35N is a pure polyimide laminate and prepreg system for applications requiring high temperature performance. High Tg (250°C) results in low Z-direction expansion for resistance to PTH failure during PWB processing, and minimizes risk of latent PTH defects in-service. Reduced temperature and time to cure offers improved throughput compared to traditional polyimide cycles.

Polymer Name: Polyimide (PI)

Functions: Laminate, Prepreg

End Uses: PCB Materials

Technical Data Sheet

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Properties

Flame Rating
Physical Form
Mechanical Properties
ValueUnitsTest Method / Conditions
Tensile Strength (CD)48KpsiIPC TM-650 2.4.18.3
Tensile Strength (MD)65KpsiIPC TM-650 2.4.18.3
Peel Strength to Copper (1 oz/35 micron) After Thermal Stress6.3 (1.1)lb/in (N/mm)IPC TM-650 2.4.8
Peel Strength to Copper (1 oz/35 micron) at Elevated Temperatures6.3 (1.1)lb/in (N/mm)IPC TM-650 2.4.8.2
Peel Strength to Copper (1 oz/35 micron) After Process Solutions6.0 (1.1)lb/in (N/mm)IPC TM-650 2.4.8
Young's Modulus (CD)3.5MpsiIPC TM-650 2.4.18.3
Young's Modulus (CD/MD)3.5/4.2 (24.1/28.9)Mpsi (GPa)IPC TM-650 2.4.18.3
Young's Modulus (MD)4.2MpsiIPC TM-650 2.4.18.3
Poisson's Ratio0.17-ASTM D-3039
Physical Properties
ValueUnitsTest Method / Conditions
Specific Gravity1.6-ASTM D 792
Water Absorption (0.062)0.26%IPC TM-650 2.6.2.1
Thermal Properties
ValueUnitsTest Method / Conditions
Glass Transition Temperature (Tg) - TMA250°CIPC TM-650 2.4.24
Coefficient of Thermal Expansion (X,Y)16ppm/°CIPC TM-650 2.4.41
z-axis Expansion (50-260oC)1.2%IPC TM-650 2.4.24
Coefficient of Thermal Expansion (Z) - Below Tg51ppm/°CIPC TM-650 2.4.24
Coefficient of Thermal Expansion (Z) - Above Tg158ppm/°CIPC TM-650 2.4.24
Decomposition Temperature (Td) - Initial363°CIPC TM-650 2.3.41
Decomposition Temperature (Td, 5%)407°CIPC TM-650 2.3.41
T30011minIPC TM-650 2.4.24.1
T260min. 60minIPC TM-650 2.4.24.1
T288min. 60minIPC TM-650 2.4.24.1
Thermal Conductivity0.2W/(m K)DIN 52616
Electrical Properties
ValueUnitsTest Method / Conditions
Electrical Strength1400 (55.9)Volts/mil (kV/mm)IPC TM-650 2.5.6.2
Dielectric Constant (1 MHz)4.2-ASTM D 150
Dielectric Constant (1 GHz)4Multilayer ~ 50% RCIPC TM-650 2.5.5.9
Dissipation Factor (1 MHz)0.01-ASTM D 150
Volume Resistivity (C96/35/90)1.5 x 10^8MΩ-cmIPC TM-650 2.5.17.1
Volume Resistivity (E24/125)1.2 x 10^8MΩ-cmIPC TM-650 2.5.17.1
Surface Resistivity (C96/35/90)5.0 x 10^8IPC TM-650 2.5.17.1
Surface Resistivity (E24/125)3.7 x 10^8IPC TM-650 2.5.17.1
Arc Resistance165secIPC TM-650 2.5.1
Flammability
ValueUnitsTest Method / Conditions
FlammabilityV1classUL-94

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  • Asia Pacific
  • Europe
  • North America