Products

35N is a pure polyimide laminate and prepreg system for applications requiring high temperature performance. High Tg (250°C) results in low Z-direction expansion for resistance to PTH failure during PWB processing, and minimizes risk of latent PTH defects in-service. Reduced temperature and time to cure offers improved throughput compared to traditional polyimide cycles.

85N is the ultimate polyimide and laminate prepreg system fo PWB's requiring resistance to high temperature, both in process and in end-use applications. Bromine-free chemistry provides Bestin-Class thermal stability for applications with sustained high in-use temperatures as well as for use in lead-free soldering applications.

33N is a flame retardant (UL94 V-O) polyimide laminate and prepreg system where the excellent high performance properties of polyimide need to be combined with flame retardance. High Tg (250°C) results in low overall z-axis expansion, and minimizes risk of latent PTH defects in-service.

47N is a low-flow epoxy prepreg engineered for binding multilayer epoxy rigid-flex or attaching heatsinks to multilayer PCBs. An optional low lamination temperature protects components already mounted on the PCB.

Arlon 45N is a tough, high Tg (175°C by DSC) multifunctional epoxy laminate and prepreg system designed for use in a variety of higher layer count MLB's. Processeable using conventional FR-4 conditions, 45N is supplied to meet the requirements of IPC-4101/24.

Arlon 44N is a high resin content multifunctional (175°C) epoxy prepreg system with a proprietary micordisperse ceramic filler system. 44N is engineered for the filling of clearance holes in thin Metal cores such as 0.006" Copperinvar- Copper or via holes in sequentially laminated MLB designs. Based on Arlon's 45N, the 44N system is compatible with conventional epoxy lamination and fabrication.

35NQ is a pure polyimide laminate and prepreg system. Reinforced with woven Quartz fabric, combining the advantages of a reduced cure cycle, high temperature polyimide system (Tg >/=250°C), with low dielectric constant and loss tangent (DK = 3.5, loss 0.009 at 1 MHz) for applications requiring operation at RF/Microwave frequencies. Polyimide Quartz materials also exhibit reduced in-plane CTE for expansion matched SMT applications.