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Arlon Electronic Materials
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27 Products found on Arlon Electronic Materials
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Arlon® 35N
Polymer Name:
Polyimide (PI)
Functions:
Laminate, Prepreg
End Uses:
PCB Materials
35N is a pure polyimide laminate and prepreg system for applications requiring high temperature performance. High Tg (250°C) results in low Z-direction expansion for resistance to PTH failure during PWB processing, and minimizes risk of latent PTH defects in-service. Reduced temperature and time to cure offers improved throughput compared to traditional polyimide cycles.
Arlon® 25N
Polymer Name:
Polytetrafluoroethylene (PTFE)
Processing Methods:
Injection Molding
Fillers Included:
Glass Fiber, Ceramic, Ceramic Fiber
Arlon 25N and 25FR are woven fiberglass reinforced, ceramic-filled composite materials engineered for use in microwave and RF multilayer printed circuit boards. Combining a non-polar thermoset resin system with a controlled-expansion ceramic filler, 25N and 25FR offer low dielectric constant and loss combined with a low Thermal Coefficient of Dielectric Constant (TCEr) for signal stability over a wide ambient temperature range. Designed for use in multilayer packages, 25N and 25FR offer prepregs that are identical in chemical composition and physical properties with their copper clad laminates for a completely homogeneous finished package for optimal signal integrity.The low dielectric constant (Er) and loss properties, low thermal coefficient of dielectric constant (TCEr), and excellent physical stability characteristics offered by 25N and 25FR materials make them ideal for wireless and digital applications, such as cellular telephones, down converters, low noise amplifiers, antennas and other advanced des ign circuits.Processing for 25N and 25FR materials is consistent with processing for standard high temperature thermoset based printed circuit board substrates.
Arlon® AD350
Polymer Name:
Polytetrafluoroethylene (PTFE)
Processing Methods:
Injection Molding
Fillers Included:
Glass Fiber
Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications.The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates.Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.
Arlon® AD255
Polymer Name:
Polytetrafluoroethylene (PTFE)
Processing Methods:
Injection Molding
Fillers Included:
Glass Fiber
Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications.The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates.Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.
Arlon® 1000
Polymer Name:
Polyetheretherketone (PEEK)
Processing Methods:
Injection Molding
Greene, Tweed's Arlon® 1000, a tough, hig temperature, semi-crystalline thermoplastic, offers a unique combination of mechanical, thermal and chemical propertier. Arlon 1000 features superior compressive strength and minimum creep, as well as broad chemical resistance. Arlon is an excellent choice for applications such as valve seats and bushings greater abrasion resistance and lower wear and better fatigue properties than other thermoplastics.
Arlon® AD300
Polymer Name:
Polytetrafluoroethylene (PTFE)
Processing Methods:
Injection Molding
Fillers Included:
Glass Fiber
Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications.The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates.Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.
Arlon® 49N
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Injection Molding
End Uses:
Electrical/Electronic Applications
49N is a low-flow epoxy prepreg engineered for bonding multilayer epoxy rigid-flex or attaching heatsinks to multilayer epoxy PCBs. With a high Tg, the prepreg can be used in high-performance or hightemperature applications compared to a standard difunctional epoxy low-flow.
Arlon® AD270
Polymer Name:
Polytetrafluoroethylene (PTFE)
Processing Methods:
Injection Molding
Fillers Included:
Glass Fiber
Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications.The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates.Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.
Arlon® 1555
Polymer Name:
Polyetheretherketone (PEEK)
Processing Methods:
Injection Molding
Fillers Included:
Graphite Fiber, Carbon Fiber
Additives Included:
Lubricant (Unspecified)
Arlon® 1555 is a Polyetheretherketone (PEEK) product filled with carbon fiber and graphite fiber. It can be processed by injection molding and is available in Europe or North America. Primary characteristic: lubricated.
Arlon® 37N
Polymer Name:
Polyimide (PI)
Functions:
Prepreg
37N is a polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow is required.
Arlon® 1263
Polymer Name:
Polyetheretherketone (PEEK)
Processing Methods:
Injection Molding
Fillers Included:
Carbon Fiber
Arlon® 1263 is a Polyetheretherketone (PEEK) product filled with carbon fiber. It can be processed by injection molding and is available in Europe or North America. Typical application: Military Applications.
Arlon® AD250
Polymer Name:
Polytetrafluoroethylene (PTFE)
Processing Methods:
Injection Molding
Fillers Included:
Glass Fiber
Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications.The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates.Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.
Arlon® 45N
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Injection Molding
End Uses:
Automotive Under The Hood, Laminates, Electrical/Electronic Applications, Computer Components
Arlon 45N is a tough, high Tg (175°C by DSC) multifunctional epoxy laminate and prepreg system designed for use in a variety of higher layer count MLB's. Processeable using conventional FR-4 conditions, 45N is supplied to meet the requirements of IPC-4101/24.
