nylon 6 injection molding homopolymer exhibiting excellent melt fluidity for filling thin sections. It exhibits good strength, stiffness and toughness as well as excellent heat, chemical and abrasion resistance.

Aegis® H8202NL resin is a 2.6 RV, unfilled, low/medium viscosity, non-lubricated, nylon 6 homopolymer. It combines good strength, stiffness and toughness with excellent heat, chemical and abrasion resistance.

Aegis® PIR-H8202NLB resin from AdvanSix contains 100% post-industrial recycled (PIR) raw materials while providing the same top performance and processability as Aegis® H8202NLB, its standard, non-recycled counterpart.Aegis® PIR-H8202NLB resin is an unfilled, low/medium viscosity, non-lubricated, nylon 6 homopolymer. It exhibits good strength, stiffness, and toughness as well as excellent heat, chemical and abrasion resistance.

ForTii® F11 is a breakthrough high-temperature polyamide that offers halogen-free and halogen-containing flame retardant grades, making it suitable for demanding applications in industries such as electronics, lighting, automotive, white goods, industrial, and aerospace. It provides an excellent balance of flow, toughness, and stiffness, enabling the production of thin walls or complex geometries in electronics and electrical applications. The material is VDE (Verband der Elektrotechnik) approved for all colors, has a high RTI electrical rating of 140 °C at 0.75 mm, and a CTI rating of 800 V, ensuring thermal and electrical performance. It is phosphorous-free and VDE-certified. The processing technology for this product is injection molding.

Akulon® Ultraflow XG-FKGS6 is a high-performance polyamide 6 and polyamide 66 material trusted worldwide for applications in automotive, electronics, electrical, furniture, and packaging. In molded parts, it delivers an impressive blend of design simplicity and processing ease, along with exceptional mechanical properties across a wide temperature range and diverse conditions. For extrusion, it sets industry benchmarks, featuring remarkable strength, resilience, and ease of processing. This product boasts special features including 30% glass reinforcement, flame retardancy (halogen-free), and being best suited for injection molding.

Akulon® SG-KGS6 is a high-performance material that combines the properties of polyamide 6 and polyamide 66. It is widely used in various industries, including automotive, electronics, electrical, furniture, and packaging. Whether applied in molded parts or extrusion processes, Akulon® SG-KGS6 stands out for its exceptional combination of design flexibility, easy processing, and outstanding mechanical properties. It performs well over a wide temperature range and under diverse conditions.

ForTii® F12 is a breakthrough high-temperature polyamide that offers halogen-free and halogen-containing flame retardant grades, making it suitable for demanding applications in industries such as electronics, lighting, automotive, white goods, industrial, and aerospace. It exhibits an excellent balance of stiffness and toughness, making it suitable for high-mechanical load applications such as power connectors or electric vehicle (EV) parts. With a high RTI electrical rating of 140 °C at 0.75 mm and JEDEC (Joint Electron Device Engineering Council) Level 2 performance, it allows for surface mount technology (SMT) processes without deformation and with a low risk of blistering. The processing technology for this product is injection molding, and it is phosphorous-free.

403C Super Cold™ HFO-1234ZE is a non-flammable cold spray that is used primarily for diagnosing thermally intermittent problems with electronic devices. It is also useful for protecting heat sensitive components during soldering, quickly cooling solder joints, and it can also be used to quickly remove gum and other adhesives from a variety of surfaces.

The 403A Super Cold™ 134 is a pure, non-flammable cold spray that is used primarily for diagnosing thermally intermittent problems with electronic devices. The cold spray contains pure 1,1,1,2-tetrafluoroethane (HFC 134a).

HeBoFill® LL-SP 120 is a Boron Nitride powder of high purity. Its high crystallinity results in excellent lubrication. The powder is also characterised by a narrow grain size distribution. The high crystallinity results in a relatively low specific surface area. This property enables a low increase in viscosity at high filler loadings.

SC-417 is a two-part, low viscosity, clear silicone which will cure at room temperature or at elevated temperatures. The cured elastomer is suited for electrical/electronic potting and encapsulating applications and provides environmental protection. It is readily pourable and can cure from room temperature to 200°C. The cured resin has a very good flexibility with excellent electrical properties and high temperature resistance.

SC-550-LV-TC-1 is a 100% silicone solid elastomer designed for electronic potting applications. This two-component system offers a hard, self-bonding, thermally conductive, low modulus material that is readily repairable. SC-550LV-TC-1 is highly filled and offers excellent thermal conductivity. It is also offers a convenient mix ratio of 1:1 by weight and volume.

SC-550-LV-RT is a 100% silicone solid elastomer designed for electronic potting applications. This two-component, room temperature curing system offers a hard, self-bonding, thermally conductive, low modulus material that is readily re-workable.

SC-454M-6 is a thermally conductive, low viscosity, condensation cure, RTV silicone potting or encapsulating compound. It is readily pourable and can cure at room temperature. The cured resin has a very good flexibility with excellent electrical properties and high temperature resistance.

ADEKA™ EP-4000, identified by the polymer name epoxy resins and compounds, finds application in engineered and electrical/electronic applications. Noted for its material features of good adhesion and flexibility, this product is specifically tailored for processing methods such as casting in plastics and elastomers. ADEKA™ EP-4000 stands as a reliable choice in industries where superior adhesion, flexibility, and versatile processing methods are essential.

ADEKA™ EP-4300E, a premier epoxy resin and compound polymer, stands out for its technological prowess in plastics. Engineered with materials featuring low viscosity, it caters to the intricate demands of electrical and electronic applications. Its excellence extends to processing methods, particularly casting, making it the top choice for industries seeking superior performance and reliability.

ADEKA™ EP-7001, an epoxy resin and compound polymer, is a cutting-edge solution in the realm of plastics technology. Tailored for casting methods, it exhibits remarkable features like good adhesion and flexibility. Positioned for excellence, ADEKA™ EP-7001 finds its applications in the automotive and transportation and electrical and electronics markets, meeting the demands of electrical and electronic applications and engineering applications with precision.

ADEKA™ EP-4100G, a variant of epoxy resins and compounds, stands out with its general-purpose material features. Specifically designed for plastics and elastomers processed using casting methods, this polymer finds versatile applications. Its end uses span across electrical and electronic applications and general-purpose industrial scenarios, making ADEKA™ EP-4100G a reliable choice for various manufacturing needs.

ADEKA™ EP-4400, a distinguished epoxy resin and compound polymer, excels at catering to the specialized needs of electrical, electronic, and engineered applications. Engineered for casting, its material features, including its amorphous nature and good adhesion, make it an optimal choice for industries requiring reliability and top-notch performance.

UL 94 V0, 30 % glass fiber, PBDE & PBDF free, excellent mechanical properties and good electrical features.

OTech Jet is a silver particle-free conductive ink optimized for inkjet printing. It enables the printing of highly conductive, smooth, and uniform layers and patterns. OrelTech’s unique process allows the deposition of highly conductive thin metallic films. The thin layers undergo short development using cold plasma treatment resulting in a fine metal structure. OrelTech’s technology enables the deposition of the ink with many different methods and on various substrates, from plastics to fabrics. OTech inks do not contain nanoparticles, and as such enable the material economy of precious metals while being significantly more environmentally friendly than the existing alternatives on the market.

UL 94 V0 at 1,6 mm, copolymer, halogen free, excellent electrical properties, RoHS.

Cuyahoga Plastics S-4021 is a glass, mineral & graphite filled Silicone Thermoset molding compound specifically designed for contact components in the hot glass handling industry.