Knowde Enhanced TDS
Identification & Functionality
- Product Type
- Technologies
Features & Benefits
- Ready-to-Use Product Features
Applications & Uses
- Applications
- Application Area
Properties
- Typical Properties
Value | Units | Test Method / Conditions | |
Dielectric Strength | min. 750 | Volts/mil | — |
Bond Line After Set In | max. 10 | microns | — |
Device Push Off Strength | min. 1000 | psi | — |
Thermal Resistance (at 0.0005 inch layer) | 0.0025 | in/watt | — |
Cured Density | 2.5 | g/cc | — |
Bond Strength | 2000 | psi | — |
Thermal Conductivity | min. 12 | W/m-°C | — |
Maximum Continuous Operation Temperature | min. 150 | °C | — |
Electrical Resistivity | min. 10¹⁴ | Ω-cm | — |
Regulatory & Compliance
- Certifications & Compliance