Search_02
Search_02
Markets
keyboard_arrow_down
Technologies
keyboard_arrow_down
Suppliers
keyboard_arrow_down
Sustainability
keyboard_arrow_down
Markets
keyboard_arrow_down
Technologies
keyboard_arrow_down
Suppliers
keyboard_arrow_down
Sustainability
keyboard_arrow_down

Electrical & Electronics

4,708 products found in Electrical & Electronics

Product Families

Devices & Assemblies

Devices & Assemblies

Parts & Components

Parts & Components

Wire & Cable

Wire & Cable

Other Electrical & Electronics Applications

Other Electrical & Electronics Applications

Packaging & Assembly

Packaging & Assembly

Product Families
keyboard_arrow_down
Functions
keyboard_arrow_down
End Uses
keyboard_arrow_down
Chemical Family
keyboard_arrow_down
Features
keyboard_arrow_down
Suppliers
keyboard_arrow_down
End Uses: Electrical/Electronic Applications
  • Products
  • Brands
  • Suppliers
  • Formulations
  • Documents
sort
Most Viewed
keyboard_arrow_down
DuPont banner
DuPont logo

DuPont

Delrin® FG500SC NC010

Polymer Name: Polyacetal Homopolymer (POM)
Processing Methods: Injection Molding
Additives Included: Mold Release Agent, Lubricant (Unspecified)
Flexural Modulus: 2900.0 - 2900.0 MPa

Delrin® FG500SC is a masterbatch of 20% silicone fluid in Delrin@ FG500P. It is designed for cube-blending with any grade of Delrin@ for applications requiring low wear and friction against itself and other plastics. It has been developed for applications in contact with food.

Polyplastics Group banner
Polyplastics Group logo

Polyplastics Group

Topas® 8007S-04

Applications: Appliances & Electronics, Automotive, Chemical & Industrial Manufacturing
Product Families: Basic Thermoplastics, Polyolefins
Chemical Family: Polyolefins
Polymer Name: Cyclic Olefin Copolymer (COC)
End Uses: Bottles, Cell Phones, Cosmetic Packaging

Polyplastics Group Topas® 8007S-04Product DescriptionTOPAS 8007S-04 is a general purpose injection molding grade. It is a glass-clear amorphous polymer with outstanding moisture barrier, chemical resistance, high purity and a non-reactive surface making it an excellent choice for healthcare and other high-tech products. Lower leachables and extractables of TOPAS COC preserve content stability and quality. It is a non-polar substrate that does not promote adsorption, denaturation, aggregation, or precipitation like glass can. Analytical results are more accurate with TOPAS COC in contact with sensitive chemistries.Selected Applications Drug delivery Prefilled syringes, vials, cartridges Bottles and tubes Surgical instruments IV containers and components Labware Optics Electronics Food packaging Healthcare and food contact Leading Attributes Low leachables & extractables, low water transmission Non-ionic, does not promote adsorption like glass Minimally reactive Chemically resistant to alcohol, acetone, and acrylates Transparent, withstands EtO and gamma sterilization Temperature resistance, clarity and purity Clarity, low birefringence, low moisture sensitivity Low dielectric constant, thermoplastic Not manufactured with BPA, phthalates, or halogens Broad regulatory compliance Related Grades for Injection Molding, Healthcare, Optics and Diagnostics TOPAS 8007X10 - our highest ultraviolet (UV) transmission grade Topas® 8007S-04Topas® 8007S-04 is a Cyclic Olefin Copolymer (COC) product. It is available in Asia Pacific.Characteristics include: Flame Rated Copolymer

Arlon Electronic Materials banner
Arlon Electronic Materials logo

Arlon Electronic Materials

Arlon® 25N

Applications: Devices & Assemblies, Other Devices & Assemblies
Product Families: Engineering & Specialty Polymers, High Performance Thermoplastics
Chemical Family: Fluoropolymers
Polymer Name: Polytetrafluoroethylene (PTFE)
End Uses: Electrical/Electronic Applications

Arlon 25N and 25FR are woven fiberglass reinforced, ceramic-filled composite materials engineered for use in microwave and RF multilayer printed circuit boards. Combining a non-polar thermoset resin system with a controlled-expansion ceramic filler, 25N and 25FR offer low dielectric constant and loss combined with a low Thermal Coefficient of Dielectric Constant (TCEr) for signal stability over a wide ambient temperature range. Designed for use in multilayer packages, 25N and 25FR offer prepregs that are identical in chemical composition and physical properties with their copper clad laminates for a completely homogeneous finished package for optimal signal integrity.The low dielectric constant (Er) and loss properties, low thermal coefficient of dielectric constant (TCEr), and excellent physical stability characteristics offered by 25N and 25FR materials make them ideal for wireless and digital applications, such as cellular telephones, down converters, low noise amplifiers, antennas and other advanced des ign circuits.Processing for 25N and 25FR materials is consistent with processing for standard high temperature thermoset based printed circuit board substrates.

Show36of 4,708 results per page
Go to page
For CustomersOverviewCustomer FeaturesPeriodical

© 2023 Knowde. All Rights Reserved.

Terms of Use | Cookies | Cookie Settings
Terms of UseCookiesCookie Settings