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49 Products found on Cosmic Plastics
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DAP D72/6120F
Polymer Name:
Diallyl Phthalate
Processing Methods:
Transfer Molding, Injection Molding, Compression Molding
End Uses:
Terminal Blocks, Switches, Insulators, Cups, Cases, Encapsulant
Density:
1820.0 - 1820.0 kg/m³
Tensile Strength:
0.0414 - 69.0 MPa
DAP D72/6120F is a versatile diiallyl ortho-phthalate molding compound, filled with short glass fibers and featuring flame retardant properties. Supplied in a free-flowing granular form, this compound is well-suited for a variety of molding applications. It can be easily molded using compression, transfer, or injection equipment and can be preformed with ease. An important distinction is that it has passed NASA outgassing tests, indicating its suitability for applications with stringent outgassing requirements, particularly in industries like aerospace where such standards are critical.
Cosmic Epoxy E4920
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Capacitors, Rectifier, Inductor, Encapsulant, Diodes
Volume Resistivity:
10000000000000.0 - 10000000000000.0 Ohm-m
Flexural Strength:
103.35 - 103.35 MPa
Cosmic Epoxy E4920 is a mineral-filled epoxy molding compound available either in granular form or preformed in various sizes and weights. It features excellent moisture resistance, thermal cycling stability, and remarkable moldability. Furthermore, parts molded from this material do not support fungus growth, and it is specifically designed for the encapsulation of passive devices, including capacitors, inductors, diodes, and rectifiers.
Cosmic Epoxy E484-FDA
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Electrical Insulation, Connectors
Volume Resistivity:
100000000.0 - 100000000.0 Ohm-m
Flexural Strength:
130.91 - 130.91 MPa
Cosmic Epoxy E484-FDA is a mineral-filled, glass-reinforced, electrical-grade epoxy molding compound supplied in granular form. It has received approval for direct food contact. Notably, it possesses outstanding mechanical strength and electrical properties, especially at high temperatures, and has met the rigorous NASA outgassing standards. This material is used in electrical hardware applications such as underwater connectors and other insulation needs.
DAP K31/6220
Polymer Name:
Diallyl Phthalate
Processing Methods:
Transfer Molding, Injection Molding, Compression Molding
End Uses:
Terminal Blocks, Switches, Insulators, Housings, Structural Parts
Density:
1760.0 - 1760.0 kg/m³
Tensile Strength:
0.0414 - 69.0 MPa
DAP K31/6220 is a versatile diallyl iso-phthalate molding compound, filled with short glass fibers and supplied in granular form. This compound offers excellent heat resistance and is suitable for a wide range of applications. It is easy to work with, pouring easily and allowing for preforming. Additionally, it molds readily using standard compression, transfer, or injection equipment. One notable feature of K31/6220 is its FDA approval for direct food contact use, making it a reliable choice for applications in the food industry where heat resistance and safety standards are essential.
DAP K77/6220F
Polymer Name:
Diallyl Phthalate
Processing Methods:
Transfer Molding, Injection Molding, Compression Molding
End Uses:
Terminal Blocks, Switches, Insulators, Housings, Structural Parts
Density:
1780.0 - 1780.0 kg/m³
Tensile Strength:
0.0414 - 69.0 MPa
DAP K77/6220F is a high-quality diallyl iso-phthalate molding compound that combines short glass fibers and flame retardant properties. Supplied in granular form, it is designed for ease of use in molding applications. This compound has excellent flow characteristics, making it easy to pour and mold in standard compression, transfer, or injection equipment. Its flame retardant properties make it suitable for applications where fire resistance is a critical factor, such as in the production of components for fire safety equipment or other high-temperature environments.
DAP D33/6120
Polymer Name:
Diallyl Phthalate
Processing Methods:
Injection Molding, Compression Molding, Transfer Molding
End Uses:
Cups, Cases, Encapsulant, Terminal Blocks, Switches, Insulators
Density:
1720.0 - 1720.0 kg/m³
Tensile Strength:
0.0414 - 69.0 MPa
DAP D33/6120 is a versatile general purpose diallyl ortho-phthalate molding compound that incorporates short glass fibers for added strength. Supplied in a free-flowing granular form, it is designed for ease of use in molding applications. This compound can be easily molded using compression, transfer, or injection equipment, and it can also be readily preformed to suit the specific requirements of the application. Its blend of properties makes it suitable for a range of molding applications where strength and versatility are essential.
Cosmic Epoxy E4920VS
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant
Cosmic Epoxy E4920VS is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, provided as granules, preforms, or powder, and is offered in various colors. This product features a mild odor and is insoluble in water, making it well-suited for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.
