Resicure® EMI-24

1 of 4 products in this brand
Resicure® EMI-24 is commonly used as a sole curing agent or as a dicy and anhydride cure accelerator in epoxy resin based formulations. Typical loading level as a sole curing agent is about 1-5 phr and as a dicy and anhydride cure accelerator is about 0.5 – 3.0 phr. Resicure EMI-24 LV is a lower viscosity version of Resicure EMI-24.

Functions: Curing Agent

Chemical Family: Amines

Compatible Polymers & Resins: Epoxies (EP)

Features: Chemical Resistance

Technical Data Sheet

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Identification & Functionality

Chemical Family
CASE Ingredients Functions
Technologies
Chemical Structure

Resicure® EMI-24 - Chemical Structure

Features & Benefits

CASE Ingredients Features
Advantages
  • Rapid reactivity at temperature <100°C with 9-12 hours latency
  • High glass transition temperature
  • High chemical resistance

Applications & Uses

Compatible Polymers & Resins
Adhesive & Sealant Type
Applications
  • One-component adhesives for electronics applications
  • Composites such as pre-pregs and filament winding
  • Electrical potting and encapsulation

Properties

Physical Form
Appearance
Amber to brownish liquid
Typical Properties
ValueUnitsTest Method / Conditions
Viscosity at (25°C)9600cPs
Assaymin. 85%
Color (Gardener)16 max.
Moisture ContentMax. 0.4%
Recommended use level with Epoxy resin (EEW=190)1-5 PHR