jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. jERTM YX7105 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol. Features Excellent adhesion Good toughness Good mechanical, impact and crack resistance Excellent elasticity and flexibility Applications Printed electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board) Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP) Base film and sheet for wearable devices Coatings Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group

Mitsubishi Chemical Group

jER™ YX8000D

Polymer Name: Epoxy Resins & Compounds

Function: Coupling Agent, Binder, Adhesion Promoter

Chemical Family: Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol A Type Epoxy

Compatible Substrates & Surfaces: Metal, Aluminum, Concrete & Masonry, Glass, Fibers & Fabrics, Plastics, Steel, Ceramic

jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group

INVISTA

Dytek® DCH-99

Chemical Name: 1,2-Diaminocyclohexane

Function: Chelating Agent, Catalyst, Corrosion Inhibitor, Chain Extender, Curing, Crosslinking & Hardening

CAS Number: 694-83-7

Chemical Family: Diamines

DYTEK® DCH-99 (1,2-diamainecyclohexane) is a cyclic aliphatic diamine made of 100% reclaimed material that is used primarily in epoxy coatings and composites. It provides chemical resistance over a broad range of chemicals, which makes it a superior choice for industrial and marine coatings. Other applications include mining, oil & gas, and pharmaceutical intermediates.

Mitsubishi Chemical Group

jER™ 4250

Polymer Name: Epoxy Resins & Compounds

Function: Coupling Agent, Plasticizer, Binder, Adhesion Promoter, Impact Modifier

Chemical Family: Epoxy & Epoxy Derivatives

Compatible Substrates & Surfaces: Metal, Aluminum, Concrete & Masonry, Glass, Fibers & Fabrics, Steel, Plastics, Ceramic

jER™ 4250 is a hybrid bisphenol A/bisphenol F-type epoxy resin that is more flexible than conventional polymer-type epoxy resins. It can be used as an additive to add toughness, insulating and vapor barrier properties and resistance to heat, water and chemicals to a variety of applications. Features Polymer-type epoxy resin with epoxy functional groups at the both ends High molecular weight High softening points Good adhesion Applications PCM, CAN and other coatings Paint Thermoplastics Printed electronics Plastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group

Mitsubishi Chemical Group

jER™ YL980

Polymer Name: Epoxy Resins & Compounds

Function: Coupling Agent, Binder, Adhesion Promoter

Chemical Family: Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol A Type Epoxy

Compatible Substrates & Surfaces: Metal, Aluminum, Concrete & Masonry, Glass, Fibers & Fabrics, Steel, Plastics, Ceramic

jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on).BenefitsExcellent adhesivenessMaintains high electrical reliability FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)ApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group

Mitsubishi Chemical Group

jER™ YX7110

Polymer Name: Epoxy Resins & Compounds

Function: Impact Modifier, Binder, Coupling Agent, Adhesion Promoter

Chemical Family: Epoxy & Epoxy Derivatives

jER™ YX7110 is a tough and flexible liquid-type epoxy resin. It can be used as an impact modifier for brittle materials, as an additive to increase impact resistance, and for stress relaxation to avoid cracking and warpage. jERTM YX7110 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol. Features Adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol Crack and impact resistance Excellent flexibility and elasticity High viscosity Low warpage Maintains flexibility even after full-curing Applications Coatings Adhesives Composites Potting and encapsulation materials Base film/sheet for wearable devices *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group

Mitsubishi Chemical Group

jER™ YX4000

Polymer Name: Epoxy Resins & Compounds

Function: Coupling Agent, Adhesion Promoter, Binder

Chemical Family: Epoxy & Epoxy Derivatives

Compatible Substrates & Surfaces: Glass, Ceramic, Aluminum, Fibers & Fabrics, Concrete & Masonry, Plastics, Metal, Steel

jER™ YX4000 is a biphenol-type solid epoxy resin with significantly low melt viscosity, low water absorption and a good balance between adhesiveness and rigidity against stress. It can be used for electrical and electronic applications. jERTM YX4000 is an adduct formed from the reaction of epichlorohydrin and tetramethylbiphenol Features Abrasion, heat and water resistance Electrical insulation Wear resistance Product Highlights Significantly low melt viscosity (melting point: 108°C) Low chroline content Low water absorption Applications Electrical and electronic applications (EMC, solder resist, PCB) Potting and encapsulation materials Powder coatings for ship bottoms Adhesives Composites *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group

