Composite Materials


Mitsubishi Chemical Group
jER™ YX7105
Polymer Name: Epoxy Resins & Compounds
Function: Impact Modifier, Coupling Agent, Binder, Adhesion Promoter
Chemical Family: Epoxy & Epoxy Derivatives
Compatible Substrates & Surfaces: Glass, Fibers & Fabrics, Metal, Plastics, Steel, Aluminum, Ceramic, Concrete & Masonry
jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. jERTM YX7105 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol. Features Excellent adhesion Good toughness Good mechanical, impact and crack resistance Excellent elasticity and flexibility Applications Printed electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board) Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP) Base film and sheet for wearable devices Coatings Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group


Mitsubishi Chemical Group
jER™ YX8000D
Polymer Name: Epoxy Resins & Compounds
Function: Coupling Agent, Binder, Adhesion Promoter
Chemical Family: Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol A Type Epoxy
Compatible Substrates & Surfaces: Metal, Aluminum, Concrete & Masonry, Glass, Fibers & Fabrics, Plastics, Steel, Ceramic
jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group


INVISTA
Dytek® DCH-99
Chemical Name: 1,2-Diaminocyclohexane
Function: Chelating Agent, Catalyst, Corrosion Inhibitor, Chain Extender, Curing, Crosslinking & Hardening
CAS Number: 694-83-7
Chemical Family: Diamines
DYTEK® DCH-99 (1,2-diamainecyclohexane) is a cyclic aliphatic diamine made of 100% reclaimed material that is used primarily in epoxy coatings and composites. It provides chemical resistance over a broad range of chemicals, which makes it a superior choice for industrial and marine coatings. Other applications include mining, oil & gas, and pharmaceutical intermediates.


Mitsubishi Chemical Group
jER™ 4250
Polymer Name: Epoxy Resins & Compounds
Function: Coupling Agent, Plasticizer, Binder, Adhesion Promoter, Impact Modifier
Chemical Family: Epoxy & Epoxy Derivatives
Compatible Substrates & Surfaces: Metal, Aluminum, Concrete & Masonry, Glass, Fibers & Fabrics, Steel, Plastics, Ceramic
jER™ 4250 is a hybrid bisphenol A/bisphenol F-type epoxy resin that is more flexible than conventional polymer-type epoxy resins. It can be used as an additive to add toughness, insulating and vapor barrier properties and resistance to heat, water and chemicals to a variety of applications. Features Polymer-type epoxy resin with epoxy functional groups at the both ends High molecular weight High softening points Good adhesion Applications PCM, CAN and other coatings Paint Thermoplastics Printed electronics Plastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group


Mitsubishi Chemical Group
jER™ YL980
Polymer Name: Epoxy Resins & Compounds
Function: Coupling Agent, Binder, Adhesion Promoter
Chemical Family: Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol A Type Epoxy
Compatible Substrates & Surfaces: Metal, Aluminum, Concrete & Masonry, Glass, Fibers & Fabrics, Steel, Plastics, Ceramic
jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on).BenefitsExcellent adhesivenessMaintains high electrical reliability FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)ApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group


Mitsubishi Chemical Group
jER™ YX7110
Polymer Name: Epoxy Resins & Compounds
Function: Impact Modifier, Binder, Coupling Agent, Adhesion Promoter
Chemical Family: Epoxy & Epoxy Derivatives
jER™ YX7110 is a tough and flexible liquid-type epoxy resin. It can be used as an impact modifier for brittle materials, as an additive to increase impact resistance, and for stress relaxation to avoid cracking and warpage. jERTM YX7110 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol. Features Adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol Crack and impact resistance Excellent flexibility and elasticity High viscosity Low warpage Maintains flexibility even after full-curing Applications Coatings Adhesives Composites Potting and encapsulation materials Base film/sheet for wearable devices *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group


Mitsubishi Chemical Group
jER™ YX4000
Polymer Name: Epoxy Resins & Compounds
Function: Coupling Agent, Adhesion Promoter, Binder
Chemical Family: Epoxy & Epoxy Derivatives
Compatible Substrates & Surfaces: Glass, Ceramic, Aluminum, Fibers & Fabrics, Concrete & Masonry, Plastics, Metal, Steel
jER™ YX4000 is a biphenol-type solid epoxy resin with significantly low melt viscosity, low water absorption and a good balance between adhesiveness and rigidity against stress. It can be used for electrical and electronic applications. jERTM YX4000 is an adduct formed from the reaction of epichlorohydrin and tetramethylbiphenol Features Abrasion, heat and water resistance Electrical insulation Wear resistance Product Highlights Significantly low melt viscosity (melting point: 108°C) Low chroline content Low water absorption Applications Electrical and electronic applications (EMC, solder resist, PCB) Potting and encapsulation materials Powder coatings for ship bottoms Adhesives Composites *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group


