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ADM® Thermal Bonding Enhancer

ADM ® Thermal Bonding Enhancer is a carbon based additive for starch based adhesives for the corrugated cardboard industry. It is an additive used to improve the performance of starches used in corrugating applications.

Functions: Adhesion Promoter, Coupling Agent

End Uses: Starch Adhesive

Labeling Claims: Non-GMO, Odor-free, Sustainable

Features: Better Flatness, Cost Effective, Fast Cure, High Bond Strength, High Performance, High Thermal Conductivity, Improved Dry Time, Improved Performance, Improved Quality, Improves Adhesion, Improves Thermal Bonding, Low Temperature Performance, Reduced Delamination, Reduces Carbon Footprint

Enhanced TDS

Knowde-enriched technical product data sheet

Identification & Functionality

Country of Origin
CASE Ingredients Functions
Technologies
Product Families

Features & Benefits

Applications & Uses

Markets
Applications
Compatible Substrates & Surfaces
Adhesive & Sealant End Applications

Properties

Physical Form
Appearance
Yellow-brown liquid.
Specifications
ValueUnitsTest Method / Conditions
Solid Contentmax. 5%EX087 - Solids
pH3.8 - 4.3-EX088 - pH
Viscosity1 - 2cpsEX089 - Viscosity
Storage Temperature20 - 50°C-

Regulatory & Compliance

Certifications & Compliance

Packaging & Availability

Packaging Type
Packaging Information

Drum, 220 liters; Four drums on a pallet.

Storage & Handling

Shelf Life
540 days
Storage Conditions and Shelf Life

Storage Conditions : Cool dry place in temperatures between 20°C and 50°C. Keep from freezing.