Mitsubishi Chemical Group

jER™ YX8040

Polymer Name: Epoxy Resins & Compounds

Function: Binder, Coupling Agent, Adhesion Promoter

Chemical Family: Epoxy & Epoxy Derivatives

Labeling Claims: High Purity

jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group

United Initiators

United Initiators MYPC

Chemical Name: Dimyristyl peroxydicarbonate

Function: Initiator, Curing, Crosslinking & Hardening Agent

CAS Number: 53220-22-7

Chemical Family: Carbonates, Peroxides, Enzymes

Processing Methods: Pultrusion

White, greasy flakes, consisting of technically pure Dimyristylperoxydicarbonate. This long-chained aliphatic peroxydicarbonate is used as an initiator (radical source) in the polymerisation of monomers, e.g. vinylchloride.

Mitsubishi Chemical Group

jER™ YX8800

Polymer Name: Epoxy Resins & Compounds

Function: Coupling Agent, Adhesion Promoter, Binder, Flame Retardant

Chemical Family: Epoxy & Epoxy Derivatives

Compatible Substrates & Surfaces: Glass, Ceramic, Aluminum, Fibers & Fabrics, Concrete & Masonry, Plastics, Metal, Steel

jER™ YX8800 is an anthracene-type epoxy resin with significantly low melt viscosity, high Tg and low-CTE. It can be used for electrical and electronic applications, carbon fiber reinforced polymers (CFRP) and other applications that require flame retardancy. jERTM YX8800 is an adduct formed from the reaction of epichlorohydrin and 1,4-dihydro-9,10-anthracenediol. Benefits High flame retardancy Well-balanced mechanical properies High electrical reliability Features Abrasion, heat and water resistance Electrical insulation Good thermal stability High glass tansition temperature Low CLTE Significantly low melt viscosity (melting point: 107°C) Low chroline content Applications Electrical and electronic applications (EMC, solder resist, PCB) Potting and encapsulation materials. Powder coatings Adhesives Composites *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group

Voelpker Spezialprodukte GmbH

WARADUR® E

Function: Mold Release Agent, Glossing Agent, Stabilizer, Dispersant, Melt Flow Agent, Dispersant & Wetting Agent, Emulsifier, Emulsion Stabilizer, Release Agent, Gloss Enhancer, Opacifier

Chemical Family: Waxes, Esters, Fatty Acids

Labeling Claims: Food Contact Acceptable, Non-Carcinogenic, Reprotoxic substance-free, Non-Mutagenic, Environmentally Friendly

Compatible Polymers & Resins: Polyamides, Polyethylene Terephthalate (PET), Thermoplastic Elastomers (TPE), Polypropylenes (PP), Polybutylene Terephthalate (PBT), Phenolic Resins, Polyvinyl Chloride (PVC), Polylactic Acid (PLA), Styrene Copolymers, Polyurethanes (PU), Epoxies (EP), Thermoplastic Polyurethane (TPU)

WARADUR® E is an ester wax consisting of esters of montanic acids with multihydroxyl alcohols. Montanic acids are straight-chained monocarboxylic acids with a chain length in the range of C28 – C32. The corresponding esters exhibit chain length in the range of C58 – C66 and provide this wax with a low volatility, good thermostability and low migration rates.

Arlon Electronic Materials

Arlon® 35N

Polymer Name: Polyimide (PI)

Function: Laminate, Prepreg

End Uses: PCB Materials

35N is a pure polyimide laminate and prepreg system for applications requiring high temperature performance. High Tg (250°C) results in low Z-direction expansion for resistance to PTH failure during PWB processing, and minimizes risk of latent PTH defects in-service. Reduced temperature and time to cure offers improved throughput compared to traditional polyimide cycles.

Diab

Divinycell® F50

Function: Core Material

Core Type: Thermoplastic Foam

Chemical Family: Sulfonates, Sulfonic Acids & Derivatives

Divinycell F50 foam is a recyclable, prepreg compatible sandwich core offering excellent Fire, Smoke and Toxicity (FST) properties, good mechanicals and processing characteristics. It meets the US and European regulatory requirements for commercial aircraft interiors. Other key features include vacuum bag processing up to 220°C and matched tooling and press processing up to 220°C, exceptional fatigue life, good chemical resistance and excellent heat ageing at 180°C. Divinycell F50 is compatible with most common aerospace composite manufacturing processes.