Mitsubishi Chemical Group
jER™ YX8040
Polymer Name: Epoxy Resins & Compounds
Function: Binder, Coupling Agent, Adhesion Promoter
Chemical Family: Epoxy & Epoxy Derivatives
Labeling Claims: High Purity
jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group


United Initiators
United Initiators MYPC
Chemical Name: Dimyristyl peroxydicarbonate
Function: Initiator, Curing, Crosslinking & Hardening Agent
CAS Number: 53220-22-7
Chemical Family: Carbonates, Peroxides, Enzymes
Processing Methods: Pultrusion
White, greasy flakes, consisting of technically pure Dimyristylperoxydicarbonate. This long-chained aliphatic peroxydicarbonate is used as an initiator (radical source) in the polymerisation of monomers, e.g. vinylchloride.


Mitsubishi Chemical Group
jER™ YX8800
Polymer Name: Epoxy Resins & Compounds
Function: Coupling Agent, Adhesion Promoter, Binder, Flame Retardant
Chemical Family: Epoxy & Epoxy Derivatives
Compatible Substrates & Surfaces: Glass, Ceramic, Aluminum, Fibers & Fabrics, Concrete & Masonry, Plastics, Metal, Steel
jER™ YX8800 is an anthracene-type epoxy resin with significantly low melt viscosity, high Tg and low-CTE. It can be used for electrical and electronic applications, carbon fiber reinforced polymers (CFRP) and other applications that require flame retardancy. jERTM YX8800 is an adduct formed from the reaction of epichlorohydrin and 1,4-dihydro-9,10-anthracenediol. Benefits High flame retardancy Well-balanced mechanical properies High electrical reliability Features Abrasion, heat and water resistance Electrical insulation Good thermal stability High glass tansition temperature Low CLTE Significantly low melt viscosity (melting point: 107°C) Low chroline content Applications Electrical and electronic applications (EMC, solder resist, PCB) Potting and encapsulation materials. Powder coatings Adhesives Composites *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group


Voelpker Spezialprodukte GmbH
WARADUR® E
Function: Mold Release Agent, Glossing Agent, Stabilizer, Dispersant, Melt Flow Agent, Dispersant & Wetting Agent, Emulsifier, Emulsion Stabilizer, Release Agent, Gloss Enhancer, Opacifier
Chemical Family: Waxes, Esters, Fatty Acids
Labeling Claims: Food Contact Acceptable, Non-Carcinogenic, Reprotoxic substance-free, Non-Mutagenic, Environmentally Friendly
Compatible Polymers & Resins: Polyamides, Polyethylene Terephthalate (PET), Thermoplastic Elastomers (TPE), Polypropylenes (PP), Polybutylene Terephthalate (PBT), Phenolic Resins, Polyvinyl Chloride (PVC), Polylactic Acid (PLA), Styrene Copolymers, Polyurethanes (PU), Epoxies (EP), Thermoplastic Polyurethane (TPU)
WARADUR® E is an ester wax consisting of esters of montanic acids with multihydroxyl alcohols. Montanic acids are straight-chained monocarboxylic acids with a chain length in the range of C28 – C32. The corresponding esters exhibit chain length in the range of C58 – C66 and provide this wax with a low volatility, good thermostability and low migration rates.


Arlon Electronic Materials
Arlon® 35N
Polymer Name: Polyimide (PI)
Function: Laminate, Prepreg
End Uses: PCB Materials
35N is a pure polyimide laminate and prepreg system for applications requiring high temperature performance. High Tg (250°C) results in low Z-direction expansion for resistance to PTH failure during PWB processing, and minimizes risk of latent PTH defects in-service. Reduced temperature and time to cure offers improved throughput compared to traditional polyimide cycles.