Arlon® 1160
Polymer Name:
Polyetheretherketone (PEEK)
Processing Methods:
Injection Molding
Fillers Included:
Glass Fiber
Greene, Tweed offers precision plastic components for a wide range of demanding medical and biotechnology applications. Arlon 1160, a high-performance, unfilled thermoplastic is ideal for applications requiring wear resistance, corrosion resistance and dimensional stability. Arlon 1160 is preferred over metal because it is lightweight, very nonconductive and autoclavable.
Arlon® 1330
Polymer Name:
Polyetheretherketone (PEEK)
Processing Methods:
Injection Molding
Additives Included:
Lubricant (Unspecified)
Greene, Tweed offers precision plastic components for a variety of demanding, semiconductor applications. These components are made from a full range of high-performance plastic materials including Arlon® 1330. Ideal for applications requiring exceptional wear resistance and chemical compatibility, Arlon 1330 provides good dimensional stability without the addition of carbon fibers.
Arlon® 38N
Polymer Name:
Polyimide (PI)
Functions:
Prepreg
End Uses:
PCB Materials, Insulators
38N is an improved polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow is required.
Arlon® 47N
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Injection Molding
End Uses:
Laminates, Electrical/Electronic Applications
47N is a low-flow epoxy prepreg engineered for binding multilayer epoxy rigid-flex or attaching heatsinks to multilayer PCBs. An optional low lamination temperature protects components already mounted on the PCB.
Arlon® 2000
Polymer Name:
Polyetheretherketone (PEEK)
Processing Methods:
Injection Molding
Arlon® 2000 is a Polyetheretherketone (PEEK) product. It is available in Europe or North America. Primary characteristic: heat resistant.
Arlon® AD320
Polymer Name:
Polytetrafluoroethylene (PTFE)
Processing Methods:
Injection Molding
Fillers Included:
Glass Fiber
Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications.The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates.Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.
Arlon® 51N
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Injection Molding
End Uses:
Electrical/Electronic Applications
Flexural Strength:
578.0 - 578.0 MPa
51N is a non-DICY multifunctional epoxy low-flow prepreg system designed to provide high reliability through lead-free solder operations. The high decomposition temperature and high thermal stability of this material is ideal for use in complex rigid-flex fabrication and assembly operations where minimum resin flow is required.
Arlon® 44N
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Injection Molding
End Uses:
Automotive Under The Hood, Laminates, Electrical/Electronic Applications, Computer Components
Arlon 44N is a high resin content multifunctional (175°C) epoxy prepreg system with a proprietary micordisperse ceramic filler system. 44N is engineered for the filling of clearance holes in thin Metal cores such as 0.006" Copperinvar- Copper or via holes in sequentially laminated MLB designs. Based on Arlon's 45N, the 44N system is compatible with conventional epoxy lamination and fabrication.
Arlon® 1260
Polymer Name:
Polyetheretherketone (PEEK)
Processing Methods:
Injection Molding
Fillers Included:
Carbon Fiber
Greene, Tweed offers precision plastic components for a variety of demanding semiconductor applications. These components are made from a full range of high-performance plastic materials including Arlon® 1260, which is ideal for applications requiring high impact, wear and chemical resistance.
Arlon® 3000 XT
Polymer Name:
Polyetheretherketone (PEEK)
Processing Methods:
Injection Molding
Arlon® 3000 XT is a Polyetheretherketone (PEEK) product. It can be processed by injection molding and is available in Europe or North America. Primary characteristic: heat resistant.
Arlon® 1287 LI
Polymer Name:
Polyetheretherketone (PEEK)
Processing Methods:
Injection Molding
Fillers Included:
Carbon Fiber
Greene, Tweed offers precision plastic components for a variety of demanding semiconductor applications. These components are made from a full range of high-performance plastic materials including Arlon® 1287 LI, which is ideal for applications requiring exceptionally high physical properties, wear resistance and chemical compatibility.
Arlon® 2400
Polymer Name:
Polyetheretherketone (PEEK)
Processing Methods:
Injection Molding
Fillers Included:
Glass Fiber
Arlon® 2400 is a Polyetheretherketone (PEEK) product filled with glass fiber. It is available in Europe or North America. Primary characteristic: heat resistant.
Arlon® 1163
Polymer Name:
Polyetheretherketone (PEEK)
Processing Methods:
Injection Molding
Fillers Included:
Glass Fiber
Arlon® 1163 is a Polyetheretherketone (PEEK) product filled with glass fiber. It can be processed by injection molding and is available in Europe or North America. Typical application: Military Applications.
Arlon® 35NQ
Polymer Name:
Polyimide (PI)
Functions:
Laminate, Prepreg
35NQ is a pure polyimide laminate and prepreg system. Reinforced with woven Quartz fabric, combining the advantages of a reduced cure cycle, high temperature polyimide system (Tg >/=250°C), with low dielectric constant and loss tangent (DK = 3.5, loss 0.009 at 1 MHz) for applications requiring operation at RF/Microwave frequencies. Polyimide Quartz materials also exhibit reduced in-plane CTE for expansion matched SMT applications.