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Aegis® H8202NLB

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Polymer Name: Polyamide 6 (PA 6)
Processing Methods: Injection Molding, Compounding
Flexural Modulus: 3010.0 MPa
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TypeDocument Name
Aegis® Nylon 6 Packaging Grade Resins Brochure
Aegis® Nylon 6 Packaging Grade Resins Brochure
Technical Data Sheet
Aegis® H8202NLB Technical Data Sheet
Aegis® H8202NLB Technical Data Sheet
Technical Data Sheet
AdvanSix Resins & Films for Packaging
AdvanSix Resins & Films for Packaging

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Identification & Functionality

Chemical Family
Polymer Name
Plastics & Elastomers Functions

Aegis® H8202NLB Features & Benefits

Applications & Uses

Processing Guidelines

Material Handling

Aegis® H8202NLB homopolymer is supplied in sealed containers and drying prior to processing is not required. However, high moisture is the primary cause of processing problems. If drying becomes necessary, a dehumidifying or desiccant dryer operating at 80°C (176°F) is recommended. Drying time is dependent on moisture level.


Physical Form
Typical Properties
ValueUnitsTest Method / Conditions
96% SAV2.61--
Rockwell Hardness119Scale RASTM D-785
Coefficient of Linear Thermal Expansion83μm/mm °CASTM D-831
Density1.13g/cm3ASTM D-792
Elongation Break (at 23°C (73°F))55%ASTM D-638
Elongation Yield (at 23°C (73°F))4%ASTM D-638
Extractable Contentmax. 0.8%SOP-702-307
Flexural Modulus (at 23°C (73°F))3,010 (436,000)MPa (psi)ASTM D-790
Flexural Strength (at 23°C (73°F))110 (15,900)MPa (psi)ASTM D-790
Heat Deflection (at 264 psi (1.8 MPa))65 (149)°C (°F)ASTM D-648
Heat Deflection (at 66 psi (0.45 MPa))178 (352)°C (°F)ASTM D-648
Melt Flow Rate (at 235°C/1.0 kg (455°F/1.0 kg))9.8g/10 minASTM D-1238
Melting Point220 (428)°C (°F)ASTM D-3418
Moisture (24 Hour)1.6%ASTM D-570
Moisture (50% RH)2.7%ASTM D-570
Moisture (Saturation)9.5%ASTM D-570
Moisture Contentmax. 0.10%ASTM D-6869
Mold Shrinkage Linear Flow1.28%ASTM D-955
Notched Izod Impact (at 23°C (73°F))60 (1.1)J/m (ft-lbs/in)ASTM D-256
Notched Izod Impact (at -40°C (-40°F))50 (0.9)J/m (ft-lbs/in)ASTM D-256
Tensile Modulus (at 23°C (73°F))2,850 (413,500)MPa (psi)ASTM D-638
Tensile Strength Yield (at 23°C (73°F))79 (11,500)MPa (psi)ASTM D-638
Viscosity (FAV)49+/-3-ASTM D-789

Technical Details & Test Data

Injection Molding Guidelines

Typical Profile

Melt Temperature: 240-280°C (464-536°F)
Mold Temperature: 80-95°C (176-203°F)
Injection and Packing Pressure: 35-125 bar (500-1500 psi)

Mold Temperatures

A mold temperature of 80-95°C (176-203°F) is recommended, but temperatures as low as 10°C (50°F) can be used where applicable.


Injection pressure controls the filling of the part and should not be applied for 90% of ram travel. Packing pressure affects the final part and can be used effectively in controlling sink marks and shrinkage. It should be applied and maintained until the gate area is completely frozen off.

Fill Rate

Fast fill rates are recommended to ensure uniform melt delivery to the cavity and to prevent premature freezing.

Aegis® H8202NLB