Kalrez® 8002

• Ultra-low particle generation in oxygen and fluorine-based plasmas

• Excellent (low) compression set properties

• Excellent plasma-cracking resistance

• Excellent resistance to dry process chemistry

Kalrez® 8002 has been reported to significantly improve wafer production in a variety of semiconductor ash process applications where oxygen and fluorinated plasmas are used.

Case Report #7737 - Kalrez® 8002 Improved Wafer Production Over 5x versus Incumbent Perfluoroelastomer

• Process Type: Ash • Process chemistry: O2, CF4

• Process Temperature: ~80C

• Cleaning chemistry: N/A

• Incumbent Performance: Perfluoroelastomer failed after 270 RF hours due to cracking and vacuum leakage.

Case Report #4536 - Kalrez® 8002 Improved Wafer Production Over 50% versus Incumbent Perfluoroelastomer

• Process Type: Ash top/bottom plasma tube seals

• Process chemistry: O2, CF4

• Process Temperature: 80-150C • Cleaning chemistry: N/A

• Incumbent Performance: Perfluoroelastomer failed due to erosion and excessive particle generation after 6 months

Competitive FFKM A11 and Kalrez® 8002 after comparable life cycles in the same process

• Gas inlet seals

• Gas orifice seals

• Gas feedthrough seals

• "Select" bonded door seals

• Other static and low stress/low sealing force applications

• [1]: DuPont proprietary test method; useful temperature range may vary with seal design and application specifics