AI Technology ME 8452-A

ME8452-A is an accelerated version of ME8452 for snap-curing applications.This novel silver-filled paste is reworkable, solvent free, and electrically and thermally conductive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE'S (i.e., alumina to aluminum, silicon to copper). It can be readily reworked from 80°C to 100°C and is ideal for applications such as large area die attach and substrate attach because of its ability to bond materials with highly mismatched CTE.

Product Type: Conductive Adhesive, Epoxy Adhesive, Solvent free (100% Solids) Adhesive, Thermal Adhesive

Application Area: Die/Chip Attach, Soldering

Compatible Substrates & Surfaces: Aluminum, Copper, Metal, Silicon

Chemical Family: Epoxy & Epoxy Derivatives

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Product Features
  • Stress free.
  • 100% solid.
  • Reworkable.
  • Electrically conductive.
  • Epoxy paste adhesive.
  • Snap curing.
  • Large area die.
  • Automated assembly.
  • Reworkability.
  • Mismatched CTE's.

Applications & Uses

Compatible Substrates & Surfaces
Application Procedures
  • Thaw for 30 minutes before opening jar.
  • Dispense adhesive onto clean substrate.
  • Cure according to one of the recommended schedules.

Properties

Physical Form
Typical Properties
ValueUnitsTest Method / Conditions
Thermal Conductivitymin. 7.9W/m-°C
Die Shear Strengthmin. 1800psi
Die Shear Strengthmin. 2000psi
Glass Transition Temperature-22 to -18°C
Electrical Resistivity (at 150°C, 30minutes)max. 4x10⁻⁴Ω-cm
Current Carrying Capabilities35Amp/mm²
Lap Shear Strengthmin. 6.9N/mm²
Lap Shear Strengthmin. 6.9N/mm²
Device Push Off Strengthmin. 13.8N/mm²
Hardness72 - 88Shore D
Cured Density3.15 - 3.85g/cc
Coefficeint of Linear Thermal Expansion102 - 138ppm/°C
Maximum Continuous Operation Temperaturemax. 175°C
Pot Life (at 25°C)5Days
Average Viscosity (at 24°C, 0.5rpm, Spindle CP51)204000 - 306000cPsBrookfield Viscometer DV-1

Regulatory & Compliance

Certifications & Compliance

Technical Details & Test Data

Cure Schedules
Temperature Time
100°C 2 hrs
125°C 1 hr
150°C 30 mins

Pot life is greater than 5 days at ambient of 25°C or below.

Packaging & Availability

Product Availability

ME8452-A is available in syringes for automatic needle dispense applications or in jars. Both viscosity and thixotropic index can be modified to your specific needs.

Storage & Handling

Shelf Life
1 Year (at -40°C), 3 Months (at 0°C)
Storage Information

Storage temperature: -40°C, 0°C.