Mitsubishi Chemical
jERโข YX7105
Brand: jER
Applications: Appliances & Electronics, Conformal Coatings, Consumer Electronics
Product Families: Epoxies, Thermoset Resins
Chemical Family: Epoxy & Epoxy Derivatives
Polymer Name: Epoxy Resins & Compounds
jERโข YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for printed electronics and wearable devices to avoid bending and warpage. YX7105 also has strong resistant to thermal decomposition and strong adhesion property, so it is an ideal material for adhesives and coating in semiconductor and printed electronics application. Application of YX7105 ใปCoating and Paints ใปGiving toughness and impact strength ใปAdhesives ใปIncreasing adhesiveness ใปFilm/Sheet ใปGiving flexibility and strechability ใปSemiconductor (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP) ใปIncreasing resistant to mechanical pressure (thermal decomposition, bending/warpage) ใปPrinted Electronics ใปDry film, adhesive for triple-layer FPC, and adhesion promotor for FR4 & FR5
Mitsubishi Chemical
jERโข YX8000D
Brand: jER
Applications: Appliances & Electronics, LEDs, Packaging & Assembly Materials
Product Families: Epoxies, Thermoset Resins
Chemical Family: Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol A Type Epoxy
Polymer Name: Epoxy Resins & Compounds
End Uses: Radiation Curable Coating
jERโข YX8000D is a hydrogenated bisphenol A type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. Its excellent transparency and better adhesiveness are suitable for wide variety of optical adhesives and encapsulants. This grade has higher photocure reaction rate, contributing your photocuring process to be more efficient compared to conventional cycloaliphatic epoxy resins. Application of YX8000D ใปLED/OLED encapsulant, LED reflector br/>ใปAchieve high transparency formulation br/> ใปAdhesives for optical devices (electro-optic assemblies, and laser components) br/>ใปImproving UV resistant ใปIncreasing adhesiveness br/> ใปPhotocure process application (UV/LED) br/>ใปAccelerate photo cure rate br/>
INVISTA
Dytekยฎ DCH-99
Brand: Dytek
Applications: Equipment & Parts, Textile Manufacturing, Water Treatment
Product Families: Other Resins & Binders, Catalysts & Initiators, Surface Protective Additives
Chemical Family: Diamines
End Uses: Tanks, Pipes & Liners, Pump Parts
DYTEKยฎ DCH-99 (1,2-diamainecyclohexane) is a cyclic aliphatic diamine made of 100% reclaimed material that is used primarily in epoxy coatings and composites. It provides chemical resistance over a broad range of chemicals, which makes it a superior choice for industrial and marine coatings. Other applications include mining, oil & gas, and pharmaceutical intermediates.
Mitsubishi Chemical
jERโข 4250
Brand: jER
Applications: Appliances & Electronics, Conformal Coatings, Electronics Adhesives
Product Families: Epoxies, Thermoset Resins
Chemical Family: Epoxy & Epoxy Derivatives
Polymer Name: Epoxy Resins & Compounds
jERโข 4250 is a polymer type epoxy resin with epoxy functional group at the both ends. It is bisphenol A / bisphenol F hybrid type of epoxy resin and more flexible than conventional polymer type epoxy resin. Its high molecular weight and high softening points work for improving toughness, insulating, vapor barrier propetiesand heat/water/chemicals resistance to products of various apprications like; ใปCoating and Paints ใImproving paintability and coatability ใปCFRP ใImproving toughness and flexibility ใViscosity adjustment ใปFilm/Sheet ใImproving formability ใปThermoplastic Modifier(Polyester, PPS etc) ใImproving hydrolysis resistance, adhesiveness, and insulating ใปPrinted Electronics ใDry film, adhesive for triple-layer FPC, and adhesion promotor for FR4&FR5
Mitsubishi Chemical
jERโข YL980
Brand: jER
Applications: Appliances & Electronics, Potting Compounds, Other Packaging & Assembly Applications
Product Families: Epoxies, Thermoset Resins
Chemical Family: Bisphenol Epoxy Resins, Bisphenol A Type Epoxy, Epoxy & Epoxy Derivatives
Polymer Name: Epoxy Resins & Compounds
jERโข YL980 is is a Bisphenol A type liquid epoxy resin with significantly low chlorine content. Moreover, chlorine in the molecular skeleton is difficult to detach by hydrolysis. So it is ideal for electrical and electronic applications which is hesitate to metal corrosion by chlorine. ใปSemiconductor (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP) ใAchieve high filler content formulation ใIncreasing adhesiveness ใKeeping high electrical reliability because of low chlorine ใปAdhesive for electrical and electronic applications ใIncreasing adhesiveness ใKeepimg high electrical reliability because of low chlorine
Mitsubishi Chemical
jERโข YX7110
Brand: jER
Applications: Appliances & Electronics, Conformal Coatings, Consumer Electronics
Product Families: Epoxies, Thermoset Resins
Chemical Family: Epoxy & Epoxy Derivatives
Polymer Name: Epoxy Resins & Compounds
jERโข YX7110 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol.
