Products in Electrical & Electronics: Laminate

A paper-base laminate with low phenolic resin content for hard, flat surfaces. This material is most commonly used for drill entry material in the PCB industry.

A paper-base laminate with low phenolic resin content for hard, flat surfaces. It is typically hot punched for numerous low voltage electrical applications of less than 250 volts where the material is not subjected to high humidity.

Hot punching general-purpose phenolic grade. Mechanical properties approach those of NP610 with improved electrical properties and moisture resistance. Certification to IEC standard is pending.

A paper-base laminate with low phenolic resin content for hard, flat surfaces. This material is normally used in the printed circuit board industry as a backup for the drilling operation. However, it is also used in other industries for tooling stock because of its ease of machining and good dimensional stability.

Lower cost paper phenolic NEMA Grade XP. NP660 uses natural kraft paper without pigmented cover sheet. It is a warm to hot punching material. It is available in natural and black only, without a pigmented cover, only. Certification to IEC standard is pending.

Hot punching grade with excellent electrical properties and low moisture absorption. Major application is for punched parts for switches and other insulation applications requiring high electrical strength in applications where either moisture is present or in areas of high humidity.

NP629 is a paper-phenolic high-pressure laminate and intended primarily for mechanical applications, but is suitable for electrical applications as well. The electrical properties are not quite as good as those of NP630. Certification to IEC standard is pending.

NP643 is constructed from an electrical grade kraft paper and a high temperature specially modified epoxy resin system. It is designed to be used in tap changers, coil support plates and terminal panels for transformers and their accessories.

Hot punching general-purpose phenolic grade. Mechanical properties approach those of NP610 with improved electrical properties and moisture resistance. NP611 meets the requirements of IEC60893-3-4-PF CP 201.

NP572 is a high strength, medium weave glass epoxy laminate that retains a minimum of 50 percent of its room temperature flexural strength when tested at 150ºC and its Tg is guaranteed to be 180°C or greater. Typical applications include electrical equipment subjected to elevated temperatures. NP572 is certifiable to IEC 60216-3, IEEE STD 98-2002 and ASTM D2304 for Class H insulation in electrical devices. NP572 is also certifiable to MIL-I-24768/3, Type GEB.

Room temperature punching and shearing grade up to 0.125″ thick. NP615 is more flexible with lower mechanical properties than NP611. NP615 is produced with high resin content melamine impregnated surfaces to give the resulting laminate better arc resistance. Intended for applications where electrical and moisture requirements are secondary.

NP613 is constructed from electrical grade of kraft paper and a specially modified epoxy resin system. It is designed to be used in tap changers, coil support plates and terminal panels for transformers and their accessories.

Phenolic paper based grade for mechanical applications. Good tensile, compressive and flexural strength. Primarily a machining material, but may be hot punched up to .093" thick. NP610 meets MIL-I24768/12 Type PBM, ASTM D709 Type X and IEC 60893-3-4 PFCP 201.

MC511A is a high strength, glass epoxy laminate that is specially formulated to meet power generation producer’s exacting standards where higher strength at elevated temperatures are required. MC511A is certifiable to MIL-I-24768/3, Type GEB, IEC-60893-3-2 EP GC 203 and is halogen free to meet the European restrictions.

Room temperature punching and shearing paper phenolic grade up to .125" thick. NP612 is more flexible with lower mechanical properties than NP611, and is intended for applications where electrical and moisture requirements are of secondary importance. NP612 meets the requirements of MIL-I-24768/20.

Canvas phenolic laminate with molybdenum disulfide lubricant. The mechanical properties are slightly lower than NP310. NP313 is used for lubricity in the composite when carbon (graphite) cannot be used because of conductivity.

Low cost room temperature punching grade with mechanical and electrical properties similar to NP612. This version is made with pigment cover plies on the surface.

Canvas phenolic laminate with molybdenum disulphide added as a solid lubricant. This material has improved wear properties under certain conditions. Material is semi-conductive to electricity and should no be used where this is detrimental to the application.

NP630 is a fine machining grade with excellent electrical properties and moisture resistance. It has low cold flow with good dimensional stability.

Woven glass fabric, melamine resin laminate. NP509 is very hard, flame resistant, machining grade with excellent electrical properties in high humidity conditions. NP509 has high physical strength and excellent arc resistance. Meets MIL-I-24768/1 type GME, MIL-I-24768/8 type GMG and IEC 60893-3-3-MF GC 201.

