Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Product Features
- Stress free.
- 100% solid.
- Reworkable.
- Electrically conductive.
- Epoxy paste adhesive.
- Snap curing.
- Large area die.
- Automated assembly.
- Reworkability.
- Mismatched CTE's.
Applications & Uses
- Applications
- Application Area
- Application Procedures
- Thaw for 30 minutes before opening jar.
- Dispense adhesive onto clean substrate.
- Cure according to one of the recommended schedules.
Properties
- Physical Form
- Typical Properties
Value | Units | Test Method / Conditions | |
Thermal Conductivity | min. 7.9 | W/m-°C | — |
Die Shear Strength | min. 1800 | psi | — |
Die Shear Strength | min. 2000 | psi | — |
Glass Transition Temperature | -22 to -18 | °C | — |
Electrical Resistivity (at 150°C, 30minutes) | max. 4x10⁻⁴ | Ω-cm | — |
Current Carrying Capabilities | 35 | Amp/mm² | — |
Lap Shear Strength | min. 6.9 | N/mm² | — |
Lap Shear Strength | min. 6.9 | N/mm² | — |
Device Push Off Strength | min. 13.8 | N/mm² | — |
Hardness | 72 - 88 | Shore D | — |
Cured Density | 3.15 - 3.85 | g/cc | — |
Coefficeint of Linear Thermal Expansion | 102 - 138 | ppm/°C | — |
Maximum Continuous Operation Temperature | max. 175 | °C | — |
Pot Life (at 25°C) | 5 | Days | — |
Average Viscosity (at 24°C, 0.5rpm, Spindle CP51) | 204000 - 306000 | cPs | Brookfield Viscometer DV-1 |
Regulatory & Compliance
- Certifications & Compliance
Technical Details & Test Data
- Cure Schedules
Temperature Time 100°C 2 hrs 125°C 1 hr 150°C 30 mins Pot life is greater than 5 days at ambient of 25°C or below.
Packaging & Availability
- Product Availability
ME8452-A is available in syringes for automatic needle dispense applications or in jars. Both viscosity and thixotropic index can be modified to your specific needs.
Storage & Handling
- Shelf Life
- 1 Year (at -40°C), 3 Months (at 0°C)
- Storage Information
Storage temperature: -40°C, 0°C.