Product Families
Additives
Fillers & Extenders
(24)
Fire Retardants
(32)
Functional Additives
(85)
Initiators, Promotors & Catalysts
(148)
Thixotropes
(0)
Core Materials
Foam Cores
(430)
Honeycomb
(221)
Wood Cores
(14)
Polymers & Resins
Thermoplastic Resins
(165)
Thermoset Resins
(752)
Other Polymers & Resins
(6)
Prepregs & Molding Compounds
Bulk Molding Compounds (BMC)
(183)
Sheet Molding Compounds (SMC)
(260)
Thermoplastic Prepregs
(70)
Thermoset Prepregs
(346)
Other Prepregs & Molding Compounds
(85)
Laminates
(232)
Reinforcements
Aramid (Kevlar)
(121)
Carbon Fiber
(585)
Glass Fiber
(844)
Natural Materials
(112)
Other Reinforcements
(149)
Surface Finishes
Adhesives
(23)
Gelcoats & Topcoats
(224)
Surface Veils
(46)
Other Surface Finishes
(13)

Composite Materials

5,100 products found in Composite Materials
With TDS
With SDS
Hide Blends
Jer™ Yx7105 product card banner

Mitsubishi Chemical

jER™ YX7105

Brand: jER

Applications: Appliances & Electronics, Conformal Coatings, Consumer Electronics

Product Families: Epoxies, Thermoset Resins

Chemical Family: Epoxy & Epoxy Derivatives

Polymer Name: Epoxy Resins & Compounds

jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for printed electronics and wearable devices to avoid bending and warpage.  YX7105 also has strong resistant to thermal decomposition and strong adhesion property, so it is an ideal material for adhesives and coating in semiconductor and printed electronics application.   Application of YX7105 ・Coating and Paints ・Giving toughness and impact strength ・Adhesives ・Increasing adhesiveness ・Film/Sheet ・Giving flexibility and strechability ・Semiconductor (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP) ・Increasing resistant to mechanical pressure (thermal decomposition, bending/warpage) ・Printed Electronics ・Dry film, adhesive for triple-layer FPC, and adhesion promotor for FR4 & FR5

Jer™ Yx8000d product card banner

Mitsubishi Chemical

jER™ YX8000D

Brand: jER

Applications: Appliances & Electronics, LEDs, Packaging & Assembly Materials

Product Families: Epoxies, Thermoset Resins

Chemical Family: Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol A Type Epoxy

Polymer Name: Epoxy Resins & Compounds

End Uses: Radiation Curable Coating

jER™ YX8000D is a hydrogenated bisphenol A type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. Its excellent transparency and better adhesiveness are suitable for wide variety of optical adhesives and encapsulants. This grade has higher photocure reaction rate, contributing your photocuring process to be more efficient compared to conventional cycloaliphatic epoxy resins. Application of YX8000D ・LED/OLED encapsulant, LED reflector br/>・Achieve high transparency formulation br/> ・Adhesives for optical devices (electro-optic assemblies, and laser components) br/>・Improving UV resistant ・Increasing adhesiveness br/> ・Photocure process application (UV/LED) br/>・Accelerate photo cure rate br/>

Dytek® Dch-99 product card banner

INVISTA

Dytek® DCH-99

Brand: Dytek

Applications: Equipment & Parts, Textile Manufacturing, Water Treatment

Product Families: Other Resins & Binders, Catalysts & Initiators, Surface Protective Additives

Chemical Family: Diamines

End Uses: Tanks, Pipes & Liners, Pump Parts

DYTEK® DCH-99 (1,2-diamainecyclohexane) is a cyclic aliphatic diamine made of 100% reclaimed material that is used primarily in epoxy coatings and composites. It provides chemical resistance over a broad range of chemicals, which makes it a superior choice for industrial and marine coatings. Other applications include mining, oil & gas, and pharmaceutical intermediates.