Mitsubishi Chemical Group

jER™ 1256

Polymer Name: Epoxy Resins & Compounds

Function: Coupling Agent, Plasticizer, Binder, Adhesion Promoter, Impact Modifier

Chemical Family: Epoxy & Epoxy Derivatives, Bisphenol A Type Epoxy

Compatible Substrates & Surfaces: Metal, Aluminum, Concrete & Masonry, Glass, Fibers & Fabrics, Plastics, Steel, Ceramic

jERTM 1256 is a solid epoxy resin produced from Bisphenol A epoxy resin. It is a polymer-type epoxy resin with epoxy functional group at the both ends. It can be used to add toughness, insulating and vapor barrier properties, and resistance to heat, water and chemicals in a variety of applications. FeaturesHigh molecular weightHigh softening pointsGood film formerHydrolysis resistanceFlexibilityStrong adhesionApplicationsPCM, CAN, and other coatingsPaintsFiber-reinforced materialsThermoplasticsPrinted electronicsPlastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group

Diab

Divinycell® PY105

Function: Core Material

Chemical Family: Polyethylene Terephthalate (PET)

Divinycell PY is Diab’s newest addition to the PET family. All our PET materials are recyclable and are excellent thermoplastic sandwich core materials. The material is suitable for a variety of processes including infusion, prepreg and press bonding. Divinycell PY provides high shear strain and a very low resin consumption. The core material has been desgned and developed to meet blade designs in an optimal manner.

Mitsubishi Chemical Group

jER™ YL983U

Polymer Name: Epoxy Resins & Compounds

Function: Coupling Agent, Binder, Adhesion Promoter

Chemical Family: Bisphenol Epoxy Resins, Bisphenol F Type Epoxy, Epoxy & Epoxy Derivatives

Compatible Substrates & Surfaces: Metal, Aluminum, Concrete & Masonry, Glass, Fibers & Fabrics, Steel, Plastics, Ceramic

jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Good elastic recovery Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Low viscosity Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group

Mitsubishi Chemical Group

jER™ YX7400N

Polymer Name: Epoxy Resins & Compounds

Function: Impact Modifier, Binder, Coupling Agent, Adhesion Promoter

Chemical Family: Epoxy & Epoxy Derivatives

jER™ YX7400N is an adduct formed from the reaction of epichlorohydrin and an aliphatic polyol.FeaturesAdduct formed from the reaction of epichlorohydrin and an aliphatic polyolExcellent elasticityImpact resistanceApplicationsConsumer appliances and electronicsElectrical devices, assemblies, parts and componentsElectronics adhesivesElectrical and electronic packaging and assemblySpecialty and conformal coatingsPotting compoundsPrinted circuit boards (PCBs)Semiconductor manufacturing*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group

IDI Composites International

IDI™ BMC 46-12

Function: Molding Compound

End Uses: Other End Uses

PRODUCT SERIES: 40 SERIES BMCPRODUCT DESCRIPTION: DIELECTRIC & FLAME RESISTANTElectrical applications requiring a composite material that possesses a UL Yellow card and flammability performance from UL94 HB, V-0 & 5VA. These materials can be found in Underwriters Laboratory file E53587.

Sika

Sika RSF 816 G

Chemical Family: Epoxy & Epoxy Derivatives

Processing Methods: Hand Lay-up

Sika RSF 816 G can be combined with natural fibers and fabrics such as flax, hemp or cellulose based materials fo greener composite solutions.

Sika

Biresin® CR122

Chemical Family: Epoxy & Epoxy Derivatives

Processing Methods: Pultrusion, Filament Winding, Hand Lay-up

End Uses: Pipes & Liners, Tanks

Biresin® CR122 is a medium viscosity epoxy resin system suitable for the production of high performance fibre reinforced composites with a thermal performance up to 120°C.

GMS Composites

GMS Composites EP – 530

Polymer Name: Epoxy Resins & Compounds

Function: Prepreg

Processing Methods: Prepreg Processing

End Uses: Pipes & Liners, Tanks

GMS Composites EP – 530 is a flame retardant epoxy resin matrix prepreg with long shelf life. The product has a versatile curing cycle from as low as 80°C or as high as 150°C, thus enabling the product to be used to produce a wide range of composite items, from large structures to numerous small components. EP-530 is available in a range of substrates such as carbon, glass or aramid. The product is self-extinguishing and meets the UL 94 V-0 classification. The flow and tack of EP-530 can also be varied.