Diab
Divinycell® F50
Function: Core Material
Core Type: Thermoplastic Foam
Chemical Family: Sulfonates, Sulfonic Acids & Derivatives
Divinycell F50 foam is a recyclable, prepreg compatible sandwich core offering excellent Fire, Smoke and Toxicity (FST) properties, good mechanicals and processing characteristics. It meets the US and European regulatory requirements for commercial aircraft interiors. Other key features include vacuum bag processing up to 220°C and matched tooling and press processing up to 220°C, exceptional fatigue life, good chemical resistance and excellent heat ageing at 180°C. Divinycell F50 is compatible with most common aerospace composite manufacturing processes.


Mitsubishi Chemical Group
jER™ 1256
Polymer Name: Epoxy Resins & Compounds
Function: Coupling Agent, Plasticizer, Binder, Adhesion Promoter, Impact Modifier
Chemical Family: Epoxy & Epoxy Derivatives, Bisphenol A Type Epoxy
Compatible Substrates & Surfaces: Metal, Aluminum, Concrete & Masonry, Glass, Fibers & Fabrics, Plastics, Steel, Ceramic
jERTM 1256 is a solid epoxy resin produced from Bisphenol A epoxy resin. It is a polymer-type epoxy resin with epoxy functional group at the both ends. It can be used to add toughness, insulating and vapor barrier properties, and resistance to heat, water and chemicals in a variety of applications. FeaturesHigh molecular weightHigh softening pointsGood film formerHydrolysis resistanceFlexibilityStrong adhesionApplicationsPCM, CAN, and other coatingsPaintsFiber-reinforced materialsThermoplasticsPrinted electronicsPlastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group


Diab
Divinycell® PY105
Function: Core Material
Chemical Family: Polyethylene Terephthalate (PET)
Divinycell PY is Diab’s newest addition to the PET family. All our PET materials are recyclable and are excellent thermoplastic sandwich core materials. The material is suitable for a variety of processes including infusion, prepreg and press bonding. Divinycell PY provides high shear strain and a very low resin consumption. The core material has been desgned and developed to meet blade designs in an optimal manner.


Mitsubishi Chemical Group
jER™ YL983U
Polymer Name: Epoxy Resins & Compounds
Function: Coupling Agent, Binder, Adhesion Promoter
Chemical Family: Bisphenol Epoxy Resins, Bisphenol F Type Epoxy, Epoxy & Epoxy Derivatives
Compatible Substrates & Surfaces: Metal, Aluminum, Concrete & Masonry, Glass, Fibers & Fabrics, Steel, Plastics, Ceramic
jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Good elastic recovery Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Low viscosity Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group


Mitsubishi Chemical Group
jER™ YX7400N
Polymer Name: Epoxy Resins & Compounds
Function: Impact Modifier, Binder, Coupling Agent, Adhesion Promoter
Chemical Family: Epoxy & Epoxy Derivatives
jER™ YX7400N is an adduct formed from the reaction of epichlorohydrin and an aliphatic polyol.FeaturesAdduct formed from the reaction of epichlorohydrin and an aliphatic polyolExcellent elasticityImpact resistanceApplicationsConsumer appliances and electronicsElectrical devices, assemblies, parts and componentsElectronics adhesivesElectrical and electronic packaging and assemblySpecialty and conformal coatingsPotting compoundsPrinted circuit boards (PCBs)Semiconductor manufacturing*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group


IDI Composites International
IDI™ BMC 46-12
Function: Molding Compound
End Uses: Other End Uses
PRODUCT SERIES: 40 SERIES BMCPRODUCT DESCRIPTION: DIELECTRIC & FLAME RESISTANTElectrical applications requiring a composite material that possesses a UL Yellow card and flammability performance from UL94 HB, V-0 & 5VA. These materials can be found in Underwriters Laboratory file E53587.


Sika
Biresin® CR122
Chemical Family: Epoxy & Epoxy Derivatives
Processing Methods: Pultrusion, Filament Winding, Hand Lay-up
End Uses: Pipes & Liners, Tanks
Biresin® CR122 is a medium viscosity epoxy resin system suitable for the production of high performance fibre reinforced composites with a thermal performance up to 120°C.


