Other Thermoset Resins

154 products found for Other Thermoset Resins in Plastics
Durez™ 00118 product card banner

Sumitomo Bakelite Company

Durez™ 00118

Brand: Durez

Applications: Other Automotive Applications, Other Consumer Goods Applications, Other Devices & Assemblies

Product Families: Other Thermoset Resins

Chemical Family: Phenols & Phenolics

Polymer Name: Phenolic Compound

End Uses: Automotive Applications, General Purpose, Electrical/Electronic Applications

Durez™ 00118 by Sumitomo Bakelite Company is comprised of Phenolic Compound. It is commonly used as Molding Resin for a variety of applications in Automotive. Durez™ 00118 is certified as UL Flame Rated. It is available in Granules form.

Alnovol® Uf 410 Rpc product card banner

allnex

ALNOVOL® UF 410 RPC

Brand: ALNOVOL

Applications: Tires

Product Families: Other Thermoset Resins

End Uses: Tires

ALNOVOL® UF 410 RPC is a carbamic resin on silica. It is compatible with most of the synthetic and natural rubbers. Due to the silica carrier in solvents, no clear solution is possible.

Gp Brsd-2112 product card banner

Georgia-Pacific Chemicals

GP BRSD-2112

Brand: GP

Applications: Transportation Assembly, Industrial Manufacturing, Furniture Adhesives

Product Families: Other Resins & Binders, Other Thermoset Resins

Chemical Family: Phenols & Phenolics

GP® BRSD-2112 coating/adhesive resin is a liquid heat-reactive phenolic-based resin solution.

Durez™ 29502 B product card banner

Sumitomo Bakelite Company

Durez™ 29502 B

Brand: Durez

Applications: Other Automotive Applications

Product Families: Other Thermoset Resins

Chemical Family: Phenols & Phenolics

Polymer Name: Phenolic Compound

End Uses: Automotive Applications

Durez™ 29502 B by Sumitomo Bakelite Company is comprised of Phenolic Compound. It is commonly used as Molding Resin for a variety of applications in Automotive. It is available in Granules form.

Si Group Sp-560 product card banner

SI Group

SI Group SP-560

Product Families: Other Thermoset Resins

Polymer Name: Terpene Phenolic Resin

SP-560 is a thermoplastic, oil-soluble, terpene phenolic resin. This resin is mainly used in adhesives as either the base resin or as a modifying resin in the formulation of polychloroprene cements. It can also be used in hot melt or solution adhesives made from other elastomers where the combination of high tack and high heat performance is desired. Polychloroprene cements can be directly formulated from simple mixtures of polychloroprene and SP-560 Resin. Such cements display good strength and tack retention properties but may be deficient in high-temperature performance. To improve high temperature performance, SP-560 Resin may be blended in any proportion with heat-reactive resins.

Si Group Frj-551 product card banner

SI Group

SI Group FRJ-551

Product Families: Other Thermoset Resins

FRJ-551 is a heat-reactive, alkylphenolic resin which is designed primarily for use in the formulation of polychloroprene-based contact adhesives. FRJ-551 imparts low initial viscosity and excellent viscosity-stability to adhesives of this type. In adhesives based on polychloroprene, FRJ-551 gives good bond strengths, both at room and elevated temperatures.

Epo-tek® Tv1003-lv product card banner

Epoxy Technology Inc.

EPO-TEK® TV1003-LV

Brand: EPO-TEK

Applications: Other Semiconductor Applications, Printed Circuit Boards (PCBs), Other Parts & Components

Product Families: Other Thermoset Resins

Chemical Family: Polyimides (PI)

Polymer Name: Thermoset Polyimide (PI)

End Uses: Semiconductor Molding Compounds, Printed Circuit Boards, Electrical Components

Screen printable polyimide paste for semiconductor wafer coating applications. It is a lower viscosity version of EPO-TEK® TV1003.Formerly 98-5-3

Gp Cl-7002 product card banner

Georgia-Pacific Chemicals

GP CL-7002

Brand: GP

Applications: Architectural Coatings, Industrial Coatings, Industrial Maintenance

Product Families: Other Resins & Binders, Rheology Modifiers & Stabilizers, Functional Additives

Chemical Family: Phenols & Phenolics

GP® CL-7002 phenolic resin from Georgia-Pacific Chemicals is a thermoplastic novolac. It is used as a crosslinking resin for epoxy and polyester resins. Its low phenol content, convenient softening point, and melt viscosity are conducive for use in powder coatings.

