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Zytel® HTN52G35HSL BK083

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Polymer Name: Polyphthalamide (PPA), Polyamide 6T/66 (PA 6T/66)
Processing Methods: Injection Molding
Fillers Included: Glass Fiber
Flexural Modulus: 10300.0 MPa
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Identification & Functionality

Chemical Family
Fillers Included
Plastics & Elastomers Functions
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Zytel® HTN52G35HSL BK083 Features & Benefits

Applications & Uses

Properties

Color
Flame Rating
Part Marking Code
>PA6T/66-GF35<, >PA6T/66-GF35<
Mechanical Properties
ValueUnitsTest Method / Conditions
Tensile Modulus12000/12000MPaISO 527-1/-2
Flexural Modulus10300/10300MPaISO 178
Poisson's Ratio0.33/0.33--
Stress (at Break)200/180MPaISO 527-1/-2
Strain (at Break)2.3/2.6%ISO 527-1/-2
Charpy Impact Strength (at 23°C)45/-kJ/m²ISO 179/1eU
Charpy Impact Strength (at -30°C)40/35kJ/m²ISO 179/1eU
Notched Charpy Impact Strength (at 23°C)9/9kJ/m²ISO 179/1eA
Notched Charpy Impact Strength (at -30°C)7/6kJ/m²ISO 179/1eA
Typical Properties
ValueUnitsTest Method / Conditions
Resin IdentificationPA6T/66-GF35-ISO 1043
ISO DesignationISO 16396-PA6T/66,GF35,M1CGHR,S10-120--
Thermal Properties
ValueUnitsTest Method / Conditions
Melt Temperature (First Heat)310/*°CISO 11357-1/-3
Glass Transition Temperature (at 10°C/min)90/45°CISO 11357-1/-2
Temperature of Deflection Under Load (1.8 Mpa)285/*°CISO 75-1/-2
Coefficient of Linear Thermal Expansion (Parallel)21/*E-6/KISO 11359-1/-2
Coefficient of Linear Thermal Expansion (Normal)67/*E-6/KISO 11359-1/-2
Coefficient of Linear Thermal Expansion (Normal, at -40 to 23°C)61/*E-6/KISO 11359-1/-2
Coefficient of Linear Thermal Expansion (Normal, at 55-160°C)80/*E-6/KISO 11359-1/-2
Coefficient of Linear Thermal Expansion (Parallel, at -40 to 23°C)21/*E-6/KISO 11359-1/-2
Coefficient of Linear Thermal Expansion (Parallel, at 55-160°C)11/*E-6/KISO 11359-1/-2
Relative Thermal Index (Electrical, 0.75mm)150°CUL 746B
Relative Thermal Index (Electrical, 1.5mm)150°CUL 746B
Relative Thermal Index (Electrical, 3mm)150°CUL 746B
Relative Thermal Index (Impact, 0.75mm)125°CUL 746B
Relative Thermal Index (Impact, 1.5mm)125°CUL 746B
Relative Thermal Index (Impact, 3mm)125°CUL 746B
Relative Thermal Index (Strength, 0.75mm)130°CUL 746B
Relative Thermal Index (Strength, 1.5mm)125/*°CUL 746B
Relative Thermal Index (Strength, 3mm)150°CUL 746B
Electrical Properties
ValueUnitsTest Method / Conditions
Electric Strength34/33kV/mmIEC 60243-1
Comparative Tracking Index600/--IEC 60112
Volume Resistivity1E13/-Ohm.mIEC 62631-3-1
Flammability
ValueUnitsTest Method / Conditions
FMVSS ClassB-ISO 3795 (FMVSS 302)
Burning Behavior (at 1.5mm/* Nominal Thickness)UL94 HB/*classIEC 60695-11-10
Burning Behavior (at 0.75mm/* Thickness)UL94 HB/*classIEC 60695-11-10
Glow Wire Flammability Index (at 0.75mm)750/-°CIEC 60695-2-12
Glow Wire Flammability Index (at 1.5mm)700/-°CIEC 60695-2-12
Glow Wire Flammability Index (at 3mm)850/-°CIEC 60695-2-12
Glow Wire Ignition Temperature (at 0.75mm)775/-°CIEC 60695-2-13
Glow Wire Ignition Temperature (at 1.5mm)725/-°CIEC 60695-2-13
Glow Wire Ignition Temperature (at 3mm)775/-°CIEC 60695-2-13
Burning Rate (at 1mm Thickness)44mm/minISO 3795 (FMVSS 302)
Other Properties
ValueUnitsTest Method / Conditions
Humidity Absorption (at 2mm)2/*%Sim. to ISO 62
Water Absorption (Immersion 24h) ᴰˢ0.4/*%Sim. to ISO 62
Density of Melt1100kg/m³-
Density1460/-kg/m³ISO 1183
Processing Information (Injection Molding)
ValueUnitsTest Method / Conditions
Drying Recommendedyes--
Drying Temperature100°C-
Drying Time (Dehumidified Dryer)6 - 8h-
Processing Moisture Contentmax. 0.1%-
Melt Temperature (Optimum)325°C-
Melt Temperature (Minimum)320°C-
Melt Temperature (Maximum)330°C-
Mold Temperature (Minimum)90°C-
Mold Temperature (Maximum)110°C-
Rheological Properties
ValueUnitsTest Method / Conditions
Viscosity Number ¹110/*cm³/gISO 307, 1157, 1628
Mold Shrinkage (Parallel)0.3/-%ISO 294-4, 2577
Mold Shrinkage (Normal)0.9/-%ISO 294-4, 2577
Note
  • [1]: formic acid 90%
  • [DS]: Derived from similar grade
Chemical Resistance
Chemical Type Chemical Name Resistance
Acids Acetic Acid (5% by mass) (23°C) Probably Resistant
Acids Citric Acid solution (10% by mass) (23°C) Probably Resistant
Acids Lactic Acid (10% by mass) (23°C) Probably Resistant

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Technical Details & Test Data

Stress vs Strain (Cond.)

DuPont Zytel HTN52G35HSL BK083 Stress vs Strain (Cond.)

Stress vs Strain (Dry)

DuPont Zytel HTN52G35HSL BK083 Stress vs Strain (Dry)

Secant Modulus vs Strain (Cond.)

DuPont Zytel HTN52G35HSL BK083 Secant Modulus vs Strain (Cond.)

Secant Modulus vs Strain (Dry)

DuPont Zytel HTN52G35HSL BK083 Secant Modulus vs Strain (Dry)

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Zytel® HTN52G35HSL BK083
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