GMS Composites
GMS Composites EP – 530
Polymer Name: Epoxy Resins & Compounds
Function: Prepreg
Processing Methods: Prepreg Processing
End Uses: Pipes & Liners, Tanks
GMS Composites EP – 530 is a flame retardant epoxy resin matrix prepreg with long shelf life. The product has a versatile curing cycle from as low as 80°C or as high as 150°C, thus enabling the product to be used to produce a wide range of composite items, from large structures to numerous small components. EP-530 is available in a range of substrates such as carbon, glass or aramid. The product is self-extinguishing and meets the UL 94 V-0 classification. The flow and tack of EP-530 can also be varied.


Diab
Divinycell® H100
Function: Core Material
Divinycell H provides excellent mechanical properties to low weight. The unique IPN chemical structure, yields impressive mechanical performance to a low weight. Divinycell H has been widely used and has a proven track record in virtually every application area where sandwich composites are employed including the marine (leisure, military and commercial), land transportation, wind energy, civil engineering/infrastructure and general industrial markets. Divinycell H is ideal for applications subject to fatigue, slamming or impact loads. Other key features of Divinycell H include consistent high quality, excellent adhesion/peel strength, excellent chemical resistance, low water absorption and good thermal/acoustic insulation. Divinycell H is compatible with virtually all commonly used resin and manufacturing systems.


Sika
Biresin® CR80
Chemical Family: Epoxy & Epoxy Derivatives
Processing Methods: Resin Transfer Molding (RTM), Hand Lay-up, Reinforced Reaction Injection Molding (RRIM), Vacuum Infusion Processing (VIP)
End Uses: Tanks, Pipes & Liners, Wind Turbine Blades
Biresin® CR80 is a low viscosity epoxy resin system suitable for the production of high performance fibre reinforced composites parts and moulds with thermal properties up to 80°C.


Arlon Electronic Materials
Arlon® 85N
Polymer Name: Polyimide (PI)
Function: Prepreg, Laminate
85N is the ultimate polyimide and laminate prepreg system fo PWB's requiring resistance to high temperature, both in process and in end-use applications. Bromine-free chemistry provides Bestin-Class thermal stability for applications with sustained high in-use temperatures as well as for use in lead-free soldering applications.


Cosmic Plastics
Cosmic™ DAP D72/6120F
Function: Molding Compound
Reinforcement Material: Glass Fibers
Processing Methods: Resin Transfer Molding (RTM), Compression Molding, Injection Molding
End Uses: Insulators
Cosmic D72 is a short glass fiber filled, flame retardant, general purpose diiallyl ortho phthalate molding compound which is supplied in a free flowing granular form. It can be easily molded in compression, transfer, or injection equipment and can be readily preformed. It has passed NASA outgassing tests. FEATURES: D72 has a high dielectric strength, low dissipation factor along with excellent flexural and tensile strength. APPLICATIONS: Switches, terminals, insulators, cups, cases and other applications requiring flame resistance and strength. Also useful for encapsulation of electrical and electronic components. Suitable for thin-walled parts.


Polynt Group
POLYCOR® ISO BR WHITE 9199
Chemical Family: Isophthalics
Function: Surface Finishes
Color: Off White, Transparent, Custom, White
Features: Good Mechanical Properties, Improved Mechanical Properties, Other Composite Materials Features
POLYCOR® ISO BR WHITE 9199 - A pre-accelerated gel coat based on Isophthalic unsaturated polyester resin. It is cured using MEKP peroxide.This gel coat is formulated to meet the rigid requirements of transportation,boating and sanitary applications.


Diab
Divinycell® HCP30
Function: Core Material
Divinycell HCP grade meets the demand for a high performance, low density buoyancy material with excellent characteristics. It is widely used in submarines, subsea buoyancy units, ROVs, diving bells and impact protection structures. As a result of its excellent hydraulic compressive properties and closed cell structure, it has very low buoyancy loss and water absorption under long-term loading conditions. HCP stands for Hydraulic Crush Point and is defined as the point of pressure in Bar, where the material when subjected to an increasing pressure of 1-2 Bar/sec has lost 5% of its initial volume. The design of subsea buoyancy applications is complex and consideration has to be given to the required buoyancy loss and updrift over the expected lifetime and service conditions, with respect to long and short term hydraulic compressive creep, water absorption and hydraulic fatigue. Please contact Diab Technical Services for design proposal.


