Products in Thermoset Resins

ALBIFLEX® 297 is a bisphenol-A-epoxy-silicone block copolymer resin that excels in crafting high-performance elastomers. This versatile liquid, responsive to epoxy, seamlessly cures when combined with aliphatic and cycloaliphatic epoxy resin curing agents. ALBIFLEX® 297 accommodates various conventional casting and molding techniques for your manufacturing needs.

SABIC's Specialties Business LNP THERMOCOMP TF002 compound is based on Polyurethane (TPU) resin containing 10% glass fiber. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

jER™ YX7400N is an adduct formed from the reaction of epichlorohydrin and an aliphatic polyol.FeaturesAdduct formed from the reaction of epichlorohydrin and an aliphatic polyolExcellent elasticityImpact resistanceApplicationsConsumer appliances and electronicsElectrical devices, assemblies, parts and componentsElectronics adhesivesElectrical and electronic packaging and assemblySpecialty and conformal coatingsPotting compoundsPrinted circuit boards (PCBs)Semiconductor manufacturing*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX4000 is a biphenol-type solid epoxy resin with significantly low melt viscosity, low water absorption and a good balance between adhesiveness and rigidity against stress. It can be used for electrical and electronic applications. jERTM YX4000 is an adduct formed from the reaction of epichlorohydrin and tetramethylbiphenol FeaturesAbrasion, heat and water resistanceElectrical insulationWear resistanceProduct HighlightsSignificantly low melt viscosity (melting point: 108°C)Low chroline contentLow water absorption ApplicationsElectrical and electronic applications (EMC, solder resist, PCB)Potting and encapsulation materialsPowder coatings for ship bottomsAdhesivesComposites *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. jER™ YX7105 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol.FeaturesExcellent adhesionGood toughnessGood mechanical, impact and crack resistanceExcellent elasticity and flexibilityApplicationsPrinted electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board)Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)Base film and sheet for wearable devicesCoatingsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7110 is a tough and flexible liquid-type epoxy resin. It can be used as an impact modifier for brittle materials, as an additive to increase impact resistance, and for stress relaxation to avoid cracking and warpage. jER™ YX7110 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol. Features Adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol Crack and impact resistance Excellent flexibility and elasticity High viscosity Low warpage Maintains flexibility even after full-curing Applications Coatings Adhesives Composites Potting and encapsulation materials Base film/sheet for wearable devices *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 1256 is a solid epoxy resin produced from Bisphenol A epoxy resin. It is a polymer-type epoxy resin with epoxy functional group at the both ends. It can be used to add toughness, insulating and vapor barrier properties, and resistance to heat, water and chemicals in a variety of applications. FeaturesHigh molecular weightHigh softening pointsGood film formerHydrolysis resistanceFlexibilityStrong adhesionApplicationsPCM, CAN, and other coatingsPaintsFiber-reinforced materialsThermoplasticsPrinted electronicsPlastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 4250 is a hybrid bisphenol A/bisphenol F-type epoxy resin that is more flexible than conventional polymer-type epoxy resins. It can be used as an additive to add toughness, insulating and vapor barrier properties and resistance to heat, water and chemicals to a variety of applications. FeaturesPolymer-type epoxy resin with epoxy functional groups at the both endsHigh molecular weightHigh softening points Good adhesionApplicationsPCM, CAN and other coatingsPaintThermoplastics Printed electronics Plastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

SABIC's Specialties Business LNP STAT-KON TX06488 compound is based on Polyurethane (TPU) resin containing conductive carbon powder. Added features of this grade include: Excellent Ductility, Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

MOCOM Compounds ALCOM® LDDC PMMA 1000UV18123 BK1016-11 is a translucent, UV stabilized Polymethylmethacrylate polymer used for Automotive, Lighting, and interior decoration/finishing, light transparent components, and Black Panel-Technology applications such as lamp covers, display elements, and operating elements. Pre-drying conditions involve 80°C in a dry air (dessiccant) dryer for 3-4 hours and 80°C in an air circulating dryer for 4-6 hours with a maximum moisture content of less than 0.02%. For processing injection molding, the melt temperature should be between 220-270°C and the mold temperature should be between 50-80°C. It should be protected from light.

MOCOM Compounds ALCOM® LDDC PMMA 1000 UV 18124 BK1074-11 is a polymethylmethacrylate base polymer with a UV stabilized filler/additive system suitable for applications such as lamp covers, display elements, operating elements, and light transparent components in automotive and lighting markets. Pre-drying conditions include 80°C in a dry air (dessiccant) dryer for 3-4 hours and 80°C in an air circulating dryer for 4-6 hours, with a maximum moisture content of <0.02%. For injection molding, melt temperature should be between 220-280°C and mold temperature should be between 50-80°C.

Aqua Aide™ Crystals serve as a stabilizer in food products. These crystals possess stabilizing properties and are water-soluble. Additionally, they are odorless and easy to handle. Aqua Aide™ Crystals are also labeled as Kosher.

DAP D44/6160 is a mineral-filled, special-purpose diallyl ortho-phthalate molding compound supplied in a free-flowing granular form. It can be easily molded using compression, transfer, or injection equipment and can be readily preformed. It surpasses all mineral compounds available today in terms of mechanical and electrical properties. It boasts extremely low water absorption, high dielectric strength, and a low dissipation factor, along with high tensile strength, exceptional arc resistance, and excellent resistance to high temperatures.

Cosmic Epoxy E4920D is a mineral-filled epoxy molding compound that is available in either granular form or as preformed shapes in various sizes and weights. This compound is commonly used for molding applications and offers good versatility in manufacturing processes.

Farboset® 1115AC is intended for use as a compound in thermoset molding. It is available in a solid form, presented as granules, with a granular appearance and a mild odor. This product is insoluble in water and does not exhibit reactivity under normal conditions, making it suitable for various thermoset molding applications and ensuring safety and reliability in its intended use.

DAP ID-50 is a general-purpose diallyl ortho-phthalate molding compound filled with Dacron. It is supplied in a granular form and can be easily molded using standard compression or transfer equipment. This type of compound is versatile and suitable for various molding applications.

Cosmic Epoxy E4920 is a mineral-filled epoxy molding compound available either in granular form or preformed in various sizes and weights. It features excellent moisture resistance, thermal cycling stability, and remarkable moldability. Furthermore, parts molded from this material do not support fungus growth, and it is specifically designed for the encapsulation of passive devices, including capacitors, inductors, diodes, and rectifiers.

Cosmic Epoxy C102 is a copper-filled molding compound available in a very fine granular form. It is suitable for various molding processes, including injection molding, compression molding, and transfer molding. This material is designed for fabricating parts that demand high strength and excellent electrical conductivity.

Cosmic Epoxy EH40 is an iron-filled epoxy molding compound available in a black granular form. It is suitable for EMI/RFI shielding applications and can be used for compression or transfer molding to create core rods or encapsulate surface mount and axial leaded inductors. This material simplifies the manufacturing process by allowing for single molded applications, eliminating the need for labor-intensive over/under molding.

Farboset® 2270 is a granular epoxy molding compound that contains a combination of glass and mineral fillers. It is based on a novolac epoxy resin and is designed for encapsulating various electrical and electronic components, including capacitors, resistors, hybrids, and more. This compound is known for its good moldability and fast cure rates, especially at lower molding temperatures. It offers excellent performance and reliability for applications where these characteristics are crucial.

Cosmic Epoxy E4940P is a mineral-filled, glass-reinforced epoxy molding compound supplied in granular form. It is specifically designed for high-volume encapsulation applications, particularly for resistor networks and fiber-optic connectors. This compound offers high quality, reliability, and good moldability for such applications.

DAP K43/6260 is a versatile diallyl iso-phthalate molding compound that is filled with minerals and supplied in granular form. This compound is designed for ease of use and versatility. It pours easily, can be preformed, and molds readily using standard compression, transfer, or injection equipment. What sets K43/6260 apart is its exceptional heat resistance, high arc resistance, and ease of molding around inserts. These features make it an ideal choice for applications that demand high-temperature performance and electrical insulation properties, while still allowing for straightforward processing and customization.

Farboset® 1707-2 is a mineral and glass-filled, anhydride epoxy molding compound that is engineered for the encapsulation of various electrical and electronic components. It is specifically formulated to provide high thermal shock resistance, making it ideal for protecting components that may be subjected to rapid temperature changes or other harsh environmental conditions. This compound helps ensure the reliability and durability of encapsulated components.

Esschem MMA Bead Copolymers are a collection of methyl methacrylate (MMA) bead polymers renowned for their exceptional properties.These polymers exhibit impressive features such as high glass transition temperature, melting point, tensile strength, and impact resistance.Esschem meticulously controls the reaction conditions to create polymers with specific molecular weight distributions, allowing for a wide range of desired properties. This precise control enhances the inherent strength, rigidity, and impact resistance of MMA polymers.Moreover, by carefully manipulating the particle size, Esschem offers the flexibility to customize properties such as hardness, toughness, and processability.

Farboset® 1115 is a granular, mineral-filled, anhydride epoxy molding compound with fast cure rates and excellent hot strength. It is specially designed for encapsulating various electrical and electronic components, including coils, transformers, bushings, switches, and more. The material offers good hot rigidity during the molding process and is commonly used in injection and transfer molding applications.

Esschem MMA - AMA Bead Copolymers are a versatile range of copolymers combining methyl methacrylate (MMA) with allyl methacrylate (AMA). These copolymers showcase the unique characteristics of AMA as a crosslinker in polymers. With varying MMA and AMA concentrations, Esschem offers a wide range of copolymer beads with different properties. Higher MMA content in the copolymer results in elevated glass transition temperatures, melting points, and tensile strengths, making them ideal for applications requiring high strength and rigidity. On the other hand, increasing the AMA content lowers these properties while enhancing crosslinking and hardness. By adjusting the molecular weight, Esschem can further customize the copolymer's rigidity and crosslinking behavior. The particle size of the beads can also be modified to optimize processing and surface properties, including adhesion characteristics.

Cosmic Epoxy EH81 is an iron-filled epoxy molding compound available in a black granular form. It is specifically designed for EMI/RFI shielding applications and can be used in both compression and transfer molding processes to create core rods or encapsulate surface mount and axial leaded inductors. The advantage of this material is its ability to simplify the manufacturing process by eliminating the labor-intensive over/under molding steps.

Farboset® 1190 is a fast-curing epoxy molding compound that is mineral and glass-filled, and it contains improved strength properties. It is specially designed for encapsulating a variety of electrical and electronic components, such as coils, transformers, switches, and more. Farboset® 1190 is known for its excellent thermal shock resistance and superior resistance to cracking, making it a reliable choice for these applications.

DAP D69/6130 is a versatile diallyl ortho-phthalate molding compound with the advantage of being long-glass fiber filled. Supplied in flake form, this compound is convenient to work with. It can be easily molded using compression or transfer equipment and can be preformed for improved handling. Notably, it maintains its performance even when stored at room temperature for up to one year. This makes it a reliable choice for a wide range of applications where long-term performance and ease of use are essential.

Cosmic Epoxy EH61 is an iron-filled epoxy molding compound provided in a black granular form. It is designed for EMI/RFI shielding applications and can be utilized in compression or transfer molding processes to manufacture core rods or encapsulate surface mount and axial leaded inductors. This single molded compound streamlines the manufacturing process, eliminating the labor-intensive over/under molding steps.

DAP D62/6130F is a versatile diallyl ortho-phthalate molding compound, with the added benefits of being flame retardant and long-glass fiber filled. It is supplied in flake form, making it convenient for various applications. This compound can be efficiently molded using compression or transfer equipment and is easily preformed for ease of handling. Notably, it maintains its performance when stored at room temperature for up to one year. Additionally, it has successfully passed NASA outgassing tests, indicating its suitability for a range of applications, including those with stringent requirements.