Diab

Divinycell® H100

Function: Core Material

Divinycell H provides excellent mechanical properties to low weight. The unique IPN chemical structure, yields impressive mechanical performance to a low weight. Divinycell H has been widely used and has a proven track record in virtually every application area where sandwich composites are employed including the marine (leisure, military and commercial), land transportation, wind energy, civil engineering/infrastructure and general industrial markets. Divinycell H is ideal for applications subject to fatigue, slamming or impact loads. Other key features of Divinycell H include consistent high quality, excellent adhesion/peel strength, excellent chemical resistance, low water absorption and good thermal/acoustic insulation. Divinycell H is compatible with virtually all commonly used resin and manufacturing systems.

Sika

Biresin® CR80

Chemical Family: Epoxy & Epoxy Derivatives

Processing Methods: Resin Transfer Molding (RTM), Hand Lay-up, Reinforced Reaction Injection Molding (RRIM), Vacuum Infusion Processing (VIP)

End Uses: Tanks, Pipes & Liners, Wind Turbine Blades

Biresin® CR80 is a low viscosity epoxy resin system suitable for the production of high performance fibre reinforced composites parts and moulds with thermal properties up to 80°C.

Arlon Electronic Materials

Arlon® 85N

Polymer Name: Polyimide (PI)

Function: Prepreg, Laminate

85N is the ultimate polyimide and laminate prepreg system fo PWB's requiring resistance to high temperature, both in process and in end-use applications. Bromine-free chemistry provides Bestin-Class thermal stability for applications with sustained high in-use temperatures as well as for use in lead-free soldering applications.

Cosmic Plastics

Cosmic™ DAP D72/6120F

Function: Molding Compound

Reinforcement Material: Glass Fibers

Processing Methods: Resin Transfer Molding (RTM), Compression Molding, Injection Molding

End Uses: Insulators

Cosmic D72 is a short glass fiber filled, flame retardant, general purpose diiallyl ortho phthalate molding compound which is supplied in a free flowing granular form. It can be easily molded in compression, transfer, or injection equipment and can be readily preformed. It has passed NASA outgassing tests. FEATURES: D72 has a high dielectric strength, low dissipation factor along with excellent flexural and tensile strength. APPLICATIONS: Switches, terminals, insulators, cups, cases and other applications requiring flame resistance and strength. Also useful for encapsulation of electrical and electronic components. Suitable for thin-walled parts.

Polynt Group

POLYCOR® ISO BR WHITE 9199

Chemical Family: Isophthalics

Function: Surface Finishes

Color: Off White, Transparent, Custom, White

Features: Good Mechanical Properties, Improved Mechanical Properties, Other Composite Materials Features

POLYCOR® ISO BR WHITE 9199 - A pre-accelerated gel coat based on Isophthalic unsaturated polyester resin. It is cured using MEKP peroxide.This gel coat is formulated to meet the rigid requirements of transportation,boating and sanitary applications.

Sika

Epolam 2020

Chemical Family: Epoxy & Epoxy Derivatives

Processing Methods: Vacuum Infusion Processing (VIP), Resin Transfer Molding (RTM), Filament Winding, Hand Lay-up, Reinforced Reaction Injection Molding (RRIM)

EPOLAM 2020 is a Variable reactivity by addition of an accelerator Tg ~80°C

Diab

Divinycell® HCP30

Function: Core Material

Divinycell HCP grade meets the demand for a high performance, low density buoyancy material with excellent characteristics. It is widely used in submarines, subsea buoyancy units, ROVs, diving bells and impact protection structures. As a result of its excellent hydraulic compressive properties and closed cell structure, it has very low buoyancy loss and water absorption under long-term loading conditions. HCP stands for Hydraulic Crush Point and is defined as the point of pressure in Bar, where the material when subjected to an increasing pressure of 1-2 Bar/sec has lost 5% of its initial volume. The design of subsea buoyancy applications is complex and consideration has to be given to the required buoyancy loss and updrift over the expected lifetime and service conditions, with respect to long and short term hydraulic compressive creep, water absorption and hydraulic fatigue. Please contact Diab Technical Services for design proposal.