Jer™ 4250 product card banner

Mitsubishi Chemical

jER™ 4250

Brand: jER

Applications: Appliances & Electronics, Conformal Coatings, Electronics Adhesives

Product Families: Epoxies, Thermoset Resins

Chemical Family: Epoxy & Epoxy Derivatives

Polymer Name: Epoxy Resins & Compounds

jER™ 4250 is a polymer type epoxy resin with epoxy functional group at the both ends. It is bisphenol A / bisphenol F hybrid type of epoxy resin and  more flexible than conventional polymer type epoxy resin. Its high molecular weight and high softening points work for improving toughness, insulating, vapor barrier propetiesand heat/water/chemicals resistance to products of various apprications like; ・Coating and Paints  Improving paintability and coatability ・CFRP  Improving toughness and flexibility  Viscosity adjustment ・Film/Sheet  Improving formability ・Thermoplastic Modifier(Polyester, PPS etc)  Improving hydrolysis resistance, adhesiveness, and insulating  ・Printed Electronics  Dry film, adhesive for triple-layer FPC, and adhesion promotor for FR4&FR5

Jer™ Yl980 product card banner

Mitsubishi Chemical

jER™ YL980

Brand: jER

Applications: Appliances & Electronics, Potting Compounds, Other Packaging & Assembly Applications

Product Families: Epoxies, Thermoset Resins

Chemical Family: Bisphenol Epoxy Resins, Bisphenol A Type Epoxy, Epoxy & Epoxy Derivatives

Polymer Name: Epoxy Resins & Compounds

jER™ YL980 is is a Bisphenol A type liquid epoxy resin with significantly low chlorine content. Moreover, chlorine in the molecular skeleton is difficult to detach by hydrolysis. So it is ideal for electrical and electronic applications which is hesitate to metal corrosion by chlorine. ・Semiconductor  (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)  Achieve high filler content formulation  Increasing adhesiveness   Keeping high electrical reliability because of low chlorine ・Adhesive for electrical and electronic applications  Increasing adhesiveness  Keepimg high electrical reliability because of low chlorine

Jer™ Yx7110 product card banner

Mitsubishi Chemical

jER™ YX7110

Brand: jER

Applications: Appliances & Electronics, Conformal Coatings, Consumer Electronics

Product Families: Epoxies, Thermoset Resins

Chemical Family: Epoxy & Epoxy Derivatives

Polymer Name: Epoxy Resins & Compounds

jER™ YX7110 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol.

Jer™ Yx4000 product card banner

Mitsubishi Chemical

jER™ YX4000

Brand: jER

Applications: Appliances & Electronics, Conformal Coatings, Consumer Electronics

Product Families: Epoxies, Thermoset Resins

Chemical Family: Epoxy & Epoxy Derivatives

Polymer Name: Epoxy Resins & Compounds

End Uses: Powder Coating

jER™ YX4000 is a biphenol type solid epoxy resin with significantly low melt viscosity, low water absorption and good balance between adhesiveness and rigidity against stress. These properties are suitable for Electrical and electronic applications. ・Electrical and electronic applications(EMC, solder resist, PCB, etc.)  Achieve well-balanced mechanical property required for electrical and electronic applications with high electrical reliability   Achieve high filler content formulation  Achieve high flowability formulation ・Powder coating for ship bottom  Improving chemical resistance ・CFRP

Jer™ Yx8040 product card banner

Mitsubishi Chemical

jER™ YX8040

Brand: jER

Applications: Appliances & Electronics, LEDs, Packaging & Assembly Materials

Product Families: Epoxies, Thermoset Resins

Chemical Family: Epoxy & Epoxy Derivatives

Polymer Name: Epoxy Resins & Compounds

jER™ YX8040 is a hydrogenated bisphenol A type solid epoxy resin, with high molecular weight.

United Initiators Mypc product card banner

United Initiators

United Initiators MYPC

Applications: Equipment & Parts, Roof Shingles & Tiles, Pavement, Highways, Roads & Bridges

Product Families: Catalysts, Initiators & Crosslinkers, Initiators, Promotors & Catalysts

Chemical Family: Peroxides, Carbonates

End Uses: Tanks, Pipes & Liners

White, greasy flakes, consisting of technically pure Dimyristylperoxydicarbonate. This long-chained aliphatic peroxydicarbonate is used as an initiator (radical source) in the polymerisation of monomers, e.g. vinylchloride.

Jer™ Yx8800 product card banner

Mitsubishi Chemical

jER™ YX8800

Brand: jER

Applications: LEDs, Appliances & Electronics, Conformal Coatings

Product Families: Epoxies, Thermoset Resins

Chemical Family: Epoxy & Epoxy Derivatives

Polymer Name: Epoxy Resins & Compounds

End Uses: Powder Coating

jER™ YX8800 is an anthracene type epoxy resin with with significantly low melt viscosity, high Tg and Low-CTE. It also has high flame retardancy by forming carbonized layer when it's burning. So it's suitable for Electrical and electronic applications, CFRP and some applications which is requirede flame retardancy. ・Electrical and electronic applications(EMC, solder resist, PCB, etc.)  Achieve well-balanced mechanical property required for electrical and electronic applications with high electrical reliability   Achieve high filler content formulation  Achieve high flowability formulation  Inproving flame retardancy ・CFRP  Improving toughness and flexibility  Inproving flame retardancy

