37N is a polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow is required.

Polymer Name: Polyimide (PI)

Functions: Prepreg

Technical Data Sheet

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Identification & Functionality

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Polymer Name
Composite Materials Functions

Features & Benefits

Labeling Claims

Applications & Uses

Properties

Flame Rating
Physical Form
Mechanical Properties
ValueUnitsTest Method / Conditions
Tensile Strength (MD)32 (221)kpsi (MPa)IPC TM-650 2.4.18.3
Flexural Strength60 (414)kpsi (MPa)IPC TM-650 2.4.4
Peel Strength to Copper (1 oz/35 micron) After Thermal Stress6.8 (1.2)lb/in (N/mm)IPC TM-650 2.4.8
Peel Strength to Copper (1 oz/35 micron) at Elevated Temperatures5.5 (0.9)lb/in (N/mm)IPC TM-650 2.4.8.2
Peel Strength to Copper (1 oz/35 micron) After Process Solutions9.2 (1.6)lb/in (N/mm)IPC TM-650 2.4.8
Peel Strength to Kapton As Received4.2 (0.74)lb/in (N/mm)
Young's Modulus2.1 (14.5)Mpsi (GPa)IPC TM-650 2.4.18.3
Poisson's Ratio0.17-ASTM D-3039
Physical Properties
ValueUnitsTest Method / Conditions
Water Absorption (0.062")max. 1.0%IPC TM-650 2.6.2.1
Specific Gravity1.6-ASTM D 792
Thermal Conductivity0.3W/mKASTM E1461
FlammabilityV0classUL-94
Thermal Properties
ValueUnitsTest Method / Conditions
Glass Transition Temperature (Tg) - TMA200°CIPC TM-650 2.4.24
Coefficient of Thermal Expansion (X,Y)17ppm/°CIPC TM-650 2.4.41
Coefficient of Thermal Expansion (Z) - Below Tg76ppm/°CIPC TM-650 2.4.24
Coefficient of Thermal Expansion (Z) - Above Tg253ppm/°CIPC TM-650 2.4.24
z-axis Expansion (50-260oC)2.3%IPC TM-650 2.4.24
Decomposition Temperature (Td) - Initial322°CIPC TM-650 2.3.41
Decomposition Temperature (Td, 5%)340°CIPC TM-650 2.3.41
T2885minIPC TM-650 2.4.24.1
T3002minIPC TM-650 2.4.24.1
T260min. 60minIPC TM-650 2.4.24.1
Electrical Properties
ValueUnitsTest Method / Conditions
Electrical Strength1330 (52.4)Volts/mil (kV/mm)IPC TM-650 2.5.6.2
Dielectric Constant (1 MHz)4.25Multilayer ~ 50% RCIPC TM-650 2.5.5.3
Dissipation Factor (1 MHz)0.018-ASTM D 150
Volume Resistivity (C96/35/90)8.2 x 10^9MΩ-cmIPC TM-650 2.5.17.1
Volume Resistivity (E24/125)4.7 x 10^9MΩ-cmIPC TM-650 2.5.17.1
Surface Resistivity (C96/35/90)4.4 x 10^6IPC TM-650 2.5.17.1
Surface Resistivity (E24/125)1.2 x 10^9IPC TM-650 2.5.17.1
Arc Resistance124secASTM D495

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  • Asia Pacific
  • Europe
  • North America