Knowde Enhanced TDS
Identification & Functionality
- Product Type
- Technologies
Features & Benefits
- Ready-to-Use Product Features
- Features & Benefits
- Stress free
- Moisture resistant
Applications & Uses
- Applications
- Applications
ME 7556-DA manages heat and stress, while bonding critical components within satellites, particle accelerators, airplanes, as well as cell phones and memory modules.
Properties
- Typical Properties
Value | Units | Test Method / Conditions | |
Electrical Resistivity | 1x10¹⁴ | Ω-cm | — |
Thermal Conductivity | 3.6 | W/m-°C | — |
Die Shear Strength | 1600 | psi | — |
Glass Transition Temperature | -55 | °C | — |
Viscosity (at 5 rpm) | 20 | kcPs | — |
Regulatory & Compliance
- Certifications & Compliance
- Quality Standards