Mitsubishi Chemical
jERโข YX4000
Brand: jER
Applications: Appliances & Electronics, Conformal Coatings, Consumer Electronics
Product Families: Epoxies, Thermoset Resins
Chemical Family: Epoxy & Epoxy Derivatives
Polymer Name: Epoxy Resins & Compounds
End Uses: Powder Coating
jERโข YX4000 is a biphenol type solid epoxy resin with significantly low melt viscosity, low water absorption and good balance between adhesiveness and rigidity against stress. These properties are suitable for Electrical and electronic applications. ใปElectrical and electronic applications(EMC, solder resist, PCB, etc.) ใAchieve well-balanced mechanical property required for electrical and electronic applications with high electrical reliability ใAchieve high filler content formulation ใAchieve high flowability formulation ใปPowder coating for ship bottom ใImproving chemical resistance ใปCFRP
Mitsubishi Chemical
jERโข YX8040
Brand: jER
Applications: Appliances & Electronics, LEDs, Packaging & Assembly Materials
Product Families: Epoxies, Thermoset Resins
Chemical Family: Epoxy & Epoxy Derivatives
Polymer Name: Epoxy Resins & Compounds
jERโข YX8040 is a hydrogenated bisphenol A type solid epoxy resin, with high molecular weight.
United Initiators
United Initiators MYPC
Applications: Equipment & Parts, Roof Shingles & Tiles, Pavement, Highways, Roads & Bridges
Product Families: Catalysts, Initiators & Crosslinkers, Initiators, Promotors & Catalysts
Chemical Family: Peroxides, Carbonates
End Uses: Tanks, Pipes & Liners
White, greasy flakes, consisting of technically pure Dimyristylperoxydicarbonate. This long-chained aliphatic peroxydicarbonate is used as an initiator (radical source) in the polymerisation of monomers, e.g. vinylchloride.
Mitsubishi Chemical
jERโข YX8800
Brand: jER
Applications: LEDs, Appliances & Electronics, Conformal Coatings
Product Families: Epoxies, Thermoset Resins
Chemical Family: Epoxy & Epoxy Derivatives
Polymer Name: Epoxy Resins & Compounds
End Uses: Powder Coating
jERโข YX8800 is an anthracene type epoxy resin withใwith significantly low melt viscosity, high Tg and Low-CTE. It also has high flame retardancy by forming carbonized layer when it's burning. So it's suitable for Electrical and electronic applications, CFRP and some applications which is requirede flame retardancy. ใปElectrical and electronic applications(EMC, solder resist, PCB, etc.) ใAchieve well-balanced mechanical property required for electrical and electronic applications with high electrical reliability ใAchieve high filler content formulation ใAchieve high flowability formulation ใInproving flame retardancy ใปCFRP ใImproving toughness and flexibility ใInproving flame retardancy
Arlon Electronic Materials
Arlonยฎ 35N
Brand: Arlon
Applications: Other Industrial Applications, Aerospace & Aviation, Other Automotive Applications
Product Families: Laminates, Thermoset Prepregs
Chemical Family: Polyimides (PI)
Polymer Name: Polyimide (PI)
End Uses: PCB Materials
35N is a pure polyimide laminate and prepreg system for applications requiring high temperature performance. High Tg (250ยฐC) results in low Z-direction expansion for resistance to PTH failure during PWB processing, and minimizes risk of latent PTH defects in-service. Reduced temperature and time to cure offers improved throughput compared to traditional polyimide cycles.