Si Group Hrj-11331 product card banner

SI Group

SI Group HRJ-11331

Product Families: Other Thermoset Resins

HRJ-11331 is a heat-reactive resin made from butylphenol and formaldehyde which contains reactive methylol groups. The primary use for this product is in the manufacture of polychloroprene adhesives, where it gives especially good hot bond strength.

Carbonresin™ Ce 221 product card banner

Carbon Inc.

CarbonResin™ CE 221

Brand: CarbonResin

Applications: Powertrain & UTH, Other Devices & Assemblies, Other Industrial Applications

Product Families: Photoactive Resins, Other Thermoset Resins

Polymer Name: Cyanate Ester Resin

End Uses: Automotive Under The Hood, Electrical/Electronic Applications, Industrial Applications

CE 221 is a high performance material with excellent strength, stiffness, and temperature resistance (231 °C). CE is comparable to glass-filled nylon.

Si Group Hrj-1166 product card banner

SI Group

SI Group HRJ-1166

Product Families: Other Thermoset Resins

Chemical Family: Phenol Formaldehyde (PF)

Polymer Name: Phenol Formaldehyde (PF)

HRJ-1166 is a high-purity, phenol-formaldehyde novolak resin with low softening point. HRJ-1166 is supplied in flaked form and has a nearly colorless to light yellow color. This product is specially processed to obtain low levels of monomer, ion, and particulate material.

Si Group Sp-154 product card banner

SI Group

SI Group SP-154

Product Families: Other Thermoset Resins

SP-154 is a heat-reactive phenolic resin that was developed especially for formulating solvent-borne polychloroprene contact cements that do not phase. SP-154 is extensively employed in the preparation of general purpose and heat-activating polychloroprene cements. It can also be used in formulating adhesives NBR, SBR, natural and reclaimed rubbers.

Si Group Hrj-10416 product card banner

SI Group

SI Group HRJ-10416

Product Families: Other Thermoset Resins

Chemical Family: Phenol Formaldehyde (PF)

Polymer Name: Phenol Formaldehyde (PF)

HRJ-10416 is a butylphenol-formaldehyde thermosetting resin in aqueous suspension form. It was primarily designed for use in contact cements but has found use in other areas.

Durez™ Sumikon Pm-9640 product card banner

Sumitomo Bakelite Company

Durez™ SUMIKON PM-9640

Brand: Durez

Applications: Other Automotive Applications

Product Families: Other Thermoset Resins

Chemical Family: Phenols & Phenolics

Polymer Name: Phenolic Compound

End Uses: Automotive Applications

Durez™ SUMIKON PM-9640 by Sumitomo Bakelite Company is comprised of Phenolic Compound. It is commonly used as Molding Resin for a variety of applications in Automotive. Durez™ SUMIKON PM-9640 is certified as UL Flame Rated. It is available in Granules form.

Gp Cl-7004 product card banner

Georgia-Pacific Chemicals

GP CL-7004

Brand: GP

Applications: Architectural Coatings, Industrial Coatings, Industrial Maintenance

Product Families: Other Resins & Binders, Rheology Modifiers & Stabilizers, Functional Additives

Chemical Family: Phenols & Phenolics

GP® CL-7004 phenolic resin from Georgia-Pacific Chemicals is a thermoplastic novolac. It is used as a crosslinking resin for epoxy and polyester resins. Its low phenol content, convenient softening point, and melt viscosity are conducive for use in powder coatings.

Si Group Crj-418 product card banner

SI Group

SI Group CRJ-418

Product Families: Other Thermoset Resins

CRJ-418 is a thermoplastic resin made from octylphenol and formaldehyde. It is a tackifier resin, compatible with various synthetic rubbers, it is used by all tire and rubber goods manufactures. CRJ-418 tackifier resin is readily dissolved in solvent (aromatic and aliphatic hydrocarbons), easily blended into rubber stock.

