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Arlon Electronic Materials Brand
All Arlon Electronic Materials
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34 Products found on Arlon Electronic Materials
Arlon® 35N
Polymer Name:
Polyimide (PI)
Functions:
Laminate, Prepreg
End Uses:
PCB Materials
35N is a pure polyimide laminate and prepreg system for applications requiring high temperature performance. High Tg (250°C) results in low Z-direction expansion for resistance to PTH failure during PWB processing, and minimizes risk of latent PTH defects in-service. Reduced temperature and time to cure offers improved throughput compared to traditional polyimide cycles.
Arlon® 85N
Polymer Name:
Polyimide (PI)
Functions:
Laminate, Prepreg
85N is the ultimate polyimide and laminate prepreg system fo PWB's requiring resistance to high temperature, both in process and in end-use applications. Bromine-free chemistry provides Bestin-Class thermal stability for applications with sustained high in-use temperatures as well as for use in lead-free soldering applications.
Arlon® 25N
Polymer Name:
Polytetrafluoroethylene (PTFE)
Processing Methods:
Injection Molding
Fillers Included:
Glass Fiber, Ceramic, Ceramic Fiber
Arlon 25N and 25FR are woven fiberglass reinforced, ceramic-filled composite materials engineered for use in microwave and RF multilayer printed circuit boards. Combining a non-polar thermoset resin system with a controlled-expansion ceramic filler, 25N and 25FR offer low dielectric constant and loss combined with a low Thermal Coefficient of Dielectric Constant (TCEr) for signal stability over a wide ambient temperature range. Designed for use in multilayer packages, 25N and 25FR offer prepregs that are identical in chemical composition and physical properties with their copper clad laminates for a completely homogeneous finished package for optimal signal integrity.The low dielectric constant (Er) and loss properties, low thermal coefficient of dielectric constant (TCEr), and excellent physical stability characteristics offered by 25N and 25FR materials make them ideal for wireless and digital applications, such as cellular telephones, down converters, low noise amplifiers, antennas and other advanced des ign circuits.Processing for 25N and 25FR materials is consistent with processing for standard high temperature thermoset based printed circuit board substrates.
Arlon® AD350
Polymer Name:
Polytetrafluoroethylene (PTFE)
Processing Methods:
Injection Molding
Fillers Included:
Glass Fiber
Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications.The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates.Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.
Arlon® AD255
Polymer Name:
Polytetrafluoroethylene (PTFE)
Processing Methods:
Injection Molding
Fillers Included:
Glass Fiber
Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications.The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates.Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.
Arlon® 1000
Polymer Name:
Polyetheretherketone (PEEK)
Processing Methods:
Injection Molding
Greene, Tweed's Arlon® 1000, a tough, hig temperature, semi-crystalline thermoplastic, offers a unique combination of mechanical, thermal and chemical propertier. Arlon 1000 features superior compressive strength and minimum creep, as well as broad chemical resistance. Arlon is an excellent choice for applications such as valve seats and bushings greater abrasion resistance and lower wear and better fatigue properties than other thermoplastics.
Arlon® 85HP
Polymer Name:
Polyimide (PI)
Functions:
Laminate, Prepreg
End Uses:
Semiconductor Applications
Arlon 85HP’s unique blend of pure polyimide resin and micro-fi ne proprietary fi llers results in superior performance for demanding applications. Compared to conventional polyimide systems, 85HP has a lower Z-axis expansion and twice the thermal conductivity. 85HP reduces resin cracking and wicking in designs with high density plated through holes and vias. 85HP prepreg has resin fl ow characteristics and pressed thickness matching standard polyimides.
Arlon® 49N
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Injection Molding
End Uses:
Electrical/Electronic Applications
49N is a low-flow epoxy prepreg engineered for bonding multilayer epoxy rigid-flex or attaching heatsinks to multilayer epoxy PCBs. With a high Tg, the prepreg can be used in high-performance or hightemperature applications compared to a standard difunctional epoxy low-flow.
Arlon® AD270
Polymer Name:
Polytetrafluoroethylene (PTFE)
Processing Methods:
Injection Molding
Fillers Included:
Glass Fiber
Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications.The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates.Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.
Arlon® AD300
Polymer Name:
Polytetrafluoroethylene (PTFE)
Processing Methods:
Injection Molding
Fillers Included:
Glass Fiber
Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications.The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates.Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.
