AI Technology ME 7159-LB

Product Type: Insulation Adhesive, Thermal Adhesive

Application Area: Appliances, Die/Chip Attach, Printed Electronics

Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Applications & Uses

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Dielectric Strengthmin. 750Volts/mil
Bond Line After Set Inmax. 10microns
Device Push Off Strengthmin. 1000psi
Thermal Resistance (at 0.0005 inch layer)0.0025in/watt
Cured Density2.5g/cc
Bond Strength2000psi
Thermal Conductivitymin. 12W/m-°C
Maximum Continuous Operation Temperaturemin. 150°C
Electrical Resistivitymin. 10¹⁴Ω-cm

Regulatory & Compliance

Certifications & Compliance