Diab
Divinycellยฎ F50
Brand: Divinycell
Applications: Aerospace & Aviation, Exterior & Body
Product Families: Foam Cores
Chemical Family: Sulfonic Acids & Derivatives, Sulfonates
Divinycell F50 foam is a recyclable, prepreg compatible sandwich core offering excellent Fire, Smoke and Toxicity (FST) properties, good mechanicals and processing characteristics. It meets the US and European regulatory requirements for commercial aircraft interiors. Other key features include vacuum bag processing up to 220ยฐC and matched tooling and press processing up to 220ยฐC, exceptional fatigue life, good chemical resistance and excellent heat ageing at 180ยฐC. Divinycell F50 is compatible with most common aerospace composite manufacturing processes.
Mitsubishi Chemical
jERโข 1256
Brand: jER
Applications: Can Coatings, Appliances & Electronics, Conformal Coatings
Product Families: Surface Modifiers, Epoxies, Processing Aids
Chemical Family: Bisphenol A Type Epoxy, Epoxy & Epoxy Derivatives
Polymer Name: Epoxy Resins & Compounds
jERโข 1256 is a polymer type epoxy resin with epoxy functional group at the both ends. Its high molecular weight and high softening points work for improving toughness, insulating, vapor barrier properties, and heat/water/chemicals resistance to products of various applications like;ใปCoating and PaintsใปImproving paintability and coatabilityใปCFRPใปImproving toughness and flexibilityใปViscosity adjustmentใปFilm/SheetใปImproving formabilityใปThermoplastic Modifier(Polyester, PPS etc.)ใปImproving hydrolysis resistance, adhesiveness, and insulating ใปPrinted ElectronicsใปDry film, adhesive for triple-layer FPC, and adhesion promotor for FR4&FR5
Diab
Divinycellยฎ PY105
Brand: Divinycell
Applications: Renewable Energy
Product Families: Foam Cores
Chemical Family: Polyethylene Terephthalate (PET)
Divinycell PY is Diabโs newest addition to the PET family. All our PET materials are recyclable and are excellent thermoplastic sandwich core materials. The material is suitable for a variety of processes including infusion, prepreg and press bonding. Divinycell PY provides high shear strain and a very low resin consumption. The core material has been desgned and developed to meet blade designs in an optimal manner.
Mitsubishi Chemical
jERโข YL983U
Brand: jER
Applications: Appliances & Electronics, Potting Compounds, Other Packaging & Assembly Applications
Product Families: Epoxies, Thermoset Resins
Chemical Family: Bisphenol Epoxy Resins, Bisphenol F Type Epoxy, Epoxy & Epoxy Derivatives
Polymer Name: Epoxy Resins & Compounds
jERโข YL983 is a bisphenol F type liquid epoxy resin with significantly low chorine content and low viscosity. Moreover, chlorine in the molecular skeleton of this product is difficult to detach by hydrolysis. So it is ideal for electrical and electronic applications which is hesitate to metal corrosion by chlorine. ใปSemiconductor (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP) ใAchieve high filler content formulation ใAchieve high flowabilty formulation ใIncreasing adhesiveness ใKeeping high electrical reliability because of low chlolrine ใ ใปAdhesive for electrical and electronic applications ใIncreasing adhesiveness ใKeeping high electrical reliability because of low chlolrine
Mitsubishi Chemical
jERโข YX7400N
Brand: jER
Applications: Appliances & Electronics, Conformal Coatings, Printed Circuit Boards (PCBs)
Product Families: Epoxies, Thermoset Resins
Chemical Family: Epoxy & Epoxy Derivatives
Polymer Name: Epoxy Resins & Compounds
jERโข YX7400N is an adduct formed from the reaction of epichlorohydrin and an aliphatic polyol.