Arlon® 55NT
Functions:
Laminate
Reinforcement Material:
Aramid (Kevlar)
Processing Methods:
Continuous Lamination
55NT is an epoxy laminate and prepreg system, reinforced with a non-woven aramid substrate. This system combines compatibility with lead-free processing, using a hightemperature epoxy resin, with the low in-plane (x,y) expansion and outstanding dimensional stability of non-woven aramid reinforcement.
Arlon® 1555
Polymer Name:
Polyetheretherketone (PEEK)
Processing Methods:
Injection Molding
Fillers Included:
Graphite Fiber, Carbon Fiber
Additives Included:
Lubricant (Unspecified)
Arlon® 1555 is a Polyetheretherketone (PEEK) product filled with carbon fiber and graphite fiber. It can be processed by injection molding and is available in Europe or North America. Primary characteristic: lubricated.
Arlon® AD250
Polymer Name:
Polytetrafluoroethylene (PTFE)
Processing Methods:
Injection Molding
Fillers Included:
Glass Fiber
Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications.The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates.Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.
Arlon® 33N
Polymer Name:
Polyimide (PI)
Functions:
Laminate, Prepreg
33N is a flame retardant (UL94 V-O) polyimide laminate and prepreg system where the excellent high performance properties of polyimide need to be combined with flame retardance. High Tg (250°C) results in low overall z-axis expansion, and minimizes risk of latent PTH defects in-service.
Arlon® 1263
Polymer Name:
Polyetheretherketone (PEEK)
Processing Methods:
Injection Molding
Fillers Included:
Carbon Fiber
Arlon® 1263 is a Polyetheretherketone (PEEK) product filled with carbon fiber. It can be processed by injection molding and is available in Europe or North America. Typical application: Military Applications.
Arlon® 37N
Polymer Name:
Polyimide (PI)
Functions:
Prepreg
37N is a polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow is required.
Arlon® 38N
Polymer Name:
Polyimide (PI)
Functions:
Prepreg
End Uses:
PCB Materials, Insulators
38N is an improved polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow is required.
Arlon® 1160
Polymer Name:
Polyetheretherketone (PEEK)
Processing Methods:
Injection Molding
Fillers Included:
Glass Fiber
Greene, Tweed offers precision plastic components for a wide range of demanding medical and biotechnology applications. Arlon 1160, a high-performance, unfilled thermoplastic is ideal for applications requiring wear resistance, corrosion resistance and dimensional stability. Arlon 1160 is preferred over metal because it is lightweight, very nonconductive and autoclavable.
Arlon® 45N
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Injection Molding
End Uses:
Automotive Under The Hood, Laminates, Electrical/Electronic Applications, Computer Components
Arlon 45N is a tough, high Tg (175°C by DSC) multifunctional epoxy laminate and prepreg system designed for use in a variety of higher layer count MLB's. Processeable using conventional FR-4 conditions, 45N is supplied to meet the requirements of IPC-4101/24.
Arlon® 47N
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Injection Molding
End Uses:
Laminates, Electrical/Electronic Applications
47N is a low-flow epoxy prepreg engineered for binding multilayer epoxy rigid-flex or attaching heatsinks to multilayer PCBs. An optional low lamination temperature protects components already mounted on the PCB.
Arlon® 2000
Polymer Name:
Polyetheretherketone (PEEK)
Processing Methods:
Injection Molding
Arlon® 2000 is a Polyetheretherketone (PEEK) product. It is available in Europe or North America. Primary characteristic: heat resistant.
Arlon® AD320
Polymer Name:
Polytetrafluoroethylene (PTFE)
Processing Methods:
Injection Molding
Fillers Included:
Glass Fiber
Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications.The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates.Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.
Arlon® 44N
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Injection Molding
End Uses:
Automotive Under The Hood, Laminates, Electrical/Electronic Applications, Computer Components
Arlon 44N is a high resin content multifunctional (175°C) epoxy prepreg system with a proprietary micordisperse ceramic filler system. 44N is engineered for the filling of clearance holes in thin Metal cores such as 0.006" Copperinvar- Copper or via holes in sequentially laminated MLB designs. Based on Arlon's 45N, the 44N system is compatible with conventional epoxy lamination and fabrication.
