Products in Adhesives & Sealants

MultiTech Rheology Modifier B hydrophobic fumed silica grade treated with HMDS (Hexamethyldisilazane). It can be used for sedimentation stabilization and due to its high hydrophobicity as defoaming agent.

MultiTech DiFunctional D is a low molecular weight liquid polymer derived from synthetic polyisoprene rubber. It offers the performance and processing characteristics of natural rubber with the added benefit of lighter color and none of the natural impurities inherent in natural rubber products. MultiTech DiFunctional D is a high viscosity liquid at room temprature. It is a translucent, honey-colored liquid in bulk form and virtually clear in a thin film.

MultiTech Resin is an alicyclic epoxide for epoxy resin composition, with the following features :- Excellent fluidity. Possible to maintain low viscosity at high temperature by partial addition of DE-102- High light resistance- Low water absorption

MultiTech MultiFunctional L is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparency LED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs MultiTech MultiFunctional L is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group

DEHESIVE® 929 is a solvent-free, addition-curing silicone fluid designed for release applications. This product has good curing properties, very good flow properties and coverage, an extremely stable release, excellent bath life, and excellent long-term anchorage to a wide variety of substrates.

WACKER® Silicone Paste P 12 is a pure white, soft-consistency heat sink paste with marked thermal conductivity. It is electrically insulating. WACKER® PASTE P 12 is used especially in semiconductor technology as a heat sink paste. When there is a need for good heat transfer from a semiconductor to a cooling element, applying a thin coating of WACKER® PASTE P 12 is advisable. In the assembly of semiconductors such as diodes, transistors, and thyristors, microscopic irregularities may exist on the mating surfaces of the semiconductor and the cooling surface. These surface irregularities can hinder firm metal-to-metal contact when assembled.

ELASTOSIL® RT 426 is a pourable, condensation-curing, two-component silicone rubber that vulcanizes at room temperature. It is commonly used in applications related to electrics and electronics, specifically for electronics encapsulation. This silicone rubber is known for its condensation-curing properties, flowability, and heat resistance. It is a two-component product that provides reliable performance in various electronic applications.

DEHESIVE® 944 is a solvent-based, addition-crosslinkable silicone recommended for use as a release coating. It offers excellent release stability, medium release at low peel speeds, excellent bath life, and excellent anchorage to a wide variety of substrates. It can be used for coating polyester films (PET), papers, and PE-laminated papers.

DEHESIVE® 902 AMA® is a solvent-free, addition-curing silicone fluid formulated for release applications on paper and filmic substrates. It is an integral component of a multicomponent release coating used in the production of paper and filmic release liners. These liners are widely utilized in the manufacturing of single- and double-sided industrial laminates.

WACKER® Catalyst C 05 is a highly active, diluted platinum catalyst specifically designed for the thermal curing of solvent-based and solvent-free addition-crosslinking silicones. It exhibits very high and constant catalyst activity, making it ideal for use in automated mixing units. This catalyst enables rapid curing of addition-crosslinking silicone systems, providing efficient and reliable results. Additionally, WACKER® Catalyst C 05 is miscible with silicones in all proportions.

WACKER® Catalyst OL is a highly active and concentrated platinum catalyst specifically developed for the thermal curing of solvent-based and solvent-free addition-crosslinking silicones. This catalyst exhibits exceptional and consistent activity, providing rapid curing for addition-crosslinking silicone systems. With its high concentration of platinum, it offers efficient performance. Moreover, it is miscible with silicones in any proportion.

WACKER® Crosslinker V 90 is a solvent-free hydrogenpolysiloxane containing reactive Si-H groups. It is known for its fast curing properties, good release stability, and excellent anchorage to a wide variety of substrates. The fast-curing properties of WACKER® Crosslinker V 90 also enable the use of a low platinum concentration.

WACKER® Catalyst EM 470 is an emulsion formulated with a highly reactive platinum catalyst. It is specifically designed for incorporation into release coating formulations used in the production of release papers and films. This catalyst demonstrates remarkable reactivity and excellent wetting properties, providing superior anchorage and high shear stability throughout the application process.

CRA® 17 is a highly efficient controlled-release additive designed specifically for adjusting the release force of solvent-free DEHESIVE® systems. It offers exceptional performance in achieving the highest release values among all CRA® modifiers. Its key features include high efficiency, rapid curing, and stable release characteristics.

AEROSIL® R 202 is a hydrophobic fumed silica grade, treated with a polydimethylsiloxane. This product can be used in defoamer formulations for sedimentation stabilization and due to its high hydrophobicity as defoaming component.

AEROSIL® R 805 is a high thickening fumed silica surface treated with OCTMO.

AEROSIL® 200 is a hydrophilic fumed silica with a specific surface area of 200 m²/g.

AEROSIL® R 972 is hydrophobic fumed silica grade treated with DDS (Dichlordimethylsilane). The moderate hydrophobicity of these AEROSIL® products is suited for defoaming properties in the presence of appropriate hydrophobic liquids. They are recomended for improving the sedimentation stability of defoamer dispersions as well.