MC511AF is a high strength, medium weave glass epoxy laminate that retains a minimum of 50 percent of its room temperature flexural strength when tested at 150ºC. Typical applications include insulation in power generation equipment and other structural applications when used in elevated temperatures. MC511AF is certifiable to MIL-I-24768/3, Type GEB.

MC511FR is a high strength, medium weave glass epoxy laminate that retains a minimum of 50 percent of its room temperature flexural strength when tested at 150ºC. Typical applications include structural applications when used in elevated temperatures. MC511FR also complies with MIL-I-24768/28, Type GEB-F. Certification to IEC standard is pending.

Paper phenolic grade with better electrical properties than NP612. NP625 requires slightly more heat to shear and punch than NP612. Certification to IEC standard is pending.

Warm punching, composite grade with woven glass covers for improved flexural, tensile and impact strength. It has better electrical properties and higher mechanical strength than NP611.

Current Incorporated LAMINATED SHEET NEMA Canvas (C) MIL-I-24768/16 is made of woven cotton fabric with a phenolic resin binder. Intended for use in a wide range of mechanical applications that demand high impact strength and resiliency.

Vetronite® FR-5 HF CTI 600M is composed of epoxy matrix and glass fabric reinforcement. it appears in Red color with EP GC 204/311 FR-5 Standards.

RT/duroid® 6002 microwave material was the first low loss and low dielectric constant laminate to offer superior electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable.

Lamitex® G-3 PF GC 21 glass/phenolic laminated sheet is most frequently preferred for application that require high flexural and impact strengths and good electrical properties under low relative humidity conditions. . Lamitex G-3 meets or exceeds NEMA G-3, Mil-I-24768/18 specifications and meets UL 94-HB requirements.

ISOVAL® FR4-HF (EP GC 202) is made of Flame-resistant, halogen-free glass fabric laminate Type FR4, without any toxic flame retardants, UL 94 listed, Thermal Class H (180 °C). The resin is also extremely low in smoke and free of all toxic or harmful flame retardants.

Tufnol Grade 10G/50 is a laminated plastics material made from woven glass fabric, bonded with silicone resin. It is a rigid sheet material with good resistance to high temperatures and very good electrical insulation properties, especially in applications involving very high frequencies. Note, however, that silicone bonded laminates have mechanical strength properties somewhat lower than some other glass fabric laminates.

Arlon’s TC600 is a woven fiberglass reinforced, ceramic filled, PTFE-based composite for use as a printed circuit board substrate. TC600 is designed to provide enhanced heat-transfer through “Best-In-Class” thermal conductivity, while reducing dielectric loss and insertion loss. Lower losses result in higher Amplifier and Antenna Gains/Efficiencies. Mechanical robustness is also greatly improved for the 6.15 dielectric constant market.

Current Incorporated LAMINATED SHEET NEMA XX MIL-I-24768/11 is made of cellulosic paper and a phenolic resin binder. Normal electrical applications are suitable. It is not suitable for punching. Machined with standard machine tools.

I-Tera MT40 is suitable for many of today’s high speed digital and RF/microwave printed circuit designs. I-Tera MT40 features a dielectric constant (Dk) that is stable between - 55°C and +125°C up to W-band frequencies. In addition, I-Tera MT40 offers a lower dissipation factor (Df) of 0.0031 making it a cost effective alternative to PTFE and other commercial microwave and high-speed digital laminate materials. I-Tera MT40 laminate materials are currently being offered in both laminate and prepreg form in typical thicknesses and standard panel sizes. This provides a complete materials solution package for high-speed digital multilayer, hybrid, RF/microwave, multilayer and double-sided printed circuit designs. I-Tera MT40 does not require any special through hole treatments commonly needed when processing PTFE-based laminate materials.

Beijing New Friend Insulation Material F828 Phenolic Paper Laminate is from the bleached wood pulp paper impregnated with phenolic resin, drying, hot pressing made. Implementation is in enterprise standard.

Current Incorporated LAMINATED SHEET NEMA Canvas Electrical Grade (CE) MIL-I-24768/14 is made of woven cotton fabric with a phenolic resin binder. Materials with glass substrates are better suited for electrical applications that require good moisture resistance and mechanical strength. It has good dialectric properties and a medium dielectric loss.

TC350 is a woven fiberglass reinforced, ceramic filled, PTFEbased composite for use as a printed circuit board substrate. TC350 is designed to provide enhanced heat-transfer through “Best-In-Class” thermal conductivity, while reducing dielectric loss and insertion loss. Lower losses result in higher Amplifier and Antenna Gains/Efficiencies.