DAP K77/6220F is a high-quality diallyl iso-phthalate molding compound that combines short glass fibers and flame retardant properties. Supplied in granular form, it is designed for ease of use in molding applications. This compound has excellent flow characteristics, making it easy to pour and mold in standard compression, transfer, or injection equipment. Its flame retardant properties make it suitable for applications where fire resistance is a critical factor, such as in the production of components for fire safety equipment or other high-temperature environments.

Polymer Name: Diallyl Phthalate

Processing Methods: Compression Molding, Injection Molding, Transfer Molding

End Uses: Housings, Insulators, Structural Parts, Switches, Terminal Blocks

Density: 1780.0 - 1780.0 kg/m³

Tensile Strength: 0.0414 - 69.0 MPa

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Identification & Functionality

Additives Included
Polymer Name
Plastics & Elastomers Functions
Technologies

Features & Benefits

Key Features

K77 / 6220F has good impact strength, excellent electrical properties and very high heat service properties.

Applications & Uses

Plastics & Elastomers Processing Methods
Product Applications

The high strength of this material makes it ideal for switches, terminals, housings, structural parts and insulators.

Properties

Flame Rating
Physical Form
Flame Rating
UL 94 V0
Mechanical Properties
ValueUnitsTest Method / Conditions
Flexural Strength13 - 15,000psi
Compressive Strength24 - 26,000psi
Tensile Strength6 - 10,000psi
Impact Strength (Izod Notched)0.5 - 1.25ft-lb / inch
Thermal Properties
ValueUnitsTest Method / Conditions
Dimensional Stabilitymax. 0.01%
Thermal Expansion (at -40 °C to 100 °C)1.510⁻⁵ / °C
Heat Distortion Temperature (at 18.6 kg/cm²)260°C
Electrical Properties
ValueUnitsTest Method / Conditions
Arc Resistance180seconds
Dielectric Strength (Kv Step-by-Step, Dry)400volts/mil
Dielectric Strength (Kv Step-by-Step, Wet)400volts/mil
Dielectric Breakdown (Step-by-Step, Dry)64Kv
Dielectric Breakdown (Step-by-Step, Wet)60Kv
Dielectric Constant (at 1 KHz, Dry)4.2
Dielectric Constant (at 1 KHz, Wet)4.3
Dissipation Factor (at 1KHz, Dry)0.007
Dissipation Factor (at 1KHz, Wet)0.01
Surface Resistance Megaohms (As is)min. 10¹⁰
Surface Resistance, megaohms (at 70 °C, 30 Days, at 100% RH)10⁴
Dielectric Constant (at 1 MHz, Dry)3.9
Dielectric Constant (at 1 MHz, Wet)4.2
Dissipation Factor (at 1MHz, Dry)0.014
Dissipation Factor (at 1MHz, Wet)0.015
Test Parameter
ValueUnitsTest Method / Conditions
Percent of Curemax. 90 - 99%
Moisture Properties
ValueUnitsTest Method / Conditions
Water Absorption (at 50 °C,48 hours)0.25%
Processing Information (Molding)
ValueUnitsTest Method / Conditions
Specific Gravity1.78
Bulk Factor2.5
Molding Pressure500 - 8,000psi
Molding Temperature135 - 170°C
Mold Shrinkage0.001 - 0.004In / In

Regulatory & Compliance

Certifications & Compliance