Arlon® 1330
Polymer Name:
Polyetheretherketone (PEEK)
Processing Methods:
Injection Molding
Additives Included:
Lubricant (Unspecified)
Greene, Tweed offers precision plastic components for a variety of demanding, semiconductor applications. These components are made from a full range of high-performance plastic materials including Arlon® 1330. Ideal for applications requiring exceptional wear resistance and chemical compatibility, Arlon 1330 provides good dimensional stability without the addition of carbon fibers.
Arlon® 51N
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Injection Molding
End Uses:
Electrical/Electronic Applications
Flexural Strength:
578.0 - 578.0 MPa
51N is a non-DICY multifunctional epoxy low-flow prepreg system designed to provide high reliability through lead-free solder operations. The high decomposition temperature and high thermal stability of this material is ideal for use in complex rigid-flex fabrication and assembly operations where minimum resin flow is required.
Arlon® 84N
Polymer Name:
Polyimide (PI)
Functions:
Prepreg
84N is a high performance ceramic-filled polyimide prepreg based on Arlon’s 85N pure polyimide system, designed for use in filling etched areas in polyimide multilayers that contain thick copper layers and for filling clearance holes in metal cores. The ceramic filler in the resin serves to reduce shrinkage and inhibit crack formulation during through-hole drilling in filled clearance areas.
Arlon® 55LM
Functions:
Laminate
Reinforcement Material:
Aramid (Kevlar)
Processing Methods:
Continuous Lamination
55LM is an epoxy laminate and prepreg system, reinforced with non-woven aramid fiber, with substantially lower moisture absorption compared with conventional epoxy/aramid products, even in high-humidity environments.
Arlon® 35NQ
Polymer Name:
Polyimide (PI)
Functions:
Laminate, Prepreg
35NQ is a pure polyimide laminate and prepreg system. Reinforced with woven Quartz fabric, combining the advantages of a reduced cure cycle, high temperature polyimide system (Tg >/=250°C), with low dielectric constant and loss tangent (DK = 3.5, loss 0.009 at 1 MHz) for applications requiring operation at RF/Microwave frequencies. Polyimide Quartz materials also exhibit reduced in-plane CTE for expansion matched SMT applications.
Arlon® 1163
Polymer Name:
Polyetheretherketone (PEEK)
Processing Methods:
Injection Molding
Fillers Included:
Glass Fiber
Arlon® 1163 is a Polyetheretherketone (PEEK) product filled with glass fiber. It can be processed by injection molding and is available in Europe or North America. Typical application: Military Applications.
Arlon® 1260
Polymer Name:
Polyetheretherketone (PEEK)
Processing Methods:
Injection Molding
Fillers Included:
Carbon Fiber
Greene, Tweed offers precision plastic components for a variety of demanding semiconductor applications. These components are made from a full range of high-performance plastic materials including Arlon® 1260, which is ideal for applications requiring high impact, wear and chemical resistance.
Arlon® 1287 LI
Polymer Name:
Polyetheretherketone (PEEK)
Processing Methods:
Injection Molding
Fillers Included:
Carbon Fiber
Greene, Tweed offers precision plastic components for a variety of demanding semiconductor applications. These components are made from a full range of high-performance plastic materials including Arlon® 1287 LI, which is ideal for applications requiring exceptionally high physical properties, wear resistance and chemical compatibility.
Arlon® 2400
Polymer Name:
Polyetheretherketone (PEEK)
Processing Methods:
Injection Molding
Fillers Included:
Glass Fiber
Arlon® 2400 is a Polyetheretherketone (PEEK) product filled with glass fiber. It is available in Europe or North America. Primary characteristic: heat resistant.
Arlon® 3000 XT
Polymer Name:
Polyetheretherketone (PEEK)
Processing Methods:
Injection Molding
Arlon® 3000 XT is a Polyetheretherketone (PEEK) product. It can be processed by injection molding and is available in Europe or North America. Primary characteristic: heat resistant.
Arlon® 45NK
Functions:
Laminate
Reinforcement Material:
Aramid (Kevlar)
Processing Methods:
Continuous Lamination
45NK is a woven Kevlar® aramid fiber reinforced multifunctional epoxy laminate and prepreg systemengineered to provide in-plane CTE values as low as 6 ppm/°C for compatibility with leadless alumina ceramic chip carriers (LCCC's) and other low expansion SMT devices where control of laminate expansion is critical for solder joint reliability. 45NK exceeds the requirements of IPC 4101/50 (Type AFG).