IDI Composites International
IDIโข BMC 46-12
Brand: IDI
Applications: Other Devices & Assemblies
Product Families: Bulk Molding Compounds (BMC)
End Uses: Other End Uses
PRODUCT SERIES: 40 SERIES BMCPRODUCT DESCRIPTION: DIELECTRIC & FLAME RESISTANTElectrical applications requiring a composite material that possesses a UL Yellow card and flammability performance from UL94 HB, V-0 & 5VA. These materials can be found in Underwriters Laboratory file E53587.
Sika
Biresinยฎ CR122
Brand: Biresin
Applications: Equipment & Parts, Tooling & Moldmaking, Pipes & Tanks
Product Families: Thermoset Resins
Chemical Family: Epoxy & Epoxy Derivatives
End Uses: Tanks, Pipes & Liners
Biresinยฎ CR122 is a medium viscosity epoxy resin system suitable for the production of high performance fibre reinforced composites with a thermal performance up to 120ยฐC.
Sika
Biresinยฎ CR80
Brand: Biresin
Applications: Equipment & Parts, Pipes & Tanks, Marine
Product Families: Thermoset Resins
Chemical Family: Epoxy & Epoxy Derivatives
End Uses: Tanks, Pipes & Liners, Wind Turbine Blades
Biresinยฎ CR80 is a low viscosity epoxy resin system suitable for the production of high performance fibre reinforced composites parts and moulds with thermal properties up to 80ยฐC.
GMS Composites
GMS Composites EP โ 530
Applications: Equipment & Parts, Renewable Energy, Pipes & Tanks
Product Families: Thermoset Prepregs
Chemical Family: Epoxy & Epoxy Derivatives
Polymer Name: Epoxy Resins & Compounds
End Uses: Tanks, Pipes & Liners
GMS Composites EP-530 is a flame retardant epoxy resin matrix prepreg with long shelf life. The product has a versatile curing cycle from as low as 80ยฐC or as high as 150ยฐC, thus enabling the product to be used to produce a wide range of composite items, from large structures to numerous small components. EP-530 is available in a range of substrates such as carbon, glass or aramid. The product is self-extinguishing and meets the UL 94 V-0 classification. The flow and tack of EP-530 can also be varied.
Diab
Divinycellยฎ H100
Brand: Divinycell
Applications: Pavement, Highways, Roads & Bridges, Renewable Energy, Structural Components
Product Families: Foam Cores
End Uses: Structural Components
Divinycell H provides excellent mechanical properties to low weight. The unique IPN chemical structure, yields impressive mechanical performance to a low weight. Divinycell H has been widely used and has a proven track record in virtually every application area where sandwich composites are employed including the marine (leisure, military and commercial), land transportation, wind energy, civil engineering/infrastructure and general industrial markets. Divinycell H is ideal for applications subject to fatigue, slamming or impact loads. Other key features of Divinycell H include consistent high quality, excellent adhesion/peel strength, excellent chemical resistance, low water absorption and good thermal/acoustic insulation. Divinycell H is compatible with virtually all commonly used resin and manufacturing systems.
Arlon Electronic Materials
Arlonยฎ 85N
Brand: Arlon
Applications: Other Industrial Applications, Other Devices & Assemblies, Printed Circuit Boards (PCBs)
Product Families: Laminates, Thermoset Prepregs
Chemical Family: Polyimides (PI)
Polymer Name: Polyimide (PI)
85N is the ultimate polyimide and laminate prepreg system fo PWB's requiring resistance to high temperature, both in process and in end-use applications. Bromine-free chemistry provides Bestin-Class thermal stability for applications with sustained high in-use temperatures as well as for use in lead-free soldering applications.
