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Identification & Functionality
Two of the major sources of contamination in semiconductor processes are trace elements of unwanted chemicals (anions) and organic contaminants (TOCs). Process chemicals and process water can become contaminated and interfere with wafer processing. Chlorine (i.e., chloride ion) is such a contaminant and is rigorously controlled in process chemicals. In UPDI systems, TOCs can adhere to wafer surfaces and adversely affect oxide quality or film quality. Elastomeric seals can be a source of this contamination. DuPont has developed products to minimize the potential for chemical and organic contamination.
Kalrez® 6375UP Features & Benefits
Applications & Uses
Properties
| Value | Units | Test Method / Conditions | |
| Modulus (at 100% Elongation) | 9.1 | MPa | ASTM D 412 |
| Tensile Strength | 15.2 | MPa | ASTM D 412 |
| Elongation (at Break) | 160 | % | ASTM D 412 |
| Hardness (Shore A) | 75 | - | ASTM D 2240 |
| Compression Set (Pellet Type 1, at 204°C, 70h) | 24 | % | ASTM D 395B |
| Compression Set (O-Ring AS568-214, at 204°C, 70h) | 25 | % | ASTM D 1414 |
| Value | Units | Test Method / Conditions | |
| Maximum Service Temperature ¹ | 275 | °C | - |
| Lowest Service Temperature ¹ | -20 | °C | - |
| Value | Units | Test Method / Conditions | |
| Glass Transition Temperature (at 10°C/min) | -3.8 | °C | ASTM D 3418 |
| Coefficient of Linear Thermal Expansion | 2.89 | E-4/°C | ISO 11359-1/-2 |
| Retraction Temperature (TR-10) | -3 | °C | ASTM D 1329 |
| Value | Units | Test Method / Conditions | |
| Density | 1.99 | g/cm³ | ISO 1183 |
- [1]: DuPont proprietary test method; useful temperature range may vary with seal design and application specifics
Kalrez® Offers Excellent Resistance to Chemical Attack
For many applications, low volume swell of elasto mers is critical for proper equipment operation. Excessive swell may cause permanent seal failure due to equipment hang-up, extrusion, etc. While other physical property testing may be needed to adequately define product performance in a particular application, volume swell is an excellent indicator of resistance to chemical attack. The following data represents a summary of internal and external compatibility tests performed to determine the volume swell of products suggested for semi conductor wet process environments.
|
Immersion Chemistry |
Exposure Conditions |
Kalrez® 6375UP |
Kalrez® 4079UP | Kalrez® 1050UP |
|---|---|---|---|---|
| UPDI Water |
85°C, 30 days |
0.7 | 2.3 | 5.5 |
| Piranha |
25°C, 30 days |
0.1 | 0.1 | 0.1 |
|
SC-1 |
25°C, 30 days |
0.6 | 1.1 | 0.6 |
|
SC-2 |
25°C, 30 days |
0.1 | 0.1 | 0.2 |
|
49% HF |
25°C, 30 days |
2.8 | 0.6 | 1.8 |
|
Ammonium Hydroxide |
100°C, 7 days |
2.6 | 9.8 | Not Tested |
|
Sulfuric Acid (H2SO4) |
120°C, 30 days |
1.3 |
0.8 |
2.8 |
|
Nitric Acid (HNO3) |
85°C, 7 days |
2.1 | 1.5 | Not Tested |
|
Phosphoric/Acetic/Nitric Acid |
60°C, 28 days |
1.0 | 1.0 | Not Tested |
|
Hydrofluoric Acid/HNF4 |
60°C, 28 days |
0.0 | 1.0 | Not Tested |
|
Hydrochloric, Nitric Acid and H20 |
60°C, 28 days |
5.0 |
6.0 | Not Tested |
|
n-Methylpyrrolidone |
80°C, 7 days |
2.0 |
2.4 |
3.2 |
|
Dimethyl Acetimide |
80°C, 7 days |
2.4 | 4.0 |
4.4 |
|
ACT 690C™1 |
95°C, 10 days |
1.5 | 7.9 |
2.0 |
|
ACT-NP870™1 |
80°C, 10 days |
2.0 | 6.2 | 6.2 |
|
ACT 935™1 |
ACT 935 |
1.6 | 5.1 | 1.8 |
|
ACT NE-14™1 |
25°C, 10 days |
0.0 | 0.0 | 0.3 |
|
ACT CMI™1 |
80°C, 10 days |
2.7 | 6.5 | 5.2 |
| EKC265™2 |
75°C, 7 days |
1.0 | 2.8 | 0.7 |
|
EKC830™2 |
75°C, 7 days |
3.1 |
10.0 |
10.1 |
|
EKC4000™ PCT2 |
75°C, 7 days |
0.7 | 2.8 | 2.5 |
|
PRS-1000® 3 |
95°C, 10 days |
1.5 | 7.9 | 2.0 |
|
PRS-3000™3 |
80°C, 10 days |
2.0 | 6.2 | 2.0 |
|
ALEG™310^3 |
80°C, 10 days |
1.6 | 5.1 | 1.8 |
|
REZI™ 28^3 |
80°C, 10 days |
2.7 | 6.5 | 5.2 |
Technical Details & Test Data
Process chemicals can cause metallic ions to leach out of seal materials. These metallic ions, depending on type and quantity, can alter electrical properties and cause device failure to occur. Below is a summary of total metallic extractables after immersion of O-rings in various cleaning and wafer preparation process chemicals. Kalrez® 6375UP has an excellent balance of chemical resistance and low metallic extractables in a variety of process fluids.