Epo-tek® Oe132-43 product card banner

Epoxy Technology Inc.

EPO-TEK® OE132-43

Brand: EPO-TEK

Applications: Other Semiconductor Applications, Other Devices & Assemblies, Other Medical Applications

Product Families: Other Thermoset Resins

Chemical Family: Polyimides (PI)

Polymer Name: Thermoset Polyimide (PI)

End Uses: Semiconductor Molding Compounds, Electrical/Electronic Applications, Medical/Healthcare Applications

A single component, solvent containing, low viscosity polyimide designed for high temperature applications found in semiconductor, hybrid, optical, and medical devices. It is used mostly as a coating and dielectric layer. It can be used at high temperatures. It is a REACH compliant version of EPO-TEK OE132.Formerly 108-43-3

Si Group Sp-6280 product card banner

SI Group

SI Group SP-6280

Applications: Chassis & Brake

Product Families: Other Thermoset Resins

Polymer Name: Phenol Formaldehyde (PF)

SP 6280 is a modified thermosetting phenolic novolak resin powder. The resin shows good binder properties towards aggregates and fillers. The resin contains hexamethylene tetramine (hexa) as a crosslinking agent. SP 6280 is used as a heat-resistant binder in brake blocks, including medium to heavy duty truck brake blocks. It imparts very good heat stability and fade resistance. Its low melt viscosity and long flow are advantageous if the material is being utilized in formulations with a higher fiber content. The resin has also been applied in disc pad formulations and transmission parts.

Si Group Hrj-1367 product card banner

SI Group

SI Group HRJ-1367

Product Families: Other Thermoset Resins

HRJ-1367 is an oil-soluble, heat-reactive, phenolic resin based on a para-substituted alkylphenol. This resin is used in the formulation of polychloroprene contact cements with good green strength and heat resistance.

Si Group Sp-553 product card banner

SI Group

SI Group SP-553

Product Families: Other Thermoset Resins

Polymer Name: Terpene Phenolic Resin

SP-553 Resin is an oil-soluble, thermoplastic, terpenephenolic resin having a wide compatibility range. The largest end-use application is as a tackifier for solventborne and hot-melt adhesives. SP-553 Resin is used to increase the tack retention of both polychloroprene and SBR adhesives. In the case of polychloroprene adhesives, the use of excessive amounts of this resin will cause a considerable reduction in the cohesive strength of the adhesive film.

Epo-tek® P1011 product card banner

Epoxy Technology Inc.

EPO-TEK® P1011

Brand: EPO-TEK

Applications: Other Semiconductor Applications, Other Parts & Components, Other Devices & Assemblies

Product Families: Other Thermoset Resins

Chemical Family: Polyimides (PI)

Polymer Name: Thermoset Polyimide (PI)

End Uses: Semiconductor Molding Compounds, Electrical Components, Electrical/Electronic Applications

EPO-TEK® P-1011 is a single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications.

Rezilite® 888 product card banner

SI Group

Rezilite® 888

Brand: Rezilite

Product Families: Other Thermoset Resins

Rezilite 888 is a reactive alkylphenol-formaldehyde resin. The exceptional features of this resin are its light color and high reactivity. Rezilite 888 is recommended where high performance solvent-based polychloroprene adhesives are needed. It is possibly to combine Rezilite 888 with other phenolic resins to optimize properties such as resistance to heat, open time, and the solids/viscosity relationship.

Si Group Hrj-11112 product card banner

SI Group

SI Group HRJ-11112

Product Families: Other Thermoset Resins

Polymer Name: Terpene Phenolic Resin

HRJ-11112 is an aqueous emulsion of a thermoplastic terpene-phenolic resin with a small particle size. The base resin in this emulsion is SP-560, which is noted for its high melting point. HRJ-11112 has been specifically designed to be compatible with polychloroprene latex systems that have a high pH. Other high pH elastomer latex systems can also be used as long as the stabilizer systems are compatible.

