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26 Products found on AI Technology in
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AI Technology TP 7209
Applications:
Equipment & Parts, Semiconductor Manufacturing, Appliances & Electronics
Product Families:
Pressure Sensitive Adhesives & Tapes, Adhesives & Sealants
TP7209 is a low bond strength thermoplastic film adhesive. It is designed for bonding heat-sink, component, and substrate. This unique diamond flled material has excellent thermal conductivity and is tacky at room temperature.
AI Technology LESP 7670-HF
Applications:
Appliances & Electronics, Equipment & Parts, Adhesives & Sealants
Product Families:
Conductive Adhesives, Adhesives & Sealants
COOL GREASE® CGR 7559 LB
Applications:
Equipment & Parts, Automotive Electronics, Devices & Assemblies
Product Families:
Greases, Fluids & Lubricants
AI Technology EG 7635
Applications:
Appliances & Electronics, Equipment & Parts, Semiconductor Manufacturing
Product Families:
Other Adhesives & Sealants, Adhesives & Sealants
Chemical Family:
Epoxy & Epoxy Derivatives
EG7635 is a alumina filled, electrically insulating and thermally conductive rigid epoxy paste adhesive. While bonding at ambient temperature can be achieved overnight, elevated temperatures will accelerate curing, exponentially. EG7635 high thermal conductivity and high strength makes it excellent for bonding substrates, components and heat sinks where thermal management is critical. It has more than 15 years of proven records of providing bonding to difficult substrates. EG7635 exibits reduced bond strength at 80-100°C for easier rework.
AI Technology ME 8155
Applications:
Textile Manufacturing, Textile Coatings & Inks, Adhesives & Sealants
Product Families:
Conductive Adhesives, Adhesives & Sealants
ME8155 is a silver filled paste, reworkable, solvent free, and electrically and thermally conductive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). This paste can be used for screen printing and it can be readily reworked at 80-100°C.
AI Technology CXP 8450
Applications:
Equipment & Parts, Semiconductor Manufacturing, Appliances & Electronics
Product Families:
Conductive Adhesives, Adhesives & Sealants
COOL GREASE® CGR 8550
Applications:
Equipment & Parts, Renewable Energy, Chemical & Industrial Manufacturing
Product Families:
Greases, Fluids & Lubricants
AI Technology ME 7630-RC
Applications:
Advanced Materials, Consumer Electronics, Devices & Assemblies
Product Families:
Other Adhesives & Sealants, Adhesives & Sealants
AI Technology ME 7857-SC
Applications:
Consumer Electronics, Equipment & Parts, Semiconductor Manufacturing
Product Families:
Conductive Adhesives, Adhesives & Sealants
ME7857-SC is a medium viscosity, silicon carbide filled, flexible epoxy for snap curing application. It is a reworkable, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility down to -60°C. Ideal for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The stress-free flexible adhesive maintains good stable bond strength of 100 psi from 150-250°C and has outstanding thermal stability.
AI Technology LRTK 7660-HF
Applications:
Appliances & Electronics, Equipment & Parts, Adhesives & Sealants
Product Families:
Conductive Adhesives, Adhesives & Sealants
COOL GREASE® CGR 7015
Applications:
Equipment & Parts, Semiconductor Manufacturing, Parts & Components
Product Families:
Greases, Fluids & Lubricants
AI Technology SPG 8055
Applications:
Advanced Materials, Printed Circuit Boards (PCBs), Parts & Components
Product Families:
Parts, Shapes & Films
Chemical Family:
Silicones
End Uses:
Gaskets, Military Applications
AI Technology TP 8205
Applications:
Equipment & Parts, Semiconductor Manufacturing, Appliances & Electronics
Product Families:
Pressure Sensitive Adhesives & Tapes, Adhesives & Sealants
TP8205 is a silver filled, low bond strength thermoplastic film adhesive. It is designed for bonding heat sink, component, and substrate. It is electrically and thermally conductive.
AI Technology TP 7205
Applications:
Equipment & Parts, Semiconductor Manufacturing, Appliances & Electronics
Product Families:
Pressure Sensitive Adhesives & Tapes, Adhesives & Sealants
TP7205 is an alumina filled, low bond strength thermoplastic film adhesive. It is designed for bonding heat-sink, component, and substrate. TP7205 has good thermal conductivity and is tacky at room temperature. The adhesive film typically can be used for most applications at temperature from -65 to 150°C. Customers must test the adhesive for their specific application to confirm its suitability.
