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Aegis® H55C2ZP
Polymer Name:
Polyamide 6/66 (PA 6/66)
Processing Methods:
Extrusion, Injection Molding, Compounding, Extrusion Coating
Aegis® H55C2ZP is a 2.7 RV, unfilled, medium viscosity, non-lubricated, polyamide 6/66 copolymer for molding or compounding. With a broad processing window and excellent melt fluidity for filling thin sections, it provides exceptional processability. Aegis® H55C2ZP resin combines strength, stiffness and toughness with chemical and abrasion resistance. For glass- or mineral-filled applications, Aegis® H55C2ZP resin also offers superior surface appearance and low warp.