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Sanyo Chemical America Incorporated
POLYTHICK 5423A
Applications:
Appliances & Electronics, Adhesives & Sealants, Packaging & Assembly
Product Families:
Pressure Sensitive Adhesives & Tapes, Adhesives & Sealants
Chemical Family:
Acrylics, Acrylates & Methacrylates
POLYTHICK 5423A is a one-component type pressure-sensitive adhesive for polypropylene film. This product exhibits moderate adhesive strength and removability. It is applicable as an adhesive sealant for polypropylene bags (used in the packaging of products such as calculators, clocks and clothes) and envelopes.
MG Chemicals
MG Chemicals 9200FR - Flame Retardant Structural Epoxy Adhesive
Applications:
Equipment & Parts, Consumer Electronics, Appliances & Electronics
Product Families:
Encapsulants, Structural Adhesives, Adhesives & Sealants
Chemical Family:
Epoxides
9200FR is a toughened, flame retardant, 2-part epoxy adhesive, designed to create long-lasting load-bearing joints. It creates tough vibration resistant bonds and is especially useful for joining dissimilar materials that will experience thermal cycling stresses or harsh environmental conditions. This smooth, non-sagging, thixotropic adhesive is excellent for use on vertical surfaces, for gap filling, and for potting electronics enclosures with gaps where a non-thixotropic encapsulant would flow through.
MG Chemicals
MG Chemicals 9400 - 1 Part Epoxy, Electrically Conductive Adhesive, Low Tg
Applications:
Displays, Appliances & Electronics, Semiconductor Manufacturing
Product Families:
Conductive Adhesives, Adhesives & Sealants
Chemical Family:
Epoxides
9400 is an electrically conductive, silver-filled, 1-part epoxy adhesive with a low cure temperature. It is smooth, thixotropic, non-sagging, and bonds well to a wide variety of substances. It has an unlimited working life at room temperature. This product can create electrically conductive bonds where soldering is not an option, such as when bonding to heat-sensitive components, glass, soft metals, or conductive polymers. It also works well in semi-conductor packaging, microelectronic attachment and lid-sealing, and as a die attach for small chips, LEDs and diodes. It does not require mixing and can be readily used in manual, pneumatic and robotic dispensing processes. 9400 has been formulated to have a low Tg, which allows for minimal stress on substrates during temperature changes. For a higher Tg, use 9410.
MG Chemicals
MG Chemicals 8329TFF - Fast Cure Thermal Adhesive
Applications:
Displays, Power & Utilities, Semiconductor Manufacturing
Product Families:
Conductive Adhesives, Adhesives & Sealants
Chemical Family:
Epoxy & Epoxy Derivatives
8329TFF is a 2-part, flame retardant, thermally conductive epoxy adhesive with a 5-minute working time. It is an off white, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This thermal glue is often used to bond heatsinks to CPUs, LEDs and other electronics components. This product has a very short working time. For a longer working time, use 8349TFM or 8329TFS.
MG Chemicals
MG Chemicals 8329TCF - Fast Cure Thermal Adhesive, High TC
Applications:
Equipment & Parts, Displays, Power & Utilities
Product Families:
Conductive Adhesives, Adhesives & Sealants
Chemical Family:
Epoxy & Epoxy Derivatives
8329TCF is a thermally conductive, fast-cure two-part epoxy adhesive. It is off-white, smooth, viscous, thixotropic, and bonds well to a wide variety of substrates. It is also flame retardant and meets the UL 94V-0 standard. For a 1 mL quantity, a minimal service cure can be achieved in 15 minutes at room temperature, and a full cure in 4 hours. This product is used to bond heat sinks, LEDs and other heat-generating components in electronic assemblies. It is suitable for use with dual-syringes, mix-tips and automatic dispensing systems. 8329TCF has been designed for maximum thermal conductivity with a high viscosity. For a lower viscosity, use 8329TFF. For a longer working life, use 8329TCM or 8329TCS.
MG Chemicals
MG Chemicals 8331S - Silver Conductive Epoxy Adhesive
Applications:
Adhesives & Sealants, Appliances & Electronics, Printed Circuit Boards (PCBs)
Product Families:
Conductive Adhesives, Adhesives & Sealants
Chemical Family:
Silver & Silver Compounds, Epoxy & Epoxy Derivatives
8331S – Silver Conductive Epoxy Adhesive This electrically conductive paste is a 2-part heat-cured epoxy with a long working time. It is smooth, non-sagging, thixotropic, and bonds well to a wide variety of substrates. This electrically conductive epoxy paste can be used as a solder replacement for bonding heat-sensitive electronic components, or for making conductive connections where soldering is not an option, such as when bonding to glass, soft metals, or plastics. It provides excellent EMI/RFI shielding and is very effective in filling seams between metal plates. 8331S has been formulated to be economical. For a higher fill version that maximizes conductivity, use 8330S. For a shorter working time or room temperature cure, use 8331 or 8331D. For a 1-part alternative use 9410 or 9400. We also offer a full line of thermally conductive electrically insulating epoxy adhesives.
MG Chemicals
MG Chemicals 9200 - Structural Epoxy Adhesive
Applications:
Equipment & Parts, Consumer Electronics, Appliances & Electronics
Product Families:
Encapsulants, Structural Adhesives, Adhesives & Sealants
Chemical Family:
Epoxides
9200 is a toughened, 2-part epoxy adhesive, designed to create long-lasting load-bearing joints. It creates tough vibration-resistant bonds and is especially useful for joining dissimilar materials that will experience thermal cycling stresses or harsh environmental conditions. This smooth, non-sagging, thixotropic adhesive is excellent for use on vertical surfaces, for gap filling, and for potting electronics enclosures with gaps where a non-thixotropic encapsulant would flow through. For a flame retardant version, use 9200FR.
MG Chemicals
MG Chemicals 9510 - One-Part Epoxy Potting Compound
Applications:
Adhesives & Sealants, Appliances & Electronics, Printed Circuit Boards (PCBs)
Product Families:
Encapsulants, Adhesives & Sealants
Chemical Family:
Epoxy & Epoxy Derivatives
One-part Epoxy Potting Compound 9510 is a black, rigid, one-part epoxy potting compound. It is a heat cure epoxy that provides unlimited working time at room temperature and does not require frozen storage. Our 1-part epoxy resin provides exceptional chemical resistance against a wide variety of mild to harsh chemicals, including toluene, acetone and ethyl acetate. It also provides excellent electrical insulation and protects against static discharge, vibration, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.
MG Chemicals
MG Chemicals 8329TFM - Thermal Adhesive, Flowable
Applications:
Stationery, Art & Office Supplies, Equipment & Parts, Semiconductor Manufacturing
Product Families:
Conductive Adhesives, Adhesives & Sealants
Chemical Family:
Epoxy & Epoxy Derivatives
8329TFM is a thermally conductive two-part epoxy adhesive. It is dark gray, smooth, thixotropic, and bonds well to a wide variety of substrates. This product is used to bond heat sinks, LEDs, and other heat-generating components in electronic assemblies. It is suitable for use with dual-syringes, mix-tips, and automatic dispensing systems. For a faster working life, use 8329TFF. For a longer working life, use 8329TFS.
MG Chemicals
MG Chemicals TIA225GF - Silicone Thermal Gap Filler
Applications:
Appliances & Electronics, Adhesives & Sealants, Packaging & Assembly
Product Families:
Conductive Adhesives, Adhesives & Sealants
Chemical Family:
Silicon-based Compounds
TIA225GF - Silicone Thermal Gap Filler TIA225GF is a two-component, flame retardant, thermally conductive silicone gap filler. It is a smooth, non-sagging paste that easily conforms to the complex shapes of any interface design. The cured product creates a thermal path that efficiently dissipates heat from electronic devices. It retains its softness after cure which maximizes stress relief during thermal cycling. This thermal gap filler can be used as a liquid alternative for prefabricated solid thermal pads. If higher thermal conductivity is desired, use SilCool TIA241GF.
MG Chemicals
MG Chemicals RTV102 - White Silicone Adhesive Sealant
Applications:
Equipment & Parts, Appliances & Electronics, Adhesives & Sealants
Product Families:
Encapsulants, Caulks & Sealants, Adhesives & Sealants
Chemical Family:
Silicon-based Compounds
RTV102 one-component, ready-to-use adhesive sealants are extremely versatile. They cure to a tough, durable, resilient silicone rubber on exposure to atmospheric moisture at room temperature. Acetic acid vapors are released from the sealant surface as a by-product of cure. RTV102, RTV103, RTV106, RTV108, RTV109, RTV112, RTV116 and RTV118 one-component, ready-to-use adhesive sealants are extremely versatile. They cure to a tough, durable, resilient silicone rubber on exposure to atmospheric moisture at room temperature. Acetic acid vapors are released from the sealant surface as a by-product of cure. Since all these sealants utilize a moisture cure system, they must not be used in thicknesses of greater than 6mm (1/4 in.). Where section depths exceed 6mm (1/4 in.), Momentive Performance Materials one component, addition cure or two-component silicone rubber compounds are recommended.
MG Chemicals
MG Chemicals SilCool TIA241GF – Liquid Silicone Thermal Pad
Applications:
Appliances & Electronics, Adhesives & Sealants, Packaging & Assembly
Product Families:
Conductive Adhesives, Adhesives & Sealants
Chemical Family:
Silicon-based Compounds
SilCool TIA241GF – Liquid Silicone Thermal Pad TIA241GF is a two-component, flame retardant, thermally conductive silicone gap filler. It is a smooth, non-sagging paste that easily conforms to the complex shapes of any interface design. The cured product creates a thermal path that efficiently dissipates heat from electronic devices. It retains its softness after cure which maximizes stress relief during thermal cycling. This thermal gap filler can be used as a liquid alternative for prefabricated solid thermal pads. If lower viscosity is required, use TIA225GF
MG Chemicals
MG Chemicals 9460TC - Thermally Conductive 1-Part Epoxy Adhesive
Applications:
Displays, Appliances & Electronics, Semiconductor Manufacturing
Product Families:
Conductive Adhesives, Adhesives & Sealants
Chemical Family:
Epoxides
9460TC is a 1-part, heat cured only, thermally conductive epoxy adhesive with an unlimited working time. It is an off-white, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This 1-part adhesive is used to glue heat sinks to LEDs, CPUs and other heat-generating components. It does not require mixing and is suitable for use with manual, pneumatic, and automatic dispensing systems.
MG Chemicals
MG Chemicals 8329TCM - Thermal Adhesive, High TC
Applications:
Equipment & Parts, Displays, Power & Utilities
Product Families:
Conductive Adhesives, Adhesives & Sealants
8329TCM is a 2-part thermally conductive epoxy adhesive. It is a dark gray, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This adhesive is most often used as heatsink glue, attaching heatsinks to CPUs, LEDs, or other heat generating electronics components. This compound has been formulated for high thermal conductivity. It is highly viscous and must be mixed by hand prior to application. For a lower viscosity use 8349TFM. For a shorter working time, use 8349TFM. For a longer working time, use 8329TCS.
MG Chemicals
MG Chemicals 8810 - Black Rigid Urethane
Applications:
Adhesives & Sealants, Appliances & Electronics, Potting Compounds
Product Families:
Encapsulants, Adhesives & Sealants
Chemical Family:
Polyurethanes (PU)
8810 urethane resin is a black, tough, 2-part potting compound. It features a low mixed viscosity and excellent moisture resistance. In addition, this rigid urethane potting compound adheres strongly to a wide variety of substrates, including metals, composites, glass, ceramics, and many plastics. This 2-part polyurethane resin offers exceptional physical protection and is designed for potting and encapsulating intricate electronic components and cable jointing boxes.
MG Chemicals
MG Chemicals RTV167 - Gray Silicone
Applications:
Consumer Electronics, Semiconductor Manufacturing, Printed Circuit Boards (PCBs)
Product Families:
Encapsulants, Adhesives & Sealants
Chemical Family:
Silicon-based Compounds
RTV167 adhesive sealants from Momentive Performance Materials are one-component, ready-to-use electronic grade silicone sealants. They cure to a tough, resilient silicone rubber on exposure to atmospheric moisture at room temperature. These electronic-grade silicone adhesive sealants differ somewhat in physical properties including consistency.
MG Chemicals
MG Chemicals 8820 - High Temperature Rigid Urethane
Applications:
Adhesives & Sealants, Appliances & Electronics, Potting Compounds
Product Families:
Encapsulants, Adhesives & Sealants
Chemical Family:
Polyurethanes (PU)
High Temperature Rigid Urethane 8820 is a black, tough, high temperature, two-part polyurethane potting compound. It has a low mixed viscosity and properties similar to epoxy compounds, but with exceptional low temperature stability. As well, it adheres strongly to a wide variety of substrates, including metals, composites, glass, ceramics, and many plastics. 8820 offers exceptional physical protection, a high continuous operating temperature, and superior protection from acids, bases, and many organic solvents.
MG Chemicals
MG Chemicals RTV5818 - Translucent, Very Soft
Applications:
Appliances & Electronics, Adhesives & Sealants, Packaging & Assembly
Product Families:
Caulks & Sealants, Adhesives & Sealants
RTV5810 series sealants are neutral cure, one-component, ready-to-use silicone adhesive sealants that cure to tough resilient silicone rubber on exposure to atmospheric moisture at room temperature. These sealants are fast curing, paste consistency products that may be considered for use where quick initial adhesion build is desired. This may allow for movement of the sealed assemblies in a shorter period of time, increasing productivity.
MG Chemicals
MG Chemicals 8329TCS - Thermal Adhesive, High TC
Applications:
Equipment & Parts, Displays, Power & Utilities
Product Families:
Conductive Adhesives, Adhesives & Sealants
Chemical Family:
Epoxy & Epoxy Derivatives
8329TCS is a 2-part, heat-cure, thermally conductive epoxy adhesive with a 4-hour working time. It is a dark gray, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This thermal adhesive is used to glue heat sinks to LEDs, CPUs and other heat-generating components. 8329TCS has been designed for maximum thermal conductivity. It is highly viscous and must be mixed by hand prior to application. For a lower viscosity, use 8329TFS. For a shorter working time, use 8329TCM.
MG Chemicals
MG Chemicals 9410 - 1 Part Epoxy, Electrically Conductive Adhesive, High Tg
Applications:
Displays, Appliances & Electronics, Semiconductor Manufacturing
Product Families:
Conductive Adhesives, Adhesives & Sealants
Chemical Family:
Epoxides
9410 is a 1-part electrically conductive epoxy adhesive. It has unlimited working time at room temperature. It bonds well to a wide variety of substrates, and offers strong chemical resistance. 9410 is designed for semi-conductor flip chip packaging as well as die attach for small chips, LEDs and diodes. It provides excellent EMI/RFI shielding and is very effective at filling in seams between metal plates. It can be readily used in manual, pneumatic and robotic dispensing processes.
MG Chemicals
MG Chemicals RTV108 - Clear Silicone Sealant
Applications:
Equipment & Parts, Appliances & Electronics, Adhesives & Sealants
Product Families:
Caulks & Sealants, Adhesives & Sealants
Chemical Family:
Silicon-based Compounds
RTV108 one-component, ready-to-use adhesive sealants are extremely versatile. They cure to a tough, durable, resilient silicone rubber on exposure to atmospheric moisture at room temperature. Acetic acid vapors are released from the sealant surface as a by-product of cure. RTV102, RTV103, RTV106, RTV108, RTV109, RTV112, RTV116 and RTV118 one-component, ready-to-use adhesive sealants are extremely versatile. They cure to a tough, durable, resilient silicone rubber on exposure to atmospheric moisture at room temperature. Acetic acid vapors are released from the sealant surface as a by-product of cure. Since all these sealants utilize a moisture cure system, they must not be used in thicknesses of greater than 6mm (1/4 in.). Where section depths exceed 6mm (1/4 in.), Momentive Performance Materials one component, addition cure or two-component silicone rubber compounds are recommended.
Cymer Chemical
Conseal FN120 (Polyamide Resin Solution)
Applications:
Electronics Adhesives, Batteries, Adhesives & Sealants
Product Families:
Other Resins & Binders, Resins & Binders
Chemical Family:
Polyamides
Dry Cell Battery Sealant
Cymer Chemical
Conseal 1400 (Polyamide Resin Solution)
Applications:
Electronics Adhesives, Batteries, Adhesives & Sealants
Product Families:
Other Resins & Binders, Resins & Binders
Chemical Family:
Polyamides
Dry Cell Battery Sealant
Cymer Chemical
Conseal FN120OB (Polyamide Resin Solution)
Applications:
Electronics Adhesives, Batteries, Adhesives & Sealants
Product Families:
Other Resins & Binders, Resins & Binders
Chemical Family:
Polyamides
Dry Cell Battery Sealant
Cymer Chemical
Conseal 255 (Polyamide Resin Solution)
Applications:
Electronics Adhesives, Batteries, Adhesives & Sealants
Product Families:
Other Resins & Binders, Resins & Binders
Chemical Family:
Polyamides
Dry Cell Battery Sealant
AB Specialty Silicones
Andisil® SPR 2833
Applications:
Appliances & Electronics, Primers & Lacquers, Adhesives & Sealants
Product Families:
Primers & Sealers, Paints & Coatings
Chemical Family:
Silicones
Andisil® SPR 2833 Clear is a reactive silicone primer that can be used to improve adhesion of various RTV silicones to a variety of substrates including: metal, wood, glass, ceramics and many plastics. It is useful in formulations where a clear primer is preferred.
Cymer Chemical
Conseal 250 (Polyamide Resin Solution)
Applications:
Electronics Adhesives, Batteries, Adhesives & Sealants
Product Families:
Other Resins & Binders, Resins & Binders
Chemical Family:
Polyamides
Dry Cell Battery Sealant
EpoxySet Inc.
EpoxySet Inc. TG-45LV
Applications:
Adhesives & Sealants, Appliances & Electronics, Electrical & Electronic Systems
Product Families:
Greases, Fluids & Lubricants
TG-45LV is a specially formulated with low viscosity/screen printable consistency to achieve low BLT and high thermal conductivity for optimum thermal performance. Exhibits excellent resistance to pump out, outgassing and phase separation while eliminating concern of silicone deposition on optics and electronics within any package. TG-45LV is high performance thermal grease designed to meet the thermal, reliability and low-price requirements of high-end chipset, graphic processors trend ever-faster clock speeds. RoHS compliant and halogen -free
EpoxySet Inc.
EpoxySet Inc. UV-8509R
Applications:
Switches & Relays, Consumer Electronics, Other Devices & Assemblies
Product Families:
Other Adhesives & Sealants, Adhesives & Sealants
Chemical Family:
Urethanes
UV-8509R is a non-sag, fast curing, urethane acrylate that bonds well to engineered plastics and metal based substrates. This product requires direct UV exposure during cure. Because of the variability of different UV light sources it is suggested that the user test and specify UV intensity and exposure time. This material is specially formulated to have reduced surface tack due to oxygen inhibition.
EpoxySet Inc.
FLASHBOND™ UV-3700F
Applications:
Consumer Electronics, Appliances & Electronics, Adhesives & Sealants
Product Families:
Structural Adhesives, Encapsulants, Adhesives & Sealants
Chemical Family:
Epoxy & Epoxy Derivatives
FLASHBOND™ UV-8300LV is a low viscosity, light curing epoxy adhesive that bonds well to a wide variety of substrates including metals, glass, ceramics and some plastics. This product exhibits good surface wetting and adhesion to glass and many plastics. This product requires direct light exposure during cure. Because of the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cure in the presence of visible light (405nm) as well as down to 365nm. Flashbond UV-8300LV has been tested to and passes ISO-10993-5 for cytotoxicity.
EpoxySet Inc.
EpoxySet Inc. HTG-72TC
Applications:
Adhesives & Sealants, Chassis & Brake, Appliances & Electronics
Product Families:
Greases, Fluids & Lubricants
HTG-72TC is our highest temperature resistance thermal grease along with very high thermal conductivity. It is a heavily filled system with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 360°C, maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.
EpoxySet Inc.
EPOXIBOND™ EB-109M-11
Applications:
Equipment & Parts, Consumer Electronics, Appliances & Electronics
Product Families:
Encapsulants, Adhesives & Sealants
Chemical Family:
Epoxy & Epoxy Derivatives
EPOXIBOND™ EB-155 is an undiluted, unfilled, low viscosity clear epoxy system that exhibits exceptional resistance to impact and thermal shock. This system has low exotherm and long work life. Applications includes, high bond strength adhesive for most similar and dissimilar substrates; LED displays, any fiber optic application. It can also be used for making in-place laminates or for protective coating on metals etc. Also it can be used for semi-rigid, moisture proof, gas tight seals between plastic and metallic or other substrates. This is also recommended for potting devices such as connector shells from which rigid or flexible wires may protrude directly through the epoxy.
EpoxySet Inc.
EpoxySet Inc. STG-40
Applications:
Adhesives & Sealants, Appliances & Electronics, Electrical & Electronic Systems
Product Families:
Greases, Fluids & Lubricants
Chemical Family:
Silicones
STG-40 is a non-reactive, Silicone, Thermally Conductive Grease with a high thermal conductivity and low thermal resistance with a soft, non-flowable consistency. This product is formulated with specialty binding agents to achieve lowest amount of bleed and evaporations. It is designed for applications where a silicone thermal interface material is required and where the device may later need to be easily removed from the heat sink. This compound is ideally suited for use in thin cross-sectional thicknesses down to ≤1 mil.
EpoxySet Inc.
EPOXIBOND™ EB-153
Applications:
Semiconductor Manufacturing, Consumer Electronics, Appliances & Electronics
Product Families:
Encapsulants, Structural Adhesives, Adhesives & Sealants
Chemical Family:
Epoxy & Epoxy Derivatives
FLASHBOND™ UV-5402 is a low viscosity, flexible, light curing epoxy adhesive that offers excellent strenth and flexibility for reduced cracking. UV-5402 is low viscosity and high elongation. This product requires direct light exposure during cure. Because of the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cure in the presence of visible light (400-415nm) and can also cure down to 365nm.
EpoxySet Inc.
FLASHBOND™ UV-5608DC
Applications:
Connectors, Consumer Electronics, Appliances & Electronics
Product Families:
Structural Adhesives, Adhesives & Sealants
Chemical Family:
Epoxy & Epoxy Derivatives
SetWORX™ 1510 is a fast setting, toughened epoxy adhesive designed for industrial grade applications. This epoxy system has 1:1 mixing ratio by volume & cure fast at room temperature. When cured it is resistant to a wide range of chemicals and solvents, and acts as an excellent electrical insulator. The cured adhesive exhibits high impact resistance and exceptional bond strength. It can be used for bonding glass, metals, woods and some plastics.
EpoxySet Inc.
EpoxySet Inc. TG-69
Applications:
Adhesives & Sealants, Appliances & Electronics, Electrical & Electronic Systems
Product Families:
Greases, Fluids & Lubricants
TG-69 compound grease-like NON-SILICONE, NON- FLOWABLE material heavily filled with heat-conductive metal oxides. These combinations provide high thermal conductivity, low bleed and high temperature stability. TG-69 has been engineered to solve the problems of contamination and migration associated with silicone-based products. Unique polysynthetic-based thermal grease used to insure quick, efficient heat transfer and dissipation for the full operational life of your hardware.
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