Cosmic Plastics
Cosmicโข DAP D72/6120F
Brand: Cosmic
Applications: Housings & Enclosures, Switches & Relays, Other Devices & Assemblies
Product Families: Other Prepregs & Molding Compounds
Chemical Family: Phthalates
End Uses: Insulators
Cosmic D72 is a short glass fiber filled, flame retardant, general purpose diiallyl ortho phthalate molding compound which is supplied in a free flowing granular form. It can be easily molded in compression, transfer, or injection equipment and can be readily preformed. It has passed NASA outgassing tests. FEATURES: D72 has a high dielectric strength, low dissipation factor along with excellent flexural and tensile strength. APPLICATIONS: Switches, terminals, insulators, cups, cases and other applications requiring flame resistance and strength. Also useful for encapsulation of electrical and electronic components. Suitable for thin-walled parts.
Polynt Group
NORSODYNEยฎ C 55377 AL
Brand: NORSODYNE
Applications: Roof Shingles & Tiles, Pavement, Highways, Roads & Bridges, Parking Structures & Stadiums
Product Families: Thermoset Resins
Chemical Family: Polyesters, Unsaturated Polyester (UPE)
NORSODYNEยฎ C 55377 AL - Unsaturated polyester resin in styrene,Isophthalic-Neopentylic. It is used to produce agglomerated and engineered stones through casting method.
Diab
Divinycellยฎ HCP30
Brand: Divinycell
Applications: Marine
Product Families: Foam Cores
Divinycell HCP grade meets the demand for a high performance, low density buoyancy material with excellent characteristics. It is widely used in submarines, subsea buoyancy units, ROVs, diving bells and impact protection structures. As a result of its excellent hydraulic compressive properties and closed cell structure, it has very low buoyancy loss and water absorption under long-term loading conditions. HCP stands for Hydraulic Crush Point and is defined as the point of pressure in Bar, where the material when subjected to an increasing pressure of 1-2 Bar/sec has lost 5% of its initial volume. The design of subsea buoyancy applications is complex and consideration has to be given to the required buoyancy loss and updrift over the expected lifetime and service conditions, with respect to long and short term hydraulic compressive creep, water absorption and hydraulic fatigue. Please contact Diab Technical Services for design proposal.
Polynt Group
POLYCORยฎ ISO BR WHITE 9199
Brand: POLYCOR
Applications: Roof Shingles & Tiles, Pavement, Highways, Roads & Bridges, Parking Structures & Stadiums
Product Families: Gelcoats & Topcoats
Chemical Family: Isophthalics
POLYCORยฎ ISO BR WHITE 9199 - A pre-accelerated gel coat based on Isophthalic unsaturated polyester resin. It is cured using MEKP peroxide.This gel coat is formulated to meet the rigid requirements of transportation,boating and sanitary applications.
Quantum Composites
Lytexยฎ 9063-E
Brand: Lytex
Applications: Refining & Gas Processing, Medical Devices & Assemblies, Implants & Prosthetics
Product Families: Sheet Molding Compounds (SMC)
Chemical Family: Epoxy & Epoxy Derivatives
LYTEXยฎ 9063 BK-E is an epoxy high performance, fiberglass reinforced ESCยฎ molding compound designed for military and aerospace structural applications requiring excellent mechanical properties, retention of properties at elevated temperatures, good chemical resistance and excellent electrical properties. It meets the requirements of MIL-M-46069 and MIL-M-46892.
Toray
Toray MicroPlyโข TCF4045
Brand: Toray MicroPly
Applications: Aerospace & Aviation
Product Families: Foam Cores
Chemical Family: Epoxy & Epoxy Derivatives
Toray MicroPlyโข TCF4045 is a low dielectric, low density epoxy syntactic film. The material displays both good mechanical and dielectric properties. Toray MicroPlyโข TCF4045โs base resin chemistry features low moisture absorption with good high temperature properties. 177ยฐC (350ยฐF) Cure, Low Dielectric Epoxy Syntactic Film
Diab
Divinycellยฎ HCP70
Brand: Divinycell
Applications: Marine
Product Families: Foam Cores
Divinycell HCP grade meets the demand for a high performance, low density buoyancy material with excellent characteristics. It is widely used in submarines, subsea buoyancy units, ROVs, diving bells and impact protection structures. As a result of its excellent hydraulic compressive properties and closed cell structure, it has very low buoyancy loss and water absorption under long-term loading conditions. HCP stands for Hydraulic Crush Point and is defined as the point of pressure in Bar, where the material when subjected to an increasing pressure of 1-2 Bar/sec has lost 5% of its initial volume. The design of subsea buoyancy applications is complex and consideration has to be given to the required buoyancy loss and updrift over the expected lifetime and service conditions, with respect to long and short term hydraulic compressive creep, water absorption and hydraulic fatigue. Please contact Diab Technical Services for design proposal.