AI Technology SR 8850-3
Applications:
Industrial Manufacturing, Industrial Adhesives & Sealants, Sealants & Caulks
Product Families:
Conductive Adhesives, Caulks & Sealants, Adhesives & Sealants
Chemical Family:
Silicones
COOL GREASE® CGR 7016
Applications:
Equipment & Parts, Semiconductor Manufacturing, Parts & Components
Product Families:
Greases, Fluids & Lubricants
COOL GREASE® CGR 7093
Applications:
Equipment & Parts, Renewable Energy, Chemical & Industrial Manufacturing
Product Families:
Greases, Fluids & Lubricants
AI Technology EG 7655
Applications:
Appliances & Electronics, Equipment & Parts, Adhesives & Sealants
Product Families:
Other Adhesives & Sealants, Adhesives & Sealants
Chemical Family:
Epoxy & Epoxy Derivatives
EG7655 is a reworkable, alumina filled, electrically insulating and thermally conductive epoxy paste adhesive which exhibits outstanding flexibility for bonding materials with highly mismatched CTE'S (i.e., alumina to aluminum, silicon to copper). EG7655's high thermal conductivity and flexibility make it excellent for bonding large area substrates, components and heat sinks where thermal management is critical. EG7655 exhibits reduced bond strength at 80-100°C for easier rework. The cured adhesive is flexible with Type A hardness of 80 and tensile elongation of more than 30%.
AI Technology SR 8850-2
Applications:
Industrial Manufacturing, Industrial Adhesives & Sealants, Sealants & Caulks
Product Families:
Conductive Adhesives, Caulks & Sealants, Adhesives & Sealants
Chemical Family:
Silicones
SR8850-2 is a pure silver-plated copper filled conductive RTV silicone sealant. This one-component electrically conductive silicone adhesive cures at room temperature when exposed to atmospheric moisture.The material has no corrosive by-products and has good adhesion properties to metals, plastics, silicones, ceramics and glass. SR8850-2 is provided as a one-part electrically conductive elastomer silicone adhesive sealant with a compatible primer. The adhesive has a continuous operating temperature of 125°C while conductivity is maintained when exposed to temperatures up to 200°C. The silicone cures when exposed to atmospheric conditions. The typical curing schedule is 48 hours at 25°Cand 60% relative humidity.
AI Technology ESP 7455
Applications:
Equipment & Parts, Semiconductor Manufacturing, Adhesives & Sealants
Product Families:
Other Adhesives & Sealants, Adhesives & Sealants
Chemical Family:
Epoxy & Epoxy Derivatives
Tack-Free ESP 7455 is an alumina-filled, epoxy film adhesive designed for bonding component and substrate to a mismatched substrate or carrier. The dry, tack-free handling of the film makes it suitable for an automated assembly. The adhesive film has very low ionic impurities of less than 10 ppm and high thermal stability with TGA degradation at 450°C. ESP7455 has good thermal conductivity. The extra low Tg of -60°C helps to minimize thermal stress on the bonded parts during thermal cycling or shock testing from -55 to 150°C.
AI Technology EG 7658
Applications:
Equipment & Parts, Semiconductor Manufacturing, Adhesives & Sealants
Product Families:
Conductive Adhesives, Adhesives & Sealants
Chemical Family:
Epoxy & Epoxy Derivatives
EG7658 is a reworkable, aluminum nitride filled, electrically insulating and thermally conductive epoxy paste adhesive. It which exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (ie., alumina to aluminum, silicon to copper). The high thermal conductivity and flexibility make it excellent for bonding high-powered, large area die and components. EG7658 can be reworked using temperatures higher than the cure temperature from 80-150°C to soften the bond line. Use a tool adequate to break the bond and remove. Clean any residue with a solvent which will not damage the parts.
AI Technology ME 8650-RCT
Applications:
Semiconductor Manufacturing, Appliances & Electronics, Advanced Materials
Product Families:
Other Adhesives & Sealants, Adhesives & Sealants
AI Technology MC 7888
Applications:
Equipment & Parts, Semiconductor Manufacturing, Appliances & Electronics
Product Families:
Other Adhesives & Sealants, Adhesives & Sealants
AI Technology LS-SC 7150
Applications:
Equipment & Parts, Semiconductor Manufacturing, Appliances & Electronics
Product Families:
Conductive Adhesives, Adhesives & Sealants
FLUOROSEAL® LS-UVF 7350
Applications:
Equipment & Parts, Semiconductor Manufacturing, Appliances & Electronics
Product Families:
Conductive Adhesives, Adhesives & Sealants
COOL GREASE® CGR 7018
Applications:
Equipment & Parts, Semiconductor Manufacturing, Parts & Components
Product Families:
Greases, Fluids & Lubricants