Products

85N is the ultimate polyimide and laminate prepreg system fo PWB's requiring resistance to high temperature, both in process and in end-use applications. Bromine-free chemistry provides Bestin-Class thermal stability for applications with sustained high in-use temperatures as well as for use in lead-free soldering applications.

Arlon 25N and 25FR are woven fiberglass reinforced, ceramic-filled composite materials engineered for use in microwave and RF multilayer printed circuit boards. Combining a non-polar thermoset resin system with a controlled-expansion ceramic filler, 25N and 25FR offer low dielectric constant and loss combined with a low Thermal Coefficient of Dielectric Constant (TCEr) for signal stability over a wide ambient temperature range. Designed for use in multilayer packages, 25N and 25FR offer prepregs that are identical in chemical composition and physical properties with their copper clad laminates for a completely homogeneous finished package for optimal signal integrity.The low dielectric constant (Er) and loss properties, low thermal coefficient of dielectric constant (TCEr), and excellent physical stability characteristics offered by 25N and 25FR materials make them ideal for wireless and digital applications, such as cellular telephones, down converters, low noise amplifiers, antennas and other advanced des ign circuits.Processing for 25N and 25FR materials is consistent with processing for standard high temperature thermoset based printed circuit board substrates.

Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications.The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates.Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.

Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications.The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates.Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.

Arlon 85HP’s unique blend of pure polyimide resin and micro-fi ne proprietary fi llers results in superior performance for demanding applications. Compared to conventional polyimide systems, 85HP has a lower Z-axis expansion and twice the thermal conductivity. 85HP reduces resin cracking and wicking in designs with high density plated through holes and vias. 85HP prepreg has resin fl ow characteristics and pressed thickness matching standard polyimides.

Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications.The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates.Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.

49N is a low-flow epoxy prepreg engineered for bonding multilayer epoxy rigid-flex or attaching heatsinks to multilayer epoxy PCBs. With a high Tg, the prepreg can be used in high-performance or hightemperature applications compared to a standard difunctional epoxy low-flow.

Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications.The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates.Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.

55NT is an epoxy laminate and prepreg system, reinforced with a non-woven aramid substrate. This system combines compatibility with lead-free processing, using a hightemperature epoxy resin, with the low in-plane (x,y) expansion and outstanding dimensional stability of non-woven aramid reinforcement.

37N is a polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow is required.

Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications.The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates.Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.

51N is a non-DICY multifunctional epoxy low-flow prepreg system designed to provide high reliability through lead-free solder operations. The high decomposition temperature and high thermal stability of this material is ideal for use in complex rigid-flex fabrication and assembly operations where minimum resin flow is required.

Arlon 44N is a high resin content multifunctional (175°C) epoxy prepreg system with a proprietary micordisperse ceramic filler system. 44N is engineered for the filling of clearance holes in thin Metal cores such as 0.006" Copperinvar- Copper or via holes in sequentially laminated MLB designs. Based on Arlon's 45N, the 44N system is compatible with conventional epoxy lamination and fabrication.

Arlon's AD Series is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications.The AD Series is currently available in a limited combination of dielectric thickness (0.015" - 0.062") and dielectric constant (2.5 - 3.5). Thicker dielectrics can be developed to meet customer requirements. The higher weight ratio of fiberglass to PTFE resin yields laminates with greater dimensional stability than is normally expected of PTFE-based substrates.Stability of PTFE over a wide frequency range and low loss makes AD Series materials ideal for a variety of microwave and R/F applications in telecom industry. AD Series laminate materials may be processed with standard PTFE materials. Because there is a relatively higher percentage of fiberglass, thermal expansion is reduced in all directions, improving plated through hole reliability.

47N is a low-flow epoxy prepreg engineered for binding multilayer epoxy rigid-flex or attaching heatsinks to multilayer PCBs. An optional low lamination temperature protects components already mounted on the PCB.

Arlon 45N is a tough, high Tg (175°C by DSC) multifunctional epoxy laminate and prepreg system designed for use in a variety of higher layer count MLB's. Processeable using conventional FR-4 conditions, 45N is supplied to meet the requirements of IPC-4101/24.

38N is an improved polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow is required.

55LM is an epoxy laminate and prepreg system, reinforced with non-woven aramid fiber, with substantially lower moisture absorption compared with conventional epoxy/aramid products, even in high-humidity environments.

84N is a high performance ceramic-filled polyimide prepreg based on Arlon’s 85N pure polyimide system, designed for use in filling etched areas in polyimide multilayers that contain thick copper layers and for filling clearance holes in metal cores. The ceramic filler in the resin serves to reduce shrinkage and inhibit crack formulation during through-hole drilling in filled clearance areas.

35NQ is a pure polyimide laminate and prepreg system. Reinforced with woven Quartz fabric, combining the advantages of a reduced cure cycle, high temperature polyimide system (Tg >/=250°C), with low dielectric constant and loss tangent (DK = 3.5, loss 0.009 at 1 MHz) for applications requiring operation at RF/Microwave frequencies. Polyimide Quartz materials also exhibit reduced in-plane CTE for expansion matched SMT applications.