Scott Bader
Crestapolยฎ 1080 Urethane Acrylate Resin
Brand: Crestapol
Applications: Equipment & Parts, Pipes & Tanks, Pipes & Plumbing
Product Families: Thermoset Resins
Chemical Family: Styrenics, Urethanes, Acrylics, Acrylates & Methacrylates
End Uses: Tanks, Pipes & Liners
Crestapolยฎ 1080 Urethane Acrylate Resin is an exceptionally tough, flexible, unsaturated urethane acrylate in styrene monomer with a very high elongation. It is used to blend with other polyester and vinylester resins to create a much tougher resin formulation. Addition levels with other resin systems are typically in the region of 5-20%. Crestapol 1080 has been used in military applications, marine, tooling and many building projects requiring exceptional toughness.
3A Core Materials
BALTEKยฎ SBC.80
Brand: BALTEK
Applications: Equipment & Parts, Interior, Exterior & Body
Product Families: Wood Cores
End Uses: Tanks, Pipes & Liners
BALTEKยฎ SBC is a core material produced from controlled kilndried balsa wood in the โend-grainโ configuration with physical time to kiln control. 3A Composites Core Materials owns and manages several thousand hectares of FSCยฎ-certified balsa wood plantations. Its cultivation from seedling to the tree ensures sustainable forest management and strict traceability. Documented and controlled time to kiln-drying makes SBC ideal for vacuum infusion. Own plantations enable 3A Composites to provide a continuous supply to industrial customers. BALTEKยฎ SBC has exceptionally high strength and stiffness to weight ratios and achieves an excellent bond with all types of resins. It is an ideal core material for an extensive range of applications. All while being a renewable resource.
IDI Composites International
IDIโข SMC E-206
Brand: IDI
Applications: Other Devices & Assemblies
Product Families: Sheet Molding Compounds (SMC)
End Uses: Other End Uses
PRODUCT SERIES: E200 SERIES SMCPRODUCT DESCRIPTION: UL YELLOW CARD SMCElectrical applications requiring a composite material that possesses a UL Yellow card and flammability performance from UL94 HB, V-0 & 5VA. These materials can be found in Underwriters Laboratory file E53587.
Hexcel
Hexcel F161
Applications: Structural Components, Exterior & Body
Product Families: Thermoset Prepregs
Chemical Family: Epoxy & Epoxy Derivatives
Polymer Name: Epoxy Resins & Compounds
F161 is a structural, heat resistant and electrical grade epoxy formulation designed for autoclave curing. F161 is a high temperature, laminate grade epoxy resin with a 350ยฐF (177ยฐC) cure. F161 is unique in that it was the first resin system to meet all types and classes of MIL-R-9300 B.
Hexcel
HexFlowยฎ VRM37
Brand: HexFlow
Applications: Aerospace & Aviation
Product Families: Thermoset Resins
Chemical Family: Epoxy & Epoxy Derivatives
HexFlowยฎ VRM37 is a 350ยฐF curing, two-part, mid-toughened epoxy resin, specifically developed to meet the demanding requirements of structural aerospace resin transfer molding (RTM) and vacuum assisted resin transfer molding (VARTM) applications. This epoxy system supports service temperatures up to 250ยฐF. HexFlowยฎ VRM37 Part A is a light amber color; HexFlowยฎ VRM37 Part B is a dark purple color.
