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Sold by DuPont
Ready to Use Product Type: 1K (1 component) Adhesive
Compatible Substrates & Surfaces: Polyesters, Elastomers & Rubbers, Acrylic, Polyamide, Metal, Plastics
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TypeDocument Name
Rubber-to-Substrate Bonding Agents Technical Guide
Rubber-to-Substrate Bonding Agents Technical Guide
Strong Adhesion for Rubber-to-Plastic
Strong Adhesion for Rubber-to-Plastic
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Technical Data Sheet
THIXON™ P-11 Technical Data Sheet
THIXON™ P-11 Technical Data Sheet
Technical Data Sheet

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Identification & Functionality

Ready to Use Product Type
Ready-to-Use Products

THIXON® P-11 Features & Benefits

Applications & Uses

Use Recommendations


Molding and Curing

THIXON® P-11 can be used with all common molding and curing methods. Cure temperatures between 120ºC and 205ºC are recommended.

Preliminary Surface Preparation

Properly preparing the metal surface is essential to obtaining consistent, high quality bonds. A mechanical or chemical pre-treatment should follow degreasing. Common pre-treatments are grit blasting and phosphatizing. Further details are provided in our "Substrates Preparation Guide", please contact your usual DuPont representative should you need a copy of this guide.

Mixing and Diluting

Diluents: Use ketones like methyl isobutyl ketone (MIBK) and MEK or 1:1 mixtures of ketones and aromatic solvents such as toluene or xylene. First, thoroughly mix THIXON® P-11 with a propeller-type agitator. If diluting, slowly add the diluents to the adhesive while mixing constantly. Continue to mix THIXON® P-11 while spraying to keep the dispersed solids from settling to the bottom. This will assure that a  homogeneous mixture of the adhesive is applied.

Applying the Adhesive

THIXON® P-11 can be applied by brushing, dipping, spraying or other application methods. For spray application, the viscosity can be reduced by either dilution and/or heating e.g. 40°C.

  • Brushing: Apply undiluted
  • Dipping: Dilution ratio : 1 p.b.w. bonding agent + 0.1 - 0.3 p.b.w. diluent
  • Spraying with air:
  • Dilution ratio : 1 p.b.w. bonding agent + 0.4 - 1.0 p.b.w. diluent
  • Viscosity : at room temperature
  • 30 - 50 seconds [Afnor-2.5-cup]
  • 11 - 13 seconds [DIN-4-cup]
  • 11 - 13 seconds [Ford-4-cup]
  • 15 - 18 seconds [Zahn cup #2]
  • Spray gun : Most spray equipment can be used
  • Nozzle: e.g. 1mm
  • Air pressure : 2 - 4 bar

Drying Time

The drying time is approximately 30 min at room temperature. Drying at higher  temperatures will reduce drying time accordingly, e.g. 5 minutes forced drying at 80°C. Heated circulating air can accelerate drying further.

Dry Film Stability

THIXON® P-11 has excellent dry film stability. Inserts coated with THIXON P-11 can be stored for several weeks, if protected from contamination.

Pre-bake Resistance

Adhesive-coated inserts can be pre-baked for up to 5-10 minutes at 160ºC without adversely affecting bond quality. Dried films of THIXON® P-11 show no tendency to sweep during transfer or injection molding.


Cleaning should be done using ketones like methyl ethyl ketone (MEK) or methyl isobutyl ketone (MIBK).


Typical Properties
ValueUnitsTest Method / Conditions
Density0.94g/cm³ISO 845
Solid Content22 - 26%-
Thermal Properties
ValueUnitsTest Method / Conditions
Flash Point16°CASTM D 92
VDA Properties
ValueUnitsTest Method / Conditions
Volatile Organic Compounds (Calculated)705kg/m³-
Application Technique
ValueUnitsTest Method / Conditions
Theoretical Coverage18.5m²/L-
Recommended Film Thickness5 - 10µm-
Rheological Properties
ValueUnitsTest Method / Conditions
Cup Viscosity11 - 13sFord #4
Brookfield Viscosity0.08 - 0.18Pa.s-

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Shelf Life
24 months