Arlon® 35N product card banner

Arlon Electronic Materials

Arlon® 35N

Brand: Arlon

Applications: Other Industrial Applications, Aerospace & Aviation, Other Automotive Applications

Product Families: Laminates, Thermoset Prepregs

Chemical Family: Polyimides (PI)

Polymer Name: Polyimide (PI)

End Uses: PCB Materials

35N is a pure polyimide laminate and prepreg system for applications requiring high temperature performance. High Tg (250°C) results in low Z-direction expansion for resistance to PTH failure during PWB processing, and minimizes risk of latent PTH defects in-service. Reduced temperature and time to cure offers improved throughput compared to traditional polyimide cycles.

Divinycell® F50 product card banner

Diab

Divinycell® F50

Brand: Divinycell

Applications: Aerospace & Aviation, Exterior & Body

Product Families: Foam Cores

Chemical Family: Sulfonic Acids & Derivatives, Sulfonates

Divinycell F50 foam is a recyclable, prepreg compatible sandwich core offering excellent Fire, Smoke and Toxicity (FST) properties, good mechanicals and processing characteristics. It meets the US and European regulatory requirements for commercial aircraft interiors. Other key features include vacuum bag processing up to 220°C and matched tooling and press processing up to 220°C, exceptional fatigue life, good chemical resistance and excellent heat ageing at 180°C. Divinycell F50 is compatible with most common aerospace composite manufacturing processes.

Jer™ 1256 product card banner

Mitsubishi Chemical

jER™ 1256

Brand: jER

Applications: Can Coatings, Appliances & Electronics, Conformal Coatings

Product Families: Surface Modifiers, Epoxies, Processing Aids

Chemical Family: Bisphenol A Type Epoxy, Epoxy & Epoxy Derivatives

Polymer Name: Epoxy Resins & Compounds

jER™ 1256 is a polymer type epoxy resin with epoxy functional group at the both ends. Its high molecular weight and high softening points work for improving toughness, insulating, vapor barrier properties, and heat/water/chemicals resistance to products of various applications like;・Coating and Paints・Improving paintability and coatability・CFRP・Improving toughness and flexibility・Viscosity adjustment・Film/Sheet・Improving formability・Thermoplastic Modifier(Polyester, PPS etc.)・Improving hydrolysis resistance, adhesiveness, and insulating ・Printed Electronics・Dry film, adhesive for triple-layer FPC, and adhesion promotor for FR4&FR5

Divinycell® Py105 product card banner

Diab

Divinycell® PY105

Brand: Divinycell

Applications: Renewable Energy

Product Families: Foam Cores

Chemical Family: Polyethylene Terephthalate (PET)

Divinycell PY is Diab’s newest addition to the PET family. All our PET materials are recyclable and are excellent thermoplastic sandwich core materials. The material is suitable for a variety of processes including infusion, prepreg and press bonding. Divinycell PY provides high shear strain and a very low resin consumption. The core material has been desgned and developed to meet blade designs in an optimal manner.

Jer™ Yl983u product card banner

Mitsubishi Chemical

jER™ YL983U

Brand: jER

Applications: Appliances & Electronics, Potting Compounds, Other Packaging & Assembly Applications

Product Families: Epoxies, Thermoset Resins

Chemical Family: Bisphenol Epoxy Resins, Bisphenol F Type Epoxy, Epoxy & Epoxy Derivatives

Polymer Name: Epoxy Resins & Compounds

jER™ YL983 is a bisphenol F type liquid epoxy resin with significantly low chorine content and low viscosity. Moreover, chlorine in the molecular skeleton of this product is difficult to detach by hydrolysis. So it is ideal for electrical and electronic applications which is hesitate to metal corrosion by chlorine. ・Semiconductor  (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)  Achieve high filler content formulation  Achieve high flowabilty formulation  Increasing adhesiveness   Keeping high electrical reliability because of low chlolrine    ・Adhesive for electrical and electronic applications  Increasing adhesiveness   Keeping high electrical reliability because of low chlolrine

Jer™ Yx7400n product card banner

Mitsubishi Chemical

jER™ YX7400N

Brand: jER

Applications: Appliances & Electronics, Conformal Coatings, Printed Circuit Boards (PCBs)

Product Families: Epoxies, Thermoset Resins

Chemical Family: Epoxy & Epoxy Derivatives

Polymer Name: Epoxy Resins & Compounds

jER™ YX7400N is an adduct formed from the reaction of epichlorohydrin and an aliphatic polyol.