Composites Evolution Ltd
Evopreg® PFC502
Polymer Name: Polyfurfuryl Alcohol
Function: Prepreg
Reinforcement Material: Aramid (Kevlar), Glass Fibers, Carbon Fibers, Flax Fibers
Processing Methods: Compression Molding, Vacuum Bagging, Prepreg Processing
Evopreg® PFC502 prepregs are a range of fire-retardant, pre-impregnated composite materialsbased on a PFA (Polyfurfuryl Alcohol) bioresin. PFA is a thermosetting bioresin derived from crop waste and is similar to phenolic resin but withlower toxicity and VOC emissions. In addition to its environmental credentials, PFA hasoutstanding fire retardant properties, plus excellent temperature and chemical resistance. The prepregs can be supplied with a range of reinforcement fibers and fabric constructions,including woven and unidirectional E-glass fiber and carbon fiber. They can be consolidated byvacuum bagging, autoclave or press molding and are designed for applications includingaircraft interiors, rail interiors, marine, offshore and construction.


Toray
Toray MicroPly™ TCF4045
Function: Core Material
Core Type: Thermoset Foam
Chemical Family: Epoxy & Epoxy Derivatives
Toray MicroPly™ TCF4045 is a low dielectric, low density epoxy syntactic film. The material displays both good mechanical and dielectric properties. Toray MicroPly™ TCF4045’s base resin chemistry features low moisture absorption with good high temperature properties. 177°C (350°F) Cure, Low Dielectric Epoxy Syntactic Film


Diab
Divinycell® HCP70
Function: Core Material
Divinycell HCP grade meets the demand for a high performance, low density buoyancy material with excellent characteristics. It is widely used in submarines, subsea buoyancy units, ROVs, diving bells and impact protection structures. As a result of its excellent hydraulic compressive properties and closed cell structure, it has very low buoyancy loss and water absorption under long-term loading conditions. HCP stands for Hydraulic Crush Point and is defined as the point of pressure in Bar, where the material when subjected to an increasing pressure of 1-2 Bar/sec has lost 5% of its initial volume. The design of subsea buoyancy applications is complex and consideration has to be given to the required buoyancy loss and updrift over the expected lifetime and service conditions, with respect to long and short term hydraulic compressive creep, water absorption and hydraulic fatigue. Please contact Diab Technical Services for design proposal.


Quantum Composites
Lytex® 9063-E
Function: Molding Compound
Chemical Family: Epoxy & Epoxy Derivatives
Reinforcement Material: Glass Fibers
Processing Methods: Compression Molding
Lytex® 9063-E is an epoxy high performance, fiberglass reinforced ESC® molding compound designed for military and aerospace structural applications requiring excellent mechanical properties, retention of properties at elevated temperatures, good chemical resistance and excellent electrical properties. It meets the requirements of MIL-M-46069 and MIL-M-46892.


Scott Bader
Crestapol® 1080 Urethane Acrylate Resin
Chemical Family: Styrenics, Acrylics, Acrylates & Methacrylates, Urethanes
End Uses: Pipes & Liners, Tanks
Crestapol® 1080 Urethane Acrylate Resin is an exceptionally tough, flexible, unsaturated urethane acrylate in styrene monomer with a very high elongation. It is used to blend with other polyester and vinylester resins to create a much tougher resin formulation. Addition levels with other resin systems are typically in the region of 5-20%. Crestapol 1080 has been used in military applications, marine, tooling and many building projects requiring exceptional toughness.


Hexcel
HexFlow® VRM37
Chemical Family: Epoxy & Epoxy Derivatives
Processing Methods: Resin Transfer Molding (RTM)
HexFlow® VRM37 is a 350°F curing, two-part, mid-toughened epoxy resin, specifically developed to meet the demanding requirements of structural aerospace resin transfer molding (RTM) and vacuum assisted resin transfer molding (VARTM) applications. This epoxy system supports service temperatures up to 250°F. HexFlow® VRM37 Part A is a light amber color; HexFlow® VRM37 Part B is a dark purple color.


Menzolit Ltd.
Menzolit® SMC 2300
Function: Molding Compound
Chemical Family: Polyesters
Reinforcement Material: Glass Fibers
Processing Methods: Compression Molding
menzolit® SMC 2300 is a sheet moulding compound based on unsaturated polyester resin. The product is glass fibre reinforced and contains mineral fillers. In case of fire the product doesn’t melt, neither does it form droplets nor is smoke generation excessive. The material is compression moulded in heated steel moulds. It is recommended to work with chrome plated tools. The product contains no halogens or heavy metals nor any candidates from the REACH SVHC list.