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Arlon Electronic Materials
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6 Products found on Arlon Electronic Materials
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Arlon® 35N
Polymer Name:
Polyimide (PI)
Functions:
Laminate, Prepreg
End Uses:
PCB Materials
35N is a pure polyimide laminate and prepreg system for applications requiring high temperature performance. High Tg (250°C) results in low Z-direction expansion for resistance to PTH failure during PWB processing, and minimizes risk of latent PTH defects in-service. Reduced temperature and time to cure offers improved throughput compared to traditional polyimide cycles.
Arlon® 55NT
Functions:
Laminate
Reinforcement Material:
Aramid (Kevlar)
Processing Methods:
Continuous Lamination
55NT is an epoxy laminate and prepreg system, reinforced with a non-woven aramid substrate. This system combines compatibility with lead-free processing, using a hightemperature epoxy resin, with the low in-plane (x,y) expansion and outstanding dimensional stability of non-woven aramid reinforcement.
Arlon® 37N
Polymer Name:
Polyimide (PI)
Functions:
Prepreg
37N is a polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow is required.
Arlon® 55LM
Functions:
Laminate
Reinforcement Material:
Aramid (Kevlar)
Processing Methods:
Continuous Lamination
55LM is an epoxy laminate and prepreg system, reinforced with non-woven aramid fiber, with substantially lower moisture absorption compared with conventional epoxy/aramid products, even in high-humidity environments.
Arlon® 45NK
Functions:
Laminate
Reinforcement Material:
Aramid (Kevlar)
Processing Methods:
Continuous Lamination
45NK is a woven Kevlar® aramid fiber reinforced multifunctional epoxy laminate and prepreg systemengineered to provide in-plane CTE values as low as 6 ppm/°C for compatibility with leadless alumina ceramic chip carriers (LCCC's) and other low expansion SMT devices where control of laminate expansion is critical for solder joint reliability. 45NK exceeds the requirements of IPC 4101/50 (Type AFG).
Arlon® 35NQ
Polymer Name:
Polyimide (PI)
Functions:
Laminate, Prepreg
35NQ is a pure polyimide laminate and prepreg system. Reinforced with woven Quartz fabric, combining the advantages of a reduced cure cycle, high temperature polyimide system (Tg >/=250°C), with low dielectric constant and loss tangent (DK = 3.5, loss 0.009 at 1 MHz) for applications requiring operation at RF/Microwave frequencies. Polyimide Quartz materials also exhibit reduced in-plane CTE for expansion matched SMT applications.