Idi™ Bmc 46-12 product card banner

IDI Composites International

IDI™ BMC 46-12

Brand: IDI

Applications: Other Devices & Assemblies

Product Families: Bulk Molding Compounds (BMC)

End Uses: Other End Uses

PRODUCT SERIES: 40 SERIES BMCPRODUCT DESCRIPTION: DIELECTRIC & FLAME RESISTANTElectrical applications requiring a composite material that possesses a UL Yellow card and flammability performance from UL94 HB, V-0 & 5VA. These materials can be found in Underwriters Laboratory file E53587.

Biresin® Cr122 product card banner

Sika

Biresin® CR122

Brand: Biresin

Applications: Equipment & Parts, Tooling & Moldmaking, Pipes & Tanks

Product Families: Thermoset Resins

Chemical Family: Epoxy & Epoxy Derivatives

End Uses: Tanks, Pipes & Liners

Biresin® CR122 is a medium viscosity epoxy resin system suitable for the production of high performance fibre reinforced composites with a thermal performance up to 120°C.

Sika Rsf 816 G product card banner

Sika

Sika RSF 816 G

Applications: Sports & Recreation

Product Families: Thermoset Resins

Chemical Family: Epoxy & Epoxy Derivatives

RSF 816G can be combined with natural fibers and fabrics such as flax, hemp or cellulose based materials fo greener composite solutions.

Biresin® Cr80 product card banner

Sika

Biresin® CR80

Brand: Biresin

Applications: Equipment & Parts, Pipes & Tanks, Marine

Product Families: Thermoset Resins

Chemical Family: Epoxy & Epoxy Derivatives

End Uses: Tanks, Pipes & Liners, Wind Turbine Blades

Biresin® CR80 is a low viscosity epoxy resin system suitable for the production of high performance fibre reinforced composites parts and moulds with thermal properties up to 80°C.

Gms Composites Ep – 530 product card banner

GMS Composites

GMS Composites EP – 530

Applications: Equipment & Parts, Renewable Energy, Pipes & Tanks

Product Families: Thermoset Prepregs

Chemical Family: Epoxy & Epoxy Derivatives

Polymer Name: Epoxy Resins & Compounds

End Uses: Tanks, Pipes & Liners

GMS Composites EP-530 is a flame retardant epoxy resin matrix prepreg with long shelf life. The product has a versatile curing cycle from as low as 80°C or as high as 150°C, thus enabling the product to be used to produce a wide range of composite items, from large structures to numerous small components. EP-530 is available in a range of substrates such as carbon, glass or aramid. The product is self-extinguishing and meets the UL 94 V-0 classification. The flow and tack of EP-530 can also be varied.

Divinycell® H100 product card banner

Diab

Divinycell® H100

Brand: Divinycell

Applications: Pavement, Highways, Roads & Bridges, Renewable Energy, Structural Components

Product Families: Foam Cores

End Uses: Structural Components

Divinycell H provides excellent mechanical properties to low weight. The unique IPN chemical structure, yields impressive mechanical performance to a low weight. Divinycell H has been widely used and has a proven track record in virtually every application area where sandwich composites are employed including the marine (leisure, military and commercial), land transportation, wind energy, civil engineering/infrastructure and general industrial markets. Divinycell H is ideal for applications subject to fatigue, slamming or impact loads. Other key features of Divinycell H include consistent high quality, excellent adhesion/peel strength, excellent chemical resistance, low water absorption and good thermal/acoustic insulation. Divinycell H is compatible with virtually all commonly used resin and manufacturing systems.

Arlon® 85N product card banner

Arlon Electronic Materials

Arlon® 85N

Brand: Arlon

Applications: Other Industrial Applications, Other Devices & Assemblies, Printed Circuit Boards (PCBs)

Product Families: Laminates, Thermoset Prepregs

Chemical Family: Polyimides (PI)

Polymer Name: Polyimide (PI)

85N is the ultimate polyimide and laminate prepreg system fo PWB's requiring resistance to high temperature, both in process and in end-use applications. Bromine-free chemistry provides Bestin-Class thermal stability for applications with sustained high in-use temperatures as well as for use in lead-free soldering applications.

