DAP 224 is a general-purpose diallyl ortho-phthalate molding compound filled with Dacroon. It is supplied in a flake form and can be easily molded using standard compression or transfer equipment. This type of compound is versatile and suitable for various molding applications.

Polymer Name: Diallyl Phthalate

Processing Methods: Compression Molding, Transfer Molding

Density: 1600.0 - 1600.0 kg/m³

Tensile Strength: 24.804000000000002 - 34.45 MPa

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Identification & Functionality

Fillers Included
Polymer Name
Plastics & Elastomers Functions
Technologies

Features & Benefits

Key Features
  • It has excellent electrical properties with an impact strength considerably higher than Orlon-filled material.
  • A special process enables 224 to retain its excellent volume and surface resistance after prolonged exposure to elevated temperatures and 100% humidity.

Applications & Uses

Plastics & Elastomers Processing Methods
Product Applications

The inherent strength of Dacron fibers makes this compound excellent for applications requiring high physical and/or electrical properties.

Properties

Flame Rating
Physical Form
Flame Rating
UL 94 HB
Mechanical Properties
ValueUnitsTest Method / Conditions
Flexural Strength10 - 12,000psi
Compressive Strength18 - 25,000psi
Tensile Strength3,600 - 5,000psi
Impact Strength (Izod Notched)3ft-lb / inch
Thermal Properties
ValueUnitsTest Method / Conditions
Dimensional Stabilitymax. 0.06%
Thermal Expansion (at -40 °C to 100 °C)410⁻⁵ / °C
Heat Distortion Temperature (at 18.6 kg/cm²)260°C
Electrical Properties
ValueUnitsTest Method / Conditions
Arc Resistance125seconds
Dielectric Strength (Kv Step-by-Step, Dry)360volts/mil
Dielectric Strength (Kv Step-by-Step, Wet)350volts/mil
Dielectric Breakdown (Step-by-Step, Dry)62Kv
Dielectric Breakdown (Step-by-Step, Wet)58Kv
Dielectric Constant (at 1 KHz, Dry)3.4
Dielectric Constant (at 1 KHz, Wet)3.5
Dissipation Factor (at 1KHz, Dry)0.005
Dissipation Factor (at 1KHz, Wet)0.006
Surface Resistance Megaohms (As is)min. 10¹⁰
Surface Resistance, megaohms (at 70 °C, 30 Days, at 100% RH)10⁴
Dielectric Constant (at 1 MHz, Dry)3.5
Dielectric Constant (at 1 MHz, Wet)3.6
Dissipation Factor (at 1MHz, Dry)0.01
Dissipation Factor (at 1MHz, Wet)0.012
Moisture Properties
ValueUnitsTest Method / Conditions
Water Absorption (at 50 °C,48 hours)0.35%
Processing Information (Molding)
ValueUnitsTest Method / Conditions
Specific Gravity1.6
Bulk Factor6
Molding Pressure500 - 8,000psi
Molding Temperature135 - 190°C
Mold Shrinkage0.007 - 0.009In / In

Regulatory & Compliance

Certifications & Compliance