Si Group Sp-6877 product card banner

SI Group

SI Group SP-6877

Product Families: Other Thermoset Resins

SP-6877 is a salt-free, water-borne and water-dilutable thermosetting phenolformaldehyde resin supplied in solution form. This material is a general purpose resin that has found application as a dust suppressant for fibrous composites, as a saturating resin for paper and wood, as a binder for molding compositions and as an ingredient in various metal coating applications.

Si Group Hrj-13804 product card banner

SI Group

SI Group HRJ-13804

Product Families: Other Thermoset Resins

HRJ-13804 is a rosin modified cresol-formaldehyde thermosetting resin. HRJ-13804 is supplied as a solution in propylene glycol monomethyl ether, n-butanol and isobutanol. This resin is primarily designed for use in metal coating formulations where a darker colored film is desired but is also useful in various other applications.

Carbonresin™ Ce 220 product card banner

Carbon Inc.

CarbonResin™ CE 220

Brand: CarbonResin

Applications: Powertrain & UTH, Other Devices & Assemblies, Other Industrial Applications

Product Families: Photoactive Resins, Other Thermoset Resins

Polymer Name: Cyanate Ester Resin

End Uses: Automotive Under The Hood, Electrical/Electronic Applications, Industrial Applications

CE 220 is a high performance material with excellent strength, stiffness and thermal stability that is a good choice for use at elevated temperatures. CE is comparable to glass-filled nylon.

Durez™ 32633 product card banner

Sumitomo Bakelite Company

Durez™ 32633

Brand: Durez

Applications: Other Automotive Applications, Other Devices & Assemblies

Product Families: Other Thermoset Resins

Chemical Family: Phenols & Phenolics

Polymer Name: Phenolic Compound

End Uses: Automotive Applications, Electrical/Electronic Applications

Durez™ 32633 by Sumitomo Bakelite Company is comprised of Phenolic Compound. It is commonly used as Molding Resin for a variety of applications in Automotive. Durez™ 32633 is certified as UL Flame Rated. It is available in Granules form.

Durez™ 31735 product card banner

Sumitomo Bakelite Company

Durez™ 31735

Brand: Durez

Applications: Other Automotive Applications

Product Families: Other Thermoset Resins

Chemical Family: Phenols & Phenolics

Polymer Name: Phenolic Compound

End Uses: Automotive Applications

Durez™ 31735 by Sumitomo Bakelite Company is comprised of Phenolic Compound. It is commonly used as Molding Resin for a variety of applications in Automotive. It is available in Granules form.

Metton America Metton Lmr M15xx product card banner

Metton America

Metton America Metton LMR M15XX

Applications: Other Industrial Applications, Body Armor, Advanced Materials

Product Families: Other Engineering Plastics, Other Thermoset Resins

Chemical Family: Olefins

Polymer Name: Dicyclopentadiene (DCPD)

End Uses: Military Applications, Fenders, Automotive Under The Hood

The Metton LMR product family includes a standard M15XX product line and a flame-retardant product which meets the requirements for classification as U.L. V-O. The Metton M15XX includes the products M1534, M1537, M1539 and M1540.METTON provides part design freedom with integrated functionality and part consolidation opportunities similar to injection molding for replacement of traditional materials such as wood and metal. Low internal mold pressures (15 to 30 psi.) allow part sizes up to 120 ft² (9 m²) in closed molds such as machined aluminum, nickel shell or cast aluminum. Adhesion to paint and structural adhesives is excellent

Envisiontec E-guard product card banner

EnvisionTEC

EnvisionTEC E-GUARD

Applications: Dental Adhesives & Sealants, 3D Printing, Dental

Product Families: Photoactive Resins

Polymer Name: Thermoset (unspecified)

EnvisionTEC’s FDA-approved E-Guard material is a biocompatible, crystal clear material for the production of accurate splints and retainers. The results produced by combining E-Gard with EnvisionTEC technology are superior to traditional methods of manufacturing bite guards and night guards.