Cosmic Epoxy E4920D
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Capacitors, Rectifier, Inductor, Encapsulant, Diodes
Volume Resistivity:
10000000000000.0 - 10000000000000.0 Ohm-m
Flexural Strength:
103.35 - 103.35 MPa
Cosmic Epoxy E4920D is a mineral-filled epoxy molding compound that is available in either granular form or as preformed shapes in various sizes and weights. This compound is commonly used for molding applications and offers good versatility in manufacturing processes.
Farboset® 9020
Ready-to-Use Product Type:
Powder Coating
Application Area:
Capacitors, Coils, Resistors
Compatible Substrates & Surfaces:
Ceramic
Features:
Excellent Moisture Resistance
Application Method:
Spray, Beugler Wheel, Fluid Bed Coating
Chemical Family:
Epoxy & Epoxy Derivatives
Farboset® 9020 is a nonanhydride epoxy powder coating known for its excellent moisture resistance. It is specifically designed for encapsulating components such as ceramic and film capacitors, coils, thermistors, and resistors. This coating helps protect these components from moisture and environmental factors, ensuring their performance and reliability. Farboset® 9020 can be applied using various methods, including fluidized bed, wheel coaters, and electrostatic spray techniques.
Cosmic Epoxy EH61
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Compression Molding, Transfer Molding
End Uses:
Encapsulant, Inductor, Core Rods
Cosmic Epoxy EH61 is an iron-filled epoxy molding compound provided in a black granular form. It is designed for EMI/RFI shielding applications and can be utilized in compression or transfer molding processes to manufacture core rods or encapsulate surface mount and axial leaded inductors. This single molded compound streamlines the manufacturing process, eliminating the labor-intensive over/under molding steps.
Farboset® 9081
Ready-to-Use Product Type:
Powder Coating
Application Area:
Resistors
Features:
Thermal Cracking Resistance, Low Temperature Performance
Application Method:
Spray, Beugler Wheel, Fluid Bed Coating
Chemical Family:
Epoxy & Epoxy Derivatives
Farboset® 9081 is a nonanhydride epoxy powder coating specifically formulated for low-temperature applications, making it suitable for heat-sensitive electronic components. It is ideal for encapsulating film and ceramic capacitors that require processing at low temperatures. This compound can be applied using various techniques such as fluidized bed coating, wheel coaters, or electrostatic spray methods.
Farboset® 2471VO
Polymer Name:
Epoxy Resins & Compounds
Farboset® 2471VO is designed for use as a compound in thermoset molding. It is available in a solid form, presented as granules, with a granular appearance and a mild odor. This product is insoluble in water and does not exhibit reactivity under normal conditions. It is well-suited for various thermoset molding applications, ensuring safety and reliability in its intended use.
Cosmic Epoxy EH31
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Compression Molding, Transfer Molding
End Uses:
Encapsulant, Inductor, Core Rods
Cosmic Epoxy EH31 is an iron-filled epoxy molding compound available in a granular form with a black color. This material is designed for EMI/RFI shielding applications. It can be used for compression or transfer molding to create core rods and encapsulate surface mount and axial leaded inductors. Using this single molded compound can streamline the manufacturing process and eliminate the need for labor-intensive over/under molding.
DAP ID-40
Polymer Name:
Diallyl Phthalate
Processing Methods:
Compression Molding, Transfer Molding
End Uses:
Printed Circuit Boards, Connectors, Terminal Blocks
DAP ID-40 is a general-purpose diallyl ortho-phthalate molding compound filled with Orlon. It is supplied in a granular form and can be easily molded using standard compression or transfer equipment. This type of compound is versatile and suitable for various molding applications.
Cosmic Epoxy EH21
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Compression Molding, Transfer Molding
End Uses:
Encapsulant, Inductor, Core Rods
Cosmic Epoxy EH21 is an iron-filled epoxy molding compound provided in a black granular form. It is well-suited for applications requiring EMI (Electromagnetic Interference) and RFI (Radio-Frequency Interference) shielding. This material can be molded through compression or transfer molding processes to create core rods or to encapsulate surface mount and axial leaded inductors. It offers the advantage of simplifying the molding process by eliminating the need for labor-intensive over/under molding.
Farboset® 2472V0
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Resistor, Capacitors, Coils, Relay Bases, Resistor Network
Farboset® 2472V0 is a novolac epoxy molding compound that is mineral-filled for enhanced performance. It offers rapid cure rates, excellent moldability, and exceptional resistance to thermal shock and moisture. This compound has been specially formulated to provide improved resistance to moisture ingress, making it an ideal choice for applications where exposure to moisture is a concern. Additionally, it features a high glass transition temperature, ensuring optimum reliability in performance. Its combination of properties makes it well-suited for a range of applications where resilience to environmental conditions is crucial.