AEROSIL® R 812 is hydrophobic fumed silica grade treated with HMDS (Hexamethyldisilazane). It can be used for sedimentation stabilization and due to its high hydrophobicity as defoaming agent.

jER™ YX7400N is an adduct formed from the reaction of epichlorohydrin and an aliphatic polyol.FeaturesAdduct formed from the reaction of epichlorohydrin and an aliphatic polyolExcellent elasticityImpact resistanceApplicationsConsumer appliances and electronicsElectrical devices, assemblies, parts and componentsElectronics adhesivesElectrical and electronic packaging and assemblySpecialty and conformal coatingsPotting compoundsPrinted circuit boards (PCBs)Semiconductor manufacturing*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. jER™ YX7105 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol.FeaturesExcellent adhesionGood toughnessGood mechanical, impact and crack resistanceExcellent elasticity and flexibilityApplicationsPrinted electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board)Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)Base film and sheet for wearable devicesCoatingsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

SHIKOH™ UV-3520TH is an aliphatic urethane acrylate oligomer with soft elasticity, good toughness and high elongation. It shows unique mechanical properties with various reactive diluents. Features Soft-Elastic type, Good toughness, High elongation Diluted in Tetrahydrofurfuryl Acrylate (THFA) (oligomer/ THFA = 70/30 wt%) Non-solvent (100% hardening ingredient) Unique mechanical properties with various reactive diluents Applications UV/ EB/ Thermal-curable adhesive UV adhesive for electric device use 3D printer, and Inkjet *SHIKOH™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

SHIKOH™ UV-3300B is UV curable urethane acrylate oligomer with excellent soft-elasticity, and very high elongation. It also shows good mechanical properties even at low temperature. EB and Thermal cure systems are also applicable. Features Soft-elastic, High elongation Suitable for adhesion bond and metalizing undercoat with monomers Good mechanical properties at low temperature Non-yellowing Applications Adhesive : UV/ EB/ Thermal-curable adhesive for electronics device, optical use, and automotive use. 3D printer *SHIKOH™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

SHIKOH™ UT-7792 is a bio-based urethane acrylate oligomer. (Development product) Its biomass degree is 71% while its mechanical properties are the same as a non-biomass grade UV-3300B, with higher elongation and very soft rubbery elasticity suitable for using UV-curable adhesives for electronics devices. Features Bio-based Soft-elastic, High elongation Suitable for adhesion bond and metalizing undercoat with monomers Non-yellowing Applications Adhesive : UV/ EB/ Thermal-curable adhesive for electronics device, optical use, and automotive use. 3D printer *SHIKOH™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 1256 is a solid epoxy resin produced from Bisphenol A epoxy resin. It is a polymer-type epoxy resin with epoxy functional group at the both ends. It can be used to add toughness, insulating and vapor barrier properties, and resistance to heat, water and chemicals in a variety of applications. FeaturesHigh molecular weightHigh softening pointsGood film formerHydrolysis resistanceFlexibilityStrong adhesionApplicationsPCM, CAN, and other coatingsPaintsFiber-reinforced materialsThermoplasticsPrinted electronicsPlastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX4000 is a biphenol-type solid epoxy resin with significantly low melt viscosity, low water absorption and a good balance between adhesiveness and rigidity against stress. It can be used for electrical and electronic applications. jERTM YX4000 is an adduct formed from the reaction of epichlorohydrin and tetramethylbiphenol FeaturesAbrasion, heat and water resistanceElectrical insulationWear resistanceProduct HighlightsSignificantly low melt viscosity (melting point: 108°C)Low chroline contentLow water absorption ApplicationsElectrical and electronic applications (EMC, solder resist, PCB)Potting and encapsulation materialsPowder coatings for ship bottomsAdhesivesComposites *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

SHIKOH™ UV-3700B is UV curable urethane acrylate oligomer with high elongation and soft rubbery elasticity. It is relatively low viscosity despite its high molecular weight. EB and Thermal cure systems are also applicable. Features Soft elastic type, High elongation High molecular weight but relatively low viscosity Non-solvent (100% hardening ingredient) For UV adhesion with monomers Non-yellowing Applications Adhesive: UV/ EB/ Thermal-curable adhesive for electronics device, optical use and automotive use. 3D printer *SHIKOH™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

CRA® eco 17 is an extremely efficient controlled release additive used for adjusting the release force of solvent-free DEHESIVE® systems. It is derived from renewable raw materials and complies with the "Standard REDcert²." CRA® eco 17 offers the highest release values among all CRA® modifiers.

WACKER® Crosslinker V 24 is a solvent-free hydrogenpolysiloxane that contains reactive Si-H groups. It offers a good cure, ensuring the effective curing of coatings. This crosslinker provides low release properties, making it suitable for applications where minimal release is desired. It also exhibits good release stability, maintaining its performance over time. Additionally, WACKER® Crosslinker V 24 demonstrates excellent anchorage to paper and film substrates.

CRA® 21 is an exceptional controlled release additive specifically formulated for adjusting the release force in solvent-based DEHESIVE® systems. As a solvent-based additive, it delivers high release levels, making it highly efficient in its intended application. Additionally, CRA® 21 exhibits good release stability, ensuring consistent performance over time.

CHT Group AS1707 is a non-corrosive, neutral-cure, 1-part, RTV (Room Temperature Vulcanizing) silicone adhesive sealant. It is one in a range of alkoxy cure products that are solvent-free. It exhibits excellent primerless adhesion to many substrates and cures at room temperature to form a tough rubber when in contact with atmospheric moisture. This product will not corrode copper or its alloys and is suitable for use with electronic components.