DAP K31/6220 is a versatile diallyl iso-phthalate molding compound, filled with short glass fibers and supplied in granular form. This compound offers excellent heat resistance and is suitable for a wide range of applications. It is easy to work with, pouring easily and allowing for preforming. Additionally, it molds readily using standard compression, transfer, or injection equipment. One notable feature of K31/6220 is its FDA approval for direct food contact use, making it a reliable choice for applications in the food industry where heat resistance and safety standards are essential.

Polymer Name: Diallyl Phthalate

Processing Methods: Compression Molding, Injection Molding, Transfer Molding

End Uses: Housings, Insulators, Structural Parts, Switches, Terminal Blocks

Density: 1760.0 - 1760.0 kg/m³

Tensile Strength: 0.0414 - 69.0 MPa

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Identification & Functionality

Polymer Name
Plastics & Elastomers Functions
Technologies

Features & Benefits

Key Features

K31 / 6220 has good impact strength, excellent electrical properties and very high heat service properties.

Applications & Uses

Plastics & Elastomers Processing Methods
Product Applications

The high strength of this material makes it ideal for switches, terminals, housings, structural parts and insulators.

Properties

Physical Form
Mechanical Properties
ValueUnitsTest Method / Conditions
Flexural Strength13 - 15,000psi
Compressive Strength24 - 26,000psi
Tensile Strength6 - 10,000psi
Impact Strength (Izod Notched)0.50 - 1.2ft-lb / inch
Thermal Properties
ValueUnitsTest Method / Conditions
Dimensional Stabilitymax. 0.01%
Thermal Expansion (at -40 °C to 100 °C)2.510⁻⁵ / °C
Heat Distortion Temperature (at 18.6 kg/cm²)260°C
Electrical Properties
ValueUnitsTest Method / Conditions
Arc Resistance180seconds
Dielectric Strength (Kv Step-by-Step, Dry)400volts/mil
Dielectric Strength (Kv Step-by-Step, Wet)400volts/mil
Dielectric Breakdown (Step-by-Step, Dry)64Kv
Dielectric Breakdown (Step-by-Step, Wet)60Kv
Dielectric Constant (at 1 KHz, Dry)4.1
Dielectric Constant (at 1 KHz, Wet)4.3
Dissipation Factor (at 1KHz, Dry)0.006
Dissipation Factor (at 1KHz, Wet)0.01
Surface Resistance Megaohms (As is)min. 10¹⁰
Surface Resistance, megaohms (at 70 °C, 30 Days, at 100% RH)10⁴
Dielectric Constant (at 1 MHz, Dry)4
Dielectric Constant (at 1 MHz, Wet)4.1
Dissipation Factor (at 1MHz, Dry)0.012
Dissipation Factor (at 1MHz, Wet)0.015
Moisture Properties
ValueUnitsTest Method / Conditions
Water Absorption (at 50 °C,48 hours)0.25%
Processing Information (Molding)
ValueUnitsTest Method / Conditions
Specific Gravity1.76
Bulk Factor2.5
Molding Pressure500 - 8,000psi
Molding Temperature135 - 170°C
Mold Shrinkage0.001 - 0.004In / In

Regulatory & Compliance

Certifications & Compliance