Farboset® 9544
Chemical Family:
Epoxy & Epoxy Derivatives
Ready-to-Use Product Type:
Encapsulant, Powder Coating
Application Area:
Resistors
Application Method:
Beugler Wheel, Fluid Bed Coating
Farboset® 9544 is designed for coating a variety of electronic components, including resistor networks, hybrid circuits, varistors, and ceramic capacitors. Its resistance to cracking during thermal cycling is a valuable feature for maintaining the integrity of these components when subjected to temperature variations. Additionally, it can be applied using wheel and fluid bed equipment, providing flexibility in the coating process.
Cosmic Epoxy E4920AT
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant
Cosmic Epoxy E4920AT is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, provided as granules, preforms, or powder, and comes in various colors. This product has a mild odor and is insoluble in water, making it well-suited for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.
Farboset® 1115AC
Polymer Name:
Epoxy Resins & Compounds
Farboset® 1115AC is intended for use as a compound in thermoset molding. It is available in a solid form, presented as granules, with a granular appearance and a mild odor. This product is insoluble in water and does not exhibit reactivity under normal conditions, making it suitable for various thermoset molding applications and ensuring safety and reliability in its intended use.
Farboset® 1160
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Power Transformers, Capacitors, Coils, Relay Bases, Encapsulant, Diodes
Volume Resistivity:
95000000000000.0 - 95000000000000.0 Ohm-m
Flexural Strength:
118.58 - 118.58 MPa
Farboset® 1160 is a granular, mineral-filled, anhydride epoxy molding compound designed for the encapsulation of various electrical and electronic components. It offers fast cure rates, long flow, and excellent thermal shock resistance. This compound is suitable for applications involving the encapsulation of coils, transformers, capacitors, diodes, relays, and other components that require good hot rigidity during the molding process.
Farboset® 1712
Polymer Name:
Epoxy Resins & Compounds
Farboset® 1712 is designed for use as a compound in thermoset molding. It is available in a solid form, presented as granules, with a granular appearance and a mild odor. This product is insoluble in water and does not exhibit reactivity under normal conditions. It is well-suited for a variety of thermoset molding applications, ensuring safety and reliability in its intended use.
Farboset® 2477CU
Polymer Name:
Epoxy Resins & Compounds
Farboset® 2477CU is designed for use as a compound in thermoset molding. It is available in a solid form, presented as granules, with a granular appearance and a mild odor. This product is insoluble in water and does not exhibit reactivity under normal conditions. It is well-suited for a variety of thermoset molding applications, ensuring safety and reliability in its intended use.
DAP D45
Polymer Name:
Diallyl Phthalate
End Uses:
Terminal Blocks, Structural Parts, Insulators, Housings
Density:
1740.0 - 1740.0 kg/m³
Tensile Strength:
31.005000000000003 - 41.34 MPa
DAP D45 is a mineral-filled, flame retardant, general-purpose diallyl ortho-phthalate molding compound supplied in a free-flowing granular form. It offers a cost-effective solution while maintaining essential properties such as high dimensional stability, arc resistance, and excellent dielectric strength. This compound is well-suited for structural parts, housings, terminals, insulators, and other applications where both strength and economy are important factors.
DAP K43/6260
Polymer Name:
Diallyl Phthalate
Processing Methods:
Transfer Molding, Injection Molding, Compression Molding
End Uses:
Terminal Blocks, Switches, Insulators, Housings, Cups, Cases, Encapsulant
Density:
1800.0 - 1800.0 kg/m³
Tensile Strength:
31.005000000000003 - 41.34 MPa
DAP K43/6260 is a versatile diallyl iso-phthalate molding compound that is filled with minerals and supplied in granular form. This compound is designed for ease of use and versatility. It pours easily, can be preformed, and molds readily using standard compression, transfer, or injection equipment. What sets K43/6260 apart is its exceptional heat resistance, high arc resistance, and ease of molding around inserts. These features make it an ideal choice for applications that demand high-temperature performance and electrical insulation properties, while still allowing for straightforward processing and customization.
Farboset® 2270
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Resistor, Capacitors, Encapsulant
Farboset® 2270 is a granular epoxy molding compound that contains a combination of glass and mineral fillers. It is based on a novolac epoxy resin and is designed for encapsulating various electrical and electronic components, including capacitors, resistors, hybrids, and more. This compound is known for its good moldability and fast cure rates, especially at lower molding temperatures. It offers excellent performance and reliability for applications where these characteristics are crucial.
Cosmic Epoxy EH40
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Compression Molding, Transfer Molding
End Uses:
Encapsulant, Inductor, Core Rods
Cosmic Epoxy EH40 is an iron-filled epoxy molding compound available in a black granular form. It is suitable for EMI/RFI shielding applications and can be used for compression or transfer molding to create core rods or encapsulate surface mount and axial leaded inductors. This material simplifies the manufacturing process by allowing for single molded applications, eliminating the need for labor-intensive over/under molding.
