Knowde Enhanced TDS
Identification & Functionality
- Product Type
- Technologies
- Product Families
Features & Benefits
- Labeling Claims
- Ready-to-Use Product Features
- Product Overview
Engineered Fluids’ ElectroCool Dielectric Coolants are formulated specifically for use in all Single-phase Liquid Immersion Cooling solutions. ElectroCool is specifically designed to meet the most stringent high-performance cooling and insulation challenges posed in highperformance full immersion cooling of servers, storage, GPUs, FPGAs, ASICs, and semiconductor applications.
Modern electrical systems operate at increasingly high energy densities, often in very small packaging. These factors combined with increases in operational frequency and output power, makes the effective removal of waste heat a key limiting factor in the design and efficiency of these systems. This challenge is further complicated by the need to ensure and warranty material compatibility with the immersed components while ensuring the operational health and safety of personnel, and eliminating any negative environmental impacts posed by the coolants’ manufacture and use.
Engineered Fluids’ ElectroCool Dielectric Coolants effectively solve all these challenges. ElectroCool Dielectric Coolants are 98% biodegradable, nontoxic, non-halogenated, food grade and 100% ozone safe. In addition, the use and manufacture of ElectroCool Dielectric Coolants release no toxic waste or vapors into the workplace or environment, making Engineered Fluids’ ElectroCool coolants easy to transport, use, and clean up.
- Key Properties
- Biodegradable
- Non-Toxic
- NSF Food Grade Certified
- High Material Compatibility Index High Dielectric Strength
- Broad Range of Viscosities
- Displaces Water
- Exceptional Oxidation Stability
- Suppresses All Corrosion
- Prevents Tin and Zinc Whisker Growth
Applications & Uses
- Applications
- Application Area
- Industries Served
- Aerospