Parts & Components
DuPont
Delrin® 500P NC010
Polymer Name: Polyacetal Homopolymer (POM)
Processing Methods: Injection Molding
Additives Included: Mold Release Agent, Lubricant (Unspecified)
Flexural Modulus: 3000.0 - 3000.0 MPa
Delrin® 500P is a general purpose medium viscosity acetal homopolymer for injection molding. It has improved processing thermal stability, a good combination of mechanical properties, and low VOC emissions.
DuPont
Kalrez® 4079
Polymer Name: Perfluoroelastomer (FFKM)
Physical Form: Seals, Custom, Diaphragms, O-rings
Features: Good Mechanical Properties, High Temperature Resistance, Heat Aging Resistant, Low Compression Set, Good Thermal Stability, Chemical Resistant, General Purpose
End Uses: Semiconductor Applications, Pump Parts, Aircraft Applications
Color: Black
Kalrez® 4079 perfluoroelastomer parts are a low compression set product for general purpose use in O-rings, diaphragms, seals and other parts used in the chemical process and aircraft industries. It is a carbon black filled product with excellent chemical resistance, good mechanical properties, and outstanding hot air aging properties. It exhibits low swell in organic acids, inorganic acids and aldehydes, and has good response to temperature cycling effects. A maximum service temperature of 316°C (600°F) is suggested, with short excursions to higher temperatures possible. Kalrez® 4079 is not recommended for use in hot water/steam applications or in contact with certain hot aliphatic amines, ethylene oxide, or propylene oxide.
Mitsubishi Chemical Group
jERâ„¢ YX7105
Chemical Family: Epoxy & Epoxy Derivatives
End Uses: Semiconductor Applications
Polymer Name: Epoxy Resins & Compounds
Compatible Substrates & Surfaces: Glass, Fibers & Fabrics, Metal, Plastics, Steel, Aluminum, Ceramic, Concrete & Masonry
jERâ„¢ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. Features Excellent adhesion Good toughness Good mechanical, impact and crack resistance Excellent elasticity and flexibility Applications Printed electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board) Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP) Base film and sheet for wearable devices Coatings Adhesives
DuPont
Kalrez® Spectrum™ 6375
Polymer Name: Perfluoroelastomer (FFKM)
Physical Form: Seals, Custom, Diaphragms, O-rings, Valve Seats
Features: High Temperature Resistance, Good Thermal Stability, Chemical Resistant
End Uses: Valve Parts, Electrical Connectors, Logging While Drilling Tools, Semiconductor Applications, Ball Valves, Measurement While Drilling Tools, Valves, Electric Submersible Pump
Color: Black
Kalrez® Spectrum™ 6375 is designed to give outstanding performance in the widest possible range of chemicals and temperatures. Mixed streams, once a problem for many chemical processors, can now be handled by 6375, furthermore, the curing system also allows for a maximum service temperature of 275°C (525 °F) which translates to increased chemical resistance over all temperature ranges, especially if high temperature process excursions occur. This combination of chemical and thermal resistance provides advantages for chemical processors. Kalrez® Spectrum™ 6375 is a carbon black-filled product for general use in O-rings, seals, diaphragms and other parts specifically for the chemical process industry. This product has excellent broad chemical resistance, good mechanical properties, and outstanding hot-air aging properties. Kalrez® Spectrum™ 6375 is well suited for use in mixed process streams because of its excellent resistance to acids, bases, and amines. It is also recommended for use in hot water, steam, pure ethylene oxide and propylene oxide.
Mitsubishi Chemical Group
jERâ„¢ YX8000D
Chemical Family: Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol A Type Epoxy
End Uses: Semiconductor Applications, Radiation Curable Coating
Polymer Name: Epoxy Resins & Compounds
Compatible Substrates & Surfaces: Glass, Fibers & Fabrics, Metal, Plastics, Steel, Aluminum, Ceramic, Concrete & Masonry
jERâ„¢ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs
DuPont
Delrin® 100 NC010
Polymer Name: Polyacetal Homopolymer (POM)
Processing Methods: Sheet, Plaques & Profiles Extrusion, Injection Molding, Extrusion
Additives Included: Mold Release Agent
Flexural Modulus: 2800.0 - 2800.0 MPa
Delrin® 100 is a high viscosity acetal homopolymer for use in easy-to-fill molds. Delrin® 100 provides optimum mechanical performance with its excellent combination of toughness and strength.
DuPont
Delrin® 100AF
Polymer Name: Polyacetal Homopolymer (POM)
Processing Methods: Extrusion, Sheet, Plaques & Profiles Extrusion, Injection Molding
Fillers Included: PTFE, PTFE Fiber
Additives Included: Lubricant (Unspecified), Mold Release Agent
Flexural Modulus: 2500.0 - 2500.0 MPa
Delrin® 100AF is a high viscosity acetal homopolymer containing 20% Teflon® PTFE fibers. It is designed for applications requiring low wear and/or low friction against steel, itself, or other plastics.Due to the color of the Teflon® PTFE fibers, the natural color of this material is brown.
DuPont
Kalrez® Spectrum™ 7075
Polymer Name: Perfluoroelastomer (FFKM)
Physical Form: Seals, Custom, Diaphragms, O-rings, Valve Seats
Features: Good Seal Force Retention, High Temperature Resistance, Low Compression Set, Good Thermal Stability, Chemical Resistant
End Uses: Flanges, Semiconductor Applications, Pump Parts, Hot Glue Delivery Nozzle, Valves, Valve Parts
Color: Black
Kalrez® perfluoroelastomer parts are the material of choice for mechanical seals, valves, flanges and other demanding chemical and hydrocarbon processing applications. Kalrez® Spectrum™ 7075 has enhanced physical properties including very low compression set and improved seal force retention. It is a carbon black-filled product utilizing proprietary cure chemistry. Its mechanical properties are designed for improved sealing performance in both high temperature environments and temperature cycling situations. Kalrez® Spectrum™ 7075 O-rings have a glossy finish. This product was developed specifically for the chemical and hydrocarbon industries to provide improved chemical and thermal resistance better than the industry standard set by Kalrez® 4079.
DuPont
Delrin® 100P NC010
Polymer Name: Polyacetal Homopolymer (POM)
Processing Methods: Extrusion, Sheet, Plaques & Profiles Extrusion, Injection Molding
Additives Included: Mold Release Agent, Lubricant (Unspecified)
Flexural Modulus: 2800.0 - 2800.0 MPa
Delrin® 100P is a high viscosity acetal homopolymer for use in easy-to-fill molds. Delrin® 100P provides a great combination of toughness and strength, improved processing thermal stability and productivity for injection molding, and low VOC emissions.
AdvanSix
Naxol® Cyclohexanol
Function: Intermediate, Solvent
Chemical Name: Cyclohexanol
CAS Number: 108-93-0
Chemical Family: Alcohols
Labeling Claims: Low Toxicity, Low Water Content
Naxol® cyclohexanol is a versatile solvent and intermediate suitable for use in and/or production of agricultural and CASE (Coatings Adhesives Sealants and Elastomers) products, rubbers, plasticizers, and fragrance compounds. Naxol® cyclohexanol offers low toxicity and is produced to low moisture standards. Naxol® cyclohexanol may be used to provide extra freeze protection at temperatures as low as -5°C (23°C). High purity Naxol® cyclohexanol is used in the Building & Construction market for infrastructure, roads and paving applications. Also, high purity Naxol® cyclohexanol is used in the Electrical & Electronics market for the production of printed circuit boards and other semiconductor manufacturing applications. Additionally, high purity Naxol® cyclohexanol is used in the Home & Personal Care market as a solvent for fragrance compound.
Chi Mei Corporation
Wonderloy® PC-540
Polymer Name: PC/ABS Alloy
Processing Methods: Injection Molding
Density: 1180.0 - 1180.0 kg/m³
Flexural Modulus: 2500.0 - 2500.0 MPa
WONDERLOY® PC-540 is a Polycarbonate + ABS (PC+ABS) product. It can be processed by injection molding and is available in Africa & Middle East, Asia Pacific, Europe, Latin America, or North America.Characteristics include: Flame Rated RoHS Compliant Flame Retardant Halogen Free
AdvanSix
AdvanSix Acetone NF Grade
Chemical Name: Acetone
CAS Number: 67-64-1
Grade: Pharma Grade
Purity (Assay): 99.5 - 99.5 %
Labeling Claims: Low Toxicity, Low Water Content, Benzene-free, VOC Exempt, High Purity
Chemical Family: Ketones
AdvanSix High Purity Acetone NF Grade meets or exceeds certification requirements of the National Formulary. It is produced to the highest standards for key industries, including Building & Construction, Agriculture & Feed, Automotive & Transportation, Adhesives & Sealants, Paints & Coatings, Electrical & Electronics, Packaging, Personal Care, and Pharmaceuticals & Healthcare. Offering low impurities, low Benzene, and low water content, AdvanSix High Purity Acetone NF grade can be used as an intermediate in the production of:Building and ConstructionConstruction and repair adhesives, exterior insulation and finishing systems, glazing and window elements, pipe and plumbing cement systems, and roofing sealants and caulks.Agriculture & Feed Agricultural pest control and industrial weed and vegetation control products.Automotive & TransportationAutomotive aftermarket parts, exterior and body parts, interior parts and lighting, and coatings for aerospace, automotive OEM, marine, rail, mass transit, off-road and commercial vehicle applications.Electrical & ElectronicsDevices and assemblies for automotive and consumer electronics, packaging and assembly adhesives and sealants, printed circuit boards, and other semiconductor manufacturing applications.Healthcare & PharmaOral and dental drug delivery solutions, tubing and fluid handling equipment, excipients, coatings and processing aids and nail care applications.Paints & CoatingsArchitectural coatings, decorative paints, wood coatings and finishes, flooring and surface coatings, infrastructure coatings and markings, and packaging coatings for film and foil, overprint varnishes, primers and lacquers, and other aerosol coating applications.
Mitsubishi Chemical Group
jERâ„¢ YL980
Chemical Family: Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol A Type Epoxy
End Uses: Semiconductor Applications
Polymer Name: Epoxy Resins & Compounds
Compatible Substrates & Surfaces: Glass, Fibers & Fabrics, Metal, Steel, Plastics, Aluminum, Ceramic, Concrete & Masonry
jERâ„¢ YL980 is is a Bisphenol A-type liquid epoxy resin with significantly low chlorine content. It can be used for electrical and electronic applications. Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives
DuPont
Hytrel® 7246
Polymer Name: Thermoplastic Copolyester Elastomer (TPC-ET)
Processing Methods: Thermoforming, Extrusion, Sheet, Plaques & Profiles Extrusion, Film Extrusion, Casting, Injection Molding
End Uses: Hoses, SRS Pretensioner, Automotive Safety Retractor, Cable Jacketing, SRS Airbag, SRS Actuator, Sporting Goods, Electrical/Electronic Applications, Office Automation Equipment, Automotive Safety, Cast Films, Cosmetic Packaging, Appliances, Pipes, Automotive Applications, Corrugated Pipe, SRS Adjuster, SRS Seatbelt, Connectors, Monofilaments, Film, Safety Restrain System, EV Charger, Automotive Safety Pushbutton, Thermoforming Applications, Tubing, SRS Pillar Loop, Wire & Cable Applications, Safety Equipment, Signal Cord
Density: 1260.0 - 1260.0 kg/m³
Strain at Break: 300.0 - 300.0 %
Flexural Modulus: 550.0 - 550.0 MPa
Hytrel® 7246 is a high modulus grade with nominal hardness of 72D. It contains non-discoloring stabilizer. It can be processed by many conventional thermoplastic processing techniques like injection molding and extrusion.The 72 Shore D hardness is based on a legacy method and is still used for grade identification purposes.Typical applications:Tubing, wire and cable jackets, gears and sprockets, oil field parts.
Mitsubishi Chemical Group
jERâ„¢ YX7110
Chemical Family: Epoxy & Epoxy Derivatives
End Uses: Semiconductor Applications
Polymer Name: Epoxy Resins & Compounds
jERâ„¢ YX7110 is a tough and flexible liquid-type epoxy resin. It can be used as an impact modifier for brittle materials, as an additive to increase impact resistance, and for stress relaxation to avoid cracking and warpage. Features Adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol Crack and impact resistance Excellent flexibility and elasticity High viscosity Low warpage Maintains flexibility even after full-curing Applications Coatings Adhesives Composites Potting and encapsulation materials Base film/sheet for wearable devices
DIC Corporation
DIC.PPS® Z-230
Polymer Name: Polyphenylene Sulfide (PPS)
Processing Methods: Injection Molding
Fillers Included: Glass Fiber
Additives Included: Flame Retardant
Outline: Z-230 is a 30% glass fiber reinforced super tough PPS compound that provides excellent impact, thermal shock, and hot water resistance. Color: Black
Mitsubishi Chemical Group
jERâ„¢ YX4000
Chemical Family: Epoxy & Epoxy Derivatives
End Uses: Powder Coating, Semiconductor Applications
Polymer Name: Epoxy Resins & Compounds
Compatible Substrates & Surfaces: Glass, Fibers & Fabrics, Metal, Steel, Plastics, Aluminum, Ceramic, Concrete & Masonry
jER™ YX4000 is a biphenol-type solid epoxy resin with significantly low melt viscosity, low water absorption and a good balance between adhesiveness and rigidity against stress. It can be used for electrical and electronic applications. Features Abrasion, heat and water resistance Electrical insulation Wear resistance Product Highlights Significantly low melt viscosity (melting point: 108°C) Low chroline content Low water absorption Applications Electrical and electronic applications (EMC, solder resist, PCB) Potting and encapsulation materials Powder coatings for ship bottoms Adhesives Composites
Mitsubishi Chemical Group
jERâ„¢ YX8040
Chemical Family: Epoxy & Epoxy Derivatives
End Uses: Semiconductor Applications
Polymer Name: Epoxy Resins & Compounds
jERâ„¢ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. IOt can be used for optical materials such as LED encapsulants and adhesives for displays. Features High purity Transparency LED-curable UV-curable
DuPont
Kalrez® 9100
Polymer Name: Perfluoroelastomer (FFKM)
Physical Form: Seals
Features: Excellent Resistance To Plasma Radicals, Low Compression Set, Good Thermal Stability, Good Elastic Recovery, Low Outgassing, Low Metal Content, Good Mechanical Properties
End Uses: Semiconductor Applications, Pump Parts
Color: Amber
Kalrez® 9100 is an amber translucent product targeted specifically for PECVD, ALD, HDPCVD and Conductor (Poly/Metal) Etch applications*. Kalrez® 9100 has been specifically designed for low erosion and ultra-low particle generation in harsh plasma environments. It offers excellent thermal stability, very low outgassing as well as excellent elastic recovery and good mechanical strength properties and is well suited for both static and select dynamic sealing applications*. A maximum application temperature of 300°C (572°F) is suggested. Ultrapure post-cleaning and packaging is standard for allKalrez® 9100 parts.
Mitsubishi Chemical Group
METABLENâ„¢ S 2001
Function: Impact Modifier
Compatible Polymers & Resins: Polycarbonates (PC), Polyvinyl Chloride (PVC), Polylactic Acid (PLA), Polyamides, Acrylonitrile Butadiene Styrene (ABS), Recycled Plastics, Poly(Methyl Methacrylate) (PMMA), Polyesters
Processing Methods: Injection Molding
End Uses: Appliances, Semiconductor Applications, Battery Cases
METABLENâ„¢ S-2001 is a silicone-acrylic rubber-type impact modifier with high impact strength in all temperatures and excellent weatherability. It can be used with ABS, PC, PLA, and other matrix resins in a variety of automotive, aerospace and electric and electronic applications. Features Can be used with recycled plastics Good weather stability Low temperature impact resistance
Greene Tweed
Chemrazâ„¢ XRZ
Polymer Name: Perfluoroelastomer (FFKM)
Features: High Purity, Low Compression Set
Chemraz XRZ is a Perfluoroelastomer product. It is available in North America. Applications of Chemraz XRZ include engineering/industrial parts and sealing applications. Primary characteristic: high purity.
DuPont
Delrin® 500AF
Polymer Name: Polyacetal Homopolymer (POM)
Processing Methods: Extrusion, Injection Molding
Fillers Included: PTFE, PTFE Fiber
Additives Included: Lubricant (Unspecified), Mold Release Agent
Flexural Modulus: 2500.0 - 2500.0 MPa
Delrin® 500AF is a medium viscosity acetal homopolymer containing 20% Teflon® PTFE fibers. It is designed for applications requiring low wear and/or low friction against steel, itself, or other plastics.Due to the color of the Teflon® PTFE fibers, the natural color of this material is brown.
DuPont
BETAFORCE® 2800 TC
Ready to Use Product Type: 2K (2 component) Adhesive & Sealant, Conductive Adhesive
Application Method: Pneumatic Gun
Compatible Substrates & Surfaces: Metal
Chemical Family: Polyurethanes (PU)
BETAFORCE® 2800 TC is a thermal conductive two-component polyurethane adhesive, specially developped for battery assembly Very good thermal conductivity Good adhesion to coated metal surfaces Accelerated adhesion at elevated temperatueres Silicon free Free of abrasive fillers Low temperature dependancy of the modulus DuPont Automotive products are primarily developed in co-operation with the automobile manufacturers, according to their needs and their specifications, they are approved for the specific applications as defined by the customer. The use of the product other than approved appliction have to be released in written form by the Technical Service of DuPont Automotive Systems
DuPont
Delrin® 527UV NC010
Polymer Name: Polyacetal Homopolymer (POM)
Processing Methods: Injection Molding
Additives Included: Mold Release Agent, Lubricant (Unspecified)
Flexural Modulus: 3000.0 - 3000.0 MPa
Delrin® 527UV is a UV-stabilized medium viscosity acetal homopolymer developed for applications in automotive interiors. It represents a dramatic improvement over Delrin® 507 in mechanical performance after prolonged UV exposure and thermal stability.
DuPont
BETATECHâ„¢ 2029
Ready to Use Product Type: 2K (2 component) Adhesive & Sealant, Conductive Adhesive
Chemical Family: Polyurethanes (PU)
BETATECHâ„¢ 2029 is a two component thermal interface material based on a polyurethane technology with a very high thermal conductivity. BETATECHâ„¢ 2029 is based on aluminum trihydroxide fillers that lead to a very high thermal conductivity accompanied by a low density. The material can be efficiently applied and the parts can be joined quickly due to a low press-in force. The material is free of silicones.
Epoxy Technology Inc.
EPO-TEK® E4110
Polymer Name: Epoxy Resins & Compounds
End Uses: Semiconductor Molding Compounds, Printed Circuit Boards, Electrical Components, Electrical/Electronic Applications, LCD Applications, Semiconductor Applications
EPO-TEK® E4110 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other heat cures can be used.Formerly EP110
LG Chem
Lupoy® GP5200
Polymer Name: PC/ABS Alloy
Processing Methods: Injection Molding
Density: 1300.0 - 1300.0 kg/m³
Flexural Modulus: 5297.0 - 5297.0 MPa
Lupoy® GP5200 is a Polycarbonate + ABS (PC+ABS) material filled with 20% glass fiber. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding.Typical applications include: Automotive Housings
Mitsubishi Chemical Group
jERâ„¢ YX8800
Chemical Family: Epoxy & Epoxy Derivatives
End Uses: Powder Coating, Semiconductor Applications
Polymer Name: Epoxy Resins & Compounds
Compatible Substrates & Surfaces: Glass, Fibers & Fabrics, Metal, Steel, Plastics, Aluminum, Ceramic, Concrete & Masonry
jER™ YX8800 is an anthracene-type epoxy resin with significantly low melt viscosity, high Tg and low-CTE. It can be used for electrical and electronic applications, carbon fiber reinforced polymers (CFRP) and other applications that require flame retardancy. Benefits High flame retardancy Well-balanced mechanical properies High electrical reliability Features Abrasion, heat and water resistance Electrical insulation Good thermal stability High glass tansition temperature Low CLTE Significantly low melt viscosity (melting point: 107°C) Low chroline content Applications Electrical and electronic applications (EMC, solder resist, PCB) Potting and encapsulation materials. Powder coatings Adhesives Composites
DuPont
Delrin® 500P BK602
Polymer Name: Polyacetal Homopolymer (POM)
Processing Methods: Injection Molding
Additives Included: Mold Release Agent, Lubricant (Unspecified)
Flexural Modulus: 3000.0 - 3000.0 MPa
Delrin® 500P is a general purpose medium viscosity acetal homopolymer for injection molding. It has improved processing thermal stability, and a good combination of mechanical properties.
DuPont
Zytel® FR7026V0F NC010
Polymer Name: Polyamide 66 (PA 66)
Processing Methods: Injection Molding
Additives Included: Mold Release Agent, Flame Retardant
Zytel® FR7026V0F NC010 is a flame retardant, heat stabilized, polyamide 66 resin for injection molding. It does not contain elemental phosphorous or heavy metals and uses an halogen free flame retardant package.
DuPont
Delrin® 577 BK000
Polymer Name: Polyacetal Homopolymer (POM)
Processing Methods: Injection Molding
Fillers Included: Glass Fiber
Additives Included: Mold Release Agent
Flexural Modulus: 4600.0 - 4600.0 MPa
Delrin® 577 is a medium viscosity acetal homopolymer (Polyoxymethylene POM) containing 20% glass fiber filler for injection molding. It has very high stiffness, low warpage, and good creep resistance for superior performance at elevated temperature. It contains carbon black for improved weathering.