Cosmic Epoxy C102
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Transfer Molding, Injection Molding, Compression Molding
Cosmic Epoxy C102 is a copper-filled molding compound available in a very fine granular form. It is suitable for various molding processes, including injection molding, compression molding, and transfer molding. This material is designed for fabricating parts that demand high strength and excellent electrical conductivity.
Cosmic Epoxy EH81
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Compression Molding, Transfer Molding
End Uses:
Encapsulant, Inductor, Core Rods
Cosmic Epoxy EH81 is an iron-filled epoxy molding compound available in a black granular form. It is specifically designed for EMI/RFI shielding applications and can be used in both compression and transfer molding processes to create core rods or encapsulate surface mount and axial leaded inductors. The advantage of this material is its ability to simplify the manufacturing process by eliminating the labor-intensive over/under molding steps.
Cosmic Epoxy E4920CD
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant
Cosmic Epoxy E4920CD is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, offered as granules, preforms, or powders, and is available in various colors. This product has a mild odor and is insoluble in water, making it well-suited for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.
Farboset® 9025
Chemical Family:
Epoxy & Epoxy Derivatives
Ready-to-Use Product Type:
Encapsulant, Powder Coating
Application Area:
Resistors
Application Method:
Beugler Wheel, Fluid Bed Coating
Farboset® 9025 is a nonanhydride epoxy powder coating that is specifically formulated for use as an encapsulant for electronic components. One of its key characteristics is its excellent resistance to cracking during thermal cycling, which makes it ideal for applications where electronic components are subjected to temperature variations. This epoxy powder coating is designed for coating various electronic components, including resistor networks, hybrid circuits, varistors, and ceramic capacitors.
Cosmic Epoxy EH71
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Compression Molding, Transfer Molding
End Uses:
Encapsulant, Inductor, Core Rods
Cosmic Epoxy EH71 is an iron-filled epoxy molding compound available in a black granular form. It is well-suited for EMI/RFI shielding applications and can be used in either compression or transfer molding processes to create core rods or encapsulate surface mount and axial leaded inductors. The advantage of this material is its ability to streamline the manufacturing process by eliminating the labor-intensive over/under molding steps.
Cosmic Epoxy EH51
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Compression Molding, Transfer Molding
End Uses:
Encapsulant, Inductor, Core Rods
Cosmic Epoxy EH51 is an iron-filled epoxy molding compound available in a black granular form. It is designed for EMI/RFI shielding applications and can be used in compression or transfer molding processes to create core rods or encapsulate surface mount and axial leaded inductors. This material simplifies the manufacturing process by allowing for single molded applications, eliminating the labor-intensive over/under molding.
Farboset® 1180
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant
Farboset® 1180 is a granular, glass-filled, general-purpose anhydride epoxy molding compound. It is formulated for encapsulation applications where excellent thermal shock resistance and physical strength are required. This compound helps protect electronic and electrical components by providing thermal shock resistance and maintaining their integrity under challenging conditions.
Cosmic Epoxy E4930R
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Optocoupler, Encapsulant, Transistor, Capacitors, Resistor
Volume Resistivity:
10000000000000.0 - 10000000000000.0 Ohm-m
Flexural Strength:
103.35 - 103.35 MPa
Cosmic Epoxy E4930R is a mineral-filled epoxy molding compound supplied in granular form. It is designed for encapsulating various electronic components, including optocouplers, capacitors, resistors, resistor networks, transistors, SOICs (Small Outline Integrated Circuits), and QFPs (Quad Flat Packages). This material helps protect and insulate these components, ensuring their proper functioning in electronic applications.
Cosmic Epoxy E4940P
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Resistor Network, Encapsulant, Optical Fiber Connector
Volume Resistivity:
10000000000000.0 - 10000000000000.0 Ohm-m
Flexural Strength:
103.35 - 103.35 MPa
Cosmic Epoxy E4940P is a mineral-filled, glass-reinforced epoxy molding compound supplied in granular form. It is specifically designed for high-volume encapsulation applications, particularly for resistor networks and fiber-optic connectors. This compound offers high quality, reliability, and good moldability for such applications.
Farboset® 2510
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant, Capacitors
Farboset® 2510 is a mineral-filled, novolac epoxy molding compound known for its fast cure rates at low temperatures, excellent laser markability, and good moldability. This compound is specially formulated for encapsulating surface mount ceramic and tantalum capacitors, as well as other applications that demand quick cycle times. Its unique properties and rapid curing make it well-suited for applications where fast production and efficient marking are essential.
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