Cosmic™ Dap D72/6120f product card banner

Cosmic Plastics

Cosmic™ DAP D72/6120F

Brand: Cosmic

Applications: Housings & Enclosures, Switches & Relays, Other Devices & Assemblies

Product Families: Other Prepregs & Molding Compounds

Chemical Family: Phthalates

End Uses: Insulators

Cosmic D72 is a short glass fiber filled, flame retardant, general purpose diiallyl ortho phthalate molding compound which is supplied in a free flowing granular form. It can be easily molded in compression, transfer, or injection equipment and can be readily preformed. It has passed NASA outgassing tests. FEATURES: D72 has a high dielectric strength, low dissipation factor along with excellent flexural and tensile strength. APPLICATIONS: Switches, terminals, insulators, cups, cases and other applications requiring flame resistance and strength. Also useful for encapsulation of electrical and electronic components. Suitable for thin-walled parts.

Norsodyne® C 55377 Al product card banner

Polynt Group

NORSODYNE® C 55377 AL

Brand: NORSODYNE

Applications: Roof Shingles & Tiles, Pavement, Highways, Roads & Bridges, Parking Structures & Stadiums

Product Families: Thermoset Resins

Chemical Family: Polyesters, Unsaturated Polyester (UPE)

NORSODYNE® C 55377 AL - Unsaturated polyester resin in styrene,Isophthalic-Neopentylic. It is used to produce agglomerated and engineered stones through casting method.

Divinycell® Hcp30 product card banner

Diab

Divinycell® HCP30

Brand: Divinycell

Applications: Marine

Product Families: Foam Cores

Divinycell HCP grade meets the demand for a high performance, low density buoyancy material with excellent characteristics. It is widely used in submarines, subsea buoyancy units, ROVs, diving bells and impact protection structures. As a result of its excellent hydraulic compressive properties and closed cell structure, it has very low buoyancy loss and water absorption under long-term loading conditions. HCP stands for Hydraulic Crush Point and is defined as the point of pressure in Bar, where the material when subjected to an increasing pressure of 1-2 Bar/sec has lost 5% of its initial volume. The design of subsea buoyancy applications is complex and consideration has to be given to the required buoyancy loss and updrift over the expected lifetime and service conditions, with respect to long and short term hydraulic compressive creep, water absorption and hydraulic fatigue. Please contact Diab Technical Services for design proposal.

Polycor® Iso Br White 9199 product card banner

Polynt Group

POLYCOR® ISO BR WHITE 9199

Brand: POLYCOR

Applications: Roof Shingles & Tiles, Pavement, Highways, Roads & Bridges, Parking Structures & Stadiums

Product Families: Gelcoats & Topcoats

Chemical Family: Isophthalics

POLYCOR® ISO BR WHITE 9199 - A pre-accelerated gel coat based on Isophthalic unsaturated polyester resin. It is cured using MEKP peroxide.This gel coat is formulated to meet the rigid requirements of transportation,boating and sanitary applications.

Epolam 2020 product card banner

Sika

Epolam 2020

Brand: Epolam

Applications: Power & Utilities, Marine, Pavement, Highways, Roads & Bridges

Product Families: Thermoset Resins

Chemical Family: Epoxy & Epoxy Derivatives

EPOLAM 2020 is a Variable reactivity by addition of an accelerator Tg ~80°C

Lytex® 9063-E product card banner

Quantum Composites

Lytex® 9063-E

Brand: Lytex

Applications: Refining & Gas Processing, Medical Devices & Assemblies, Implants & Prosthetics

Product Families: Sheet Molding Compounds (SMC)

Chemical Family: Epoxy & Epoxy Derivatives

LYTEX® 9063 BK-E is an epoxy high performance, fiberglass reinforced ESC® molding compound designed for military and aerospace structural applications requiring excellent mechanical properties, retention of properties at elevated temperatures, good chemical resistance and excellent electrical properties. It meets the requirements of MIL-M-46069 and MIL-M-46892.