Polynt Group

NORSODYNE® C 55377 AL

Chemical Family: Unsaturated Polyester (UPE), Polyesters

End Uses: Structural Components

NORSODYNE® C 55377 AL - Unsaturated polyester resin in styrene,Isophthalic-Neopentylic. It is used to produce agglomerated and engineered stones through casting method.

Composites Evolution Ltd

Evopreg® PFC502

Polymer Name: Polyfurfuryl Alcohol

Function: Prepreg

Reinforcement Material: Aramid (Kevlar), Glass Fibers, Carbon Fibers, Flax Fibers

Processing Methods: Compression Molding, Vacuum Bagging, Prepreg Processing

Evopreg® PFC502 prepregs are a range of fire-retardant, pre-impregnated composite materialsbased on a PFA (Polyfurfuryl Alcohol) bioresin. PFA is a thermosetting bioresin derived from crop waste and is similar to phenolic resin but withlower toxicity and VOC emissions. In addition to its environmental credentials, PFA hasoutstanding fire retardant properties, plus excellent temperature and chemical resistance. The prepregs can be supplied with a range of reinforcement fibers and fabric constructions,including woven and unidirectional E-glass fiber and carbon fiber. They can be consolidated byvacuum bagging, autoclave or press molding and are designed for applications includingaircraft interiors, rail interiors, marine, offshore and construction.

Toray

Toray MicroPly™ TCF4045

Function: Core Material

Core Type: Thermoset Foam

Chemical Family: Epoxy & Epoxy Derivatives

Toray MicroPly™ TCF4045 is a low dielectric, low density epoxy syntactic film. The material displays both good mechanical and dielectric properties. Toray MicroPly™ TCF4045’s base resin chemistry features low moisture absorption with good high temperature properties. 177°C (350°F) Cure, Low Dielectric Epoxy Syntactic Film

Diab

Divinycell® HCP70

Function: Core Material

Quantum Composites

Lytex® 9063-E

Function: Molding Compound

Chemical Family: Epoxy & Epoxy Derivatives

Reinforcement Material: Glass Fibers

Processing Methods: Compression Molding

Lytex® 9063-E is an epoxy high performance, fiberglass reinforced ESC® molding compound designed for military and aerospace structural applications requiring excellent mechanical properties, retention of properties at elevated temperatures, good chemical resistance and excellent electrical properties. It meets the requirements of MIL-M-46069 and MIL-M-46892.

Scott Bader

Crestapol® 1080 Urethane Acrylate Resin

Chemical Family: Styrenics, Acrylics, Acrylates & Methacrylates, Urethanes

End Uses: Pipes & Liners, Tanks

Crestapol® 1080 Urethane Acrylate Resin is an exceptionally tough, flexible, unsaturated urethane acrylate in styrene monomer with a very high elongation. It is used to blend with other polyester and vinylester resins to create a much tougher resin formulation. Addition levels with other resin systems are typically in the region of 5-20%. Crestapol 1080 has been used in military applications, marine, tooling and many building projects requiring exceptional toughness.

Hexcel

HexFlow® VRM37

Chemical Family: Epoxy & Epoxy Derivatives

Processing Methods: Resin Transfer Molding (RTM)

HexFlow® VRM37 is a 350°F curing, two-part, mid-toughened epoxy resin, specifically developed to meet the demanding requirements of structural aerospace resin transfer molding (RTM) and vacuum assisted resin transfer molding (VARTM) applications. This epoxy system supports service temperatures up to 250°F. HexFlow® VRM37 Part A is a light amber color; HexFlow® VRM37 Part B is a dark purple color.

Menzolit Ltd.

Menzolit® SMC 2300

Function: Molding Compound

Chemical Family: Polyesters

Reinforcement Material: Glass Fibers

Processing Methods: Compression Molding

menzolit® SMC 2300 is a sheet moulding compound based on unsaturated polyester resin. The product is glass fibre reinforced and contains mineral fillers. In case of fire the product doesn’t melt, neither does it form droplets nor is smoke generation excessive. The material is compression moulded in heated steel moulds. It is recommended to work with chrome plated tools. The product contains no halogens or heavy metals nor any candidates from the REACH SVHC list.

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