- Product Families:Pressure Sensitive Adhesives & Tapes, Adhesives & Sealants
COOL BOND® CB7208 EDA2 is a modified version of TPT208 designed to have improved bond strength at elevated temperature. CB7208-EDA2 is an aluminum nitride filled, low bond strength thermoplastic film adhesive. It is designed for bonding heat sinks, component, and substrate. CB7208- EDA2 has good thermal conductivity. As applied, it provides >100 psi bond strength that will improve to over 600 psi in-situ over time.