Toray Microply™ Tcf4045 product card banner

Toray

Toray MicroPly™ TCF4045

Brand: Toray MicroPly

Applications: Aerospace & Aviation

Product Families: Foam Cores

Chemical Family: Epoxy & Epoxy Derivatives

Toray MicroPly™ TCF4045 is a low dielectric, low density epoxy syntactic film. The material displays both good mechanical and dielectric properties. Toray MicroPly™ TCF4045’s base resin chemistry features low moisture absorption with good high temperature properties. 177°C (350°F) Cure, Low Dielectric Epoxy Syntactic Film

Divinycell® Hcp70 product card banner

Diab

Divinycell® HCP70

Brand: Divinycell

Applications: Marine

Product Families: Foam Cores

Divinycell HCP grade meets the demand for a high performance, low density buoyancy material with excellent characteristics. It is widely used in submarines, subsea buoyancy units, ROVs, diving bells and impact protection structures. As a result of its excellent hydraulic compressive properties and closed cell structure, it has very low buoyancy loss and water absorption under long-term loading conditions. HCP stands for Hydraulic Crush Point and is defined as the point of pressure in Bar, where the material when subjected to an increasing pressure of 1-2 Bar/sec has lost 5% of its initial volume. The design of subsea buoyancy applications is complex and consideration has to be given to the required buoyancy loss and updrift over the expected lifetime and service conditions, with respect to long and short term hydraulic compressive creep, water absorption and hydraulic fatigue. Please contact Diab Technical Services for design proposal.

Crestapol® 1080 Urethane Acrylate Resin product card banner

Scott Bader

Crestapol® 1080 Urethane Acrylate Resin

Brand: Crestapol

Applications: Equipment & Parts, Pipes & Tanks, Pipes & Plumbing

Product Families: Thermoset Resins

Chemical Family: Styrenics, Urethanes, Acrylics, Acrylates & Methacrylates

End Uses: Tanks, Pipes & Liners

Crestapol® 1080 Urethane Acrylate Resin is an exceptionally tough, flexible, unsaturated urethane acrylate in styrene monomer with a very high elongation. It is used to blend with other polyester and vinylester resins to create a much tougher resin formulation. Addition levels with other resin systems are typically in the region of 5-20%. Crestapol 1080 has been used in military applications, marine, tooling and many building projects requiring exceptional toughness.

Baltek® Sbc.80 product card banner

3A Core Materials

BALTEK® SBC.80

Brand: BALTEK

Applications: Equipment & Parts, Interior, Exterior & Body

Product Families: Wood Cores

End Uses: Tanks, Pipes & Liners

BALTEK® SBC is a core material produced from controlled kilndried balsa wood in the ‘end-grain’ configuration with physical time to kiln control. 3A Composites Core Materials owns and manages several thousand hectares of FSC®-certified balsa wood plantations. Its cultivation from seedling to the tree ensures sustainable forest management and strict traceability. Documented and controlled time to kiln-drying makes SBC ideal for vacuum infusion. Own plantations enable 3A Composites to provide a continuous supply to industrial customers. BALTEK® SBC has exceptionally high strength and stiffness to weight ratios and achieves an excellent bond with all types of resins. It is an ideal core material for an extensive range of applications. All while being a renewable resource.

Idi™ Smc E-206 product card banner

IDI Composites International

IDI™ SMC E-206

Brand: IDI

Applications: Other Devices & Assemblies

Product Families: Sheet Molding Compounds (SMC)

End Uses: Other End Uses

PRODUCT SERIES: E200 SERIES SMCPRODUCT DESCRIPTION: UL YELLOW CARD SMCElectrical applications requiring a composite material that possesses a UL Yellow card and flammability performance from UL94 HB, V-0 & 5VA. These materials can be found in Underwriters Laboratory file E53587.

Hexcel F161 product card banner

Hexcel

Hexcel F161

Applications: Structural Components, Exterior & Body

Product Families: Thermoset Prepregs

Chemical Family: Epoxy & Epoxy Derivatives

Polymer Name: Epoxy Resins & Compounds

F161 is a structural, heat resistant and electrical grade epoxy formulation designed for autoclave curing. F161 is a high temperature, laminate grade epoxy resin with a 350°F (177°C) cure. F161 is unique in that it was the first resin system to meet all types and classes of MIL-R-9300 B.

Hexflow® Vrm37 product card banner

Hexcel

HexFlow® VRM37

Brand: HexFlow

Applications: Aerospace & Aviation

Product Families: Thermoset Resins

Chemical Family: Epoxy & Epoxy Derivatives

HexFlow® VRM37 is a 350°F curing, two-part, mid-toughened epoxy resin, specifically developed to meet the demanding requirements of structural aerospace resin transfer molding (RTM) and vacuum assisted resin transfer molding (VARTM) applications. This epoxy system supports service temperatures up to 250°F. HexFlow® VRM37 Part A is a light amber color; HexFlow® VRM37 Part B is a dark purple color.