Metton America Metton Lmr M2100vo product card banner

Metton America

Metton America Metton LMR M2100VO

Applications: Other Industrial Applications, Body Armor, Advanced Materials

Product Families: Other Engineering Plastics, Other Thermoset Resins

Chemical Family: Olefins

Polymer Name: Dicyclopentadiene (DCPD)

End Uses: Military Applications, Fenders, Automotive Under The Hood

METTON provides part design freedom with integrated functionality and part consolidation opportunities similar to injection molding for replacement of traditional materials such as wood and metal. Low internal mold pressures (15 to 30 psi.) allow part sizes up to 120 ft² (9 m²) in closed molds such as machined aluminum, nickel shell or cast aluminum. Adhesion to paint and structural adhesives is excellent

Urochem 162 product card banner

Chemiplastica

Urochem 162

Brand: Urochem

Applications: Circuit Breakers

Product Families: Other Thermoset Resins

Polymer Name: Urea Formaldehyde Resin (UF)

End Uses: Electrical Components

Urea- formaldehyde resins fortified with highly refined cellulose as filler, and further modified with minor amounts of special purpose additives, pigments, cure regulators and lubricants. The Urochem 162 Moulding Compounds can be supplied in an almost unlimited range of colours from translucent light pastels to black. Hard, glossy and scratch resistant surface. Excellent chemical resistance. Fats, oils and common organic solvents like alcohol and acetone do not attack moulded parts which are also resistant to surfactants and weak bases. They will withstand attack from weak acids for a shorter duration. Excellent electrical properties (arc quenching, tracking, flame resistance). Oxygen index of 30% is achieved without the use of external flame retardants. No halogens are present in the composition.

Si Group Brj-473 product card banner

SI Group

SI Group BRJ-473

Product Families: Other Thermoset Resins

BRJ-473 is a thermosetting phenolic resin used primarily in the formulation of nitrile rubber (NBR) adhesives. BRJ-473 is supplies as a solution in methyl-ethyl-ketone (MEK). BRJ-473 can be easily blended directily into solutions of rubber.

Epo-tek® Tv1003 product card banner

Epoxy Technology Inc.

EPO-TEK® TV1003

Brand: EPO-TEK

Applications: Other Semiconductor Applications, Printed Circuit Boards (PCBs), Other Parts & Components

Product Families: Other Thermoset Resins

Chemical Family: Polyimides (PI)

Polymer Name: Thermoset Polyimide (PI)

End Uses: Semiconductor Molding Compounds, Printed Circuit Boards, Electrical Components

A single component, screen printable polyimide adhesive designed for semiconductor wafer passivation applications. It is a high temperature chemistry capable of resisting >400°C seen in back-end wafer fabrication processes. Coating thicknesses of 10-90 um may be achieved. Ultra fine print definition, high Tg, low outgassing, and ionic cleanliness are a few of its traits. It is an increased dielectric strength of EPO-TEK® TV1002.Formerly 78-119

Si Group Hrj-10518-lx product card banner

SI Group

SI Group HRJ-10518-LX

Product Families: Other Thermoset Resins

HRJ-10518-LX is a heat-reactive resin made from octylphenol and formaldehyde. This resin contains active hydroxymethyl (methylol) groups, and was developed specifically to cure natural rubber. HRJ-10518-LX crosslinks ruber through C-C bridges. This results in an inherent ozone-resistant and heat-resistant cured rubber system which has many end uses such as tire curing bags, conveyor belts, gaskets, and heat-resistant packings.

Si Group Hrj-10518 product card banner

SI Group

SI Group HRJ-10518

Product Families: Other Thermoset Resins

HRJ-10518 is a heat-reactive resin made from octylphenol and formaldehyde. This resin contains active hydroxymethyl (methylol) groups, and was developed specifically to cure natural rubber. Many other unsaturated elastomers can be cured by HRJ-10518 via the resin cure system. HRJ-10518 was designed to provide a rapid cure at normal curing temperatures, or to promote adequate cure at lower temperatures. HRJ-10518 can also be used to formulate pressure sensitive adhesives, inks, and thermoplastic elastomers.