Products in Thermoset Resins

SABIC's Specialties Business LNP THERMOCOMP TF002 compound is based on Polyurethane (TPU) resin containing 10% glass fiber. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP STAT-KON TX06488 compound is based on Polyurethane (TPU) resin containing conductive carbon powder. Added features of this grade include: Excellent Ductility, Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

ALBIFLEX® 297 is a bisphenol-A-epoxy-silicone block copolymer resin that excels in crafting high-performance elastomers. This versatile liquid, responsive to epoxy, seamlessly cures when combined with aliphatic and cycloaliphatic epoxy resin curing agents. ALBIFLEX® 297 accommodates various conventional casting and molding techniques for your manufacturing needs.

jER™ YX7400N is an adduct formed from the reaction of epichlorohydrin and an aliphatic polyol.FeaturesAdduct formed from the reaction of epichlorohydrin and an aliphatic polyolExcellent elasticityImpact resistanceApplicationsConsumer appliances and electronicsElectrical devices, assemblies, parts and componentsElectronics adhesivesElectrical and electronic packaging and assemblySpecialty and conformal coatingsPotting compoundsPrinted circuit boards (PCBs)Semiconductor manufacturing*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7110 is a tough and flexible liquid-type epoxy resin. It can be used as an impact modifier for brittle materials, as an additive to increase impact resistance, and for stress relaxation to avoid cracking and warpage. jER™ YX7110 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol. Features Adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol Crack and impact resistance Excellent flexibility and elasticity High viscosity Low warpage Maintains flexibility even after full-curing Applications Coatings Adhesives Composites Potting and encapsulation materials Base film/sheet for wearable devices *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. jER™ YX7105 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol.FeaturesExcellent adhesionGood toughnessGood mechanical, impact and crack resistanceExcellent elasticity and flexibilityApplicationsPrinted electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board)Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)Base film and sheet for wearable devicesCoatingsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 4250 is a hybrid bisphenol A/bisphenol F-type epoxy resin that is more flexible than conventional polymer-type epoxy resins. It can be used as an additive to add toughness, insulating and vapor barrier properties and resistance to heat, water and chemicals to a variety of applications. FeaturesPolymer-type epoxy resin with epoxy functional groups at the both endsHigh molecular weightHigh softening points Good adhesionApplicationsPCM, CAN and other coatingsPaintThermoplastics Printed electronics Plastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX4000 is a biphenol-type solid epoxy resin with significantly low melt viscosity, low water absorption and a good balance between adhesiveness and rigidity against stress. It can be used for electrical and electronic applications. jERTM YX4000 is an adduct formed from the reaction of epichlorohydrin and tetramethylbiphenol FeaturesAbrasion, heat and water resistanceElectrical insulationWear resistanceProduct HighlightsSignificantly low melt viscosity (melting point: 108°C)Low chroline contentLow water absorption ApplicationsElectrical and electronic applications (EMC, solder resist, PCB)Potting and encapsulation materialsPowder coatings for ship bottomsAdhesivesComposites *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 1256 is a solid epoxy resin produced from Bisphenol A epoxy resin. It is a polymer-type epoxy resin with epoxy functional group at the both ends. It can be used to add toughness, insulating and vapor barrier properties, and resistance to heat, water and chemicals in a variety of applications. FeaturesHigh molecular weightHigh softening pointsGood film formerHydrolysis resistanceFlexibilityStrong adhesionApplicationsPCM, CAN, and other coatingsPaintsFiber-reinforced materialsThermoplasticsPrinted electronicsPlastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

GEB-1502S is elastic polyacrylic ester resin powder with uniform spherical form. Its cross-linking structure makes it highly resist from solvent penetrating. It is highly suitable used in ink, paint, and lacquer for both solvent and waterborne coatings with function of providing mild matting, unique texture and scratch resistant.

GEB-0801S is elastic polyacrylic ester resin powder with uniform spherical form. Its cross-linking structure makes it highly resist from solvent penetrating. It is highly suitable used in ink, paint, and lacquer for both solvent and waterborne coatings with function of providing mild matting, unique texture and scratch resistant.

Farboset® 1115 is a granular, mineral-filled, anhydride epoxy molding compound with fast cure rates and excellent hot strength. It is specially designed for encapsulating various electrical and electronic components, including coils, transformers, bushings, switches, and more. The material offers good hot rigidity during the molding process and is commonly used in injection and transfer molding applications.

Farboset® 2720 is a mineral-filled epoxy molding compound known for its rapid curing, exceptional moldability, and remarkable resistance to thermal shock and moisture. This compound is tailored to offer enhanced protection against moisture ingress and boasts a high glass transition temperature, making it an ideal choice for ensuring reliability in performance. Its primary purpose is to encapsulate a wide variety of electronic devices, including tantalum and ceramic capacitors, resistors, and resistor networks, providing them with a robust shield against environmental factors and mechanical stress.

METTON® LMR Reinforced Grade M5000-GT Polymers are tough and durable engineering plastics (poly-DCPD). It offers part design freedom with integrated functionality and part consolidation opportunities, similar to injection molding, as a replacement for traditional materials like wood and metal. The low-pressure molding process is ideal for producing large plastic parts used in heavy trucks, agriculture, construction, the military, and various industrial applications.

Cosmic Epoxy E4920AC is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, provided as granules, preforms, or powder, and is offered in various colors. This product features a mild odor and is insoluble in water, making it suitable for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.

Farboset® 2220 is a granular, mineral-filled, novolac epoxy molding compound known for its excellent moldability, fast cure rate, and strong physical and electrical properties. It is specially designed for high-performance applications that demand enhanced thermal characteristics. These applications include the encapsulation of bushings, insulators, and various electrical and electronic components. The compound's properties make it a reliable choice for protecting and ensuring the performance of critical components in challenging environments.

DAP D45 is a mineral-filled, flame retardant, general-purpose diallyl ortho-phthalate molding compound supplied in a free-flowing granular form. It offers a cost-effective solution while maintaining essential properties such as high dimensional stability, arc resistance, and excellent dielectric strength. This compound is well-suited for structural parts, housings, terminals, insulators, and other applications where both strength and economy are important factors.

Farboset® 2500 is a mineral-filled, flame-retardant, novolac epoxy molding compound that offers fast cure rates at low temperatures, laser markability, and good moldability. This compound is formulated for encapsulating surface mount ceramic and tantalum capacitors, along with other applications that require quick cycle times. Its flame-retardant properties make it suitable for applications where fire safety is a concern, while its rapid curing and ability to be laser marked enhance its utility in modern production processes.

Cosmic Epoxy EH71 is an iron-filled epoxy molding compound available in a black granular form. It is well-suited for EMI/RFI shielding applications and can be used in either compression or transfer molding processes to create core rods or encapsulate surface mount and axial leaded inductors. The advantage of this material is its ability to streamline the manufacturing process by eliminating the labor-intensive over/under molding steps.

Cosmic Epoxy CP7312 is a long-glass-reinforced epoxy molding compound supplied in flake form. It can be compression or transfer-moulded and offers high physical strength. This material has a shelf life of 12 months when stored at 20°C or lower. It is an excellent replacement option for a wide range of aircraft and heavy metal parts, making it a versatile choice for various applications.

GAC Chemical Ammonium Sulfate S Grade is a product with Kosher certification, ensuring adherence to dietary preferences. Widely utilized in industrial processes, it excels in flame retardant and styrene butadiene manufacturing, making it an essential component in these applications. Its versatility extends to leather tanning and water treatment, meeting the diverse needs of industries.

Esschem MMA - Styrene Bead Copolymers are a versatile range of copolymers combining methyl methacrylate (MMA) and styrene. These bead copolymers offer a wide array of properties and applications. With increased MMA content, the resulting materials exhibit remarkable strength and transparency. Conversely, a higher proportion of styrene enhances hydrophobicity, hardness, and impact resistance. The molecular weight plays a crucial role in determining the characteristics of the copolymers. Higher molecular weights, often associated with increased styrene content, yield stronger and more heat-resistant materials. Esschem's ability to manipulate the molecular weight distribution allows for customized properties such as durability, elasticity, and processing ease. Additionally, the particle size of the copolymers influences surface properties and rigidity.

Cosmic Epoxy E4940S is a mineral-filled epoxy molding compound supplied in granular form. It offers excellent dimensional stability, improved thermal cycling properties, and exceptional moisture resistance. This product is specifically designed for high-volume encapsulation of resistor networks and fiber-optic connectors that demand high quality, reliability, and excellent moldability.

Farboset® 2472V0 is a novolac epoxy molding compound that is mineral-filled for enhanced performance. It offers rapid cure rates, excellent moldability, and exceptional resistance to thermal shock and moisture. This compound has been specially formulated to provide improved resistance to moisture ingress, making it an ideal choice for applications where exposure to moisture is a concern. Additionally, it features a high glass transition temperature, ensuring optimum reliability in performance. Its combination of properties makes it well-suited for a range of applications where resilience to environmental conditions is crucial.

MOCOM Compounds ALCOM® LDDC PMMA 1000UV18123 BK1016-11 is a translucent, UV stabilized Polymethylmethacrylate polymer used for Automotive, Lighting, and interior decoration/finishing, light transparent components, and Black Panel-Technology applications such as lamp covers, display elements, and operating elements. Pre-drying conditions involve 80°C in a dry air (dessiccant) dryer for 3-4 hours and 80°C in an air circulating dryer for 4-6 hours with a maximum moisture content of less than 0.02%. For processing injection molding, the melt temperature should be between 220-270°C and the mold temperature should be between 50-80°C. It should be protected from light.

Farboset® 2477BB is designed for use as a compound in thermoset molding. It is available in a solid form, presented as granules, with a granular appearance and a mild odor. This product is insoluble in water and does not exhibit reactivity under normal conditions. It is well-suited for a variety of thermoset molding applications, ensuring safety and reliability in its intended use.

DAP ID-50 is a general-purpose diallyl ortho-phthalate molding compound filled with Dacron. It is supplied in a granular form and can be easily molded using standard compression or transfer equipment. This type of compound is versatile and suitable for various molding applications.

METTON® LMR M1540 Polymers are tough and durable engineering plastics (poly-DCPD). They offer part design freedom with integrated functionality and part consolidation opportunities, similar to injection molding, as a replacement for traditional materials like wood and metal. Large plastic components used in military, agricultural, construction, heavy-duty vehicles, and other industrial applications may be produced with the low-pressure molding technique.

METTON® LMR M1537 Polymers are tough and durable engineering plastics (poly-DCPD). They offer part design freedom with integrated functionality and part consolidation opportunities, similar to injection molding, as a replacement for traditional materials like wood and metal. The low-pressure molding process is ideal for producing large plastic parts used in heavy trucks, agriculture, construction, the military, and other industrial applications.

Cosmic Epoxy EH31 is an iron-filled epoxy molding compound available in a granular form with a black color. This material is designed for EMI/RFI shielding applications. It can be used for compression or transfer molding to create core rods and encapsulate surface mount and axial leaded inductors. Using this single molded compound can streamline the manufacturing process and eliminate the need for labor-intensive over/under molding.

Farboset® 1180 is a granular, glass-filled, general-purpose anhydride epoxy molding compound. It is formulated for encapsulation applications where excellent thermal shock resistance and physical strength are required. This compound helps protect electronic and electrical components by providing thermal shock resistance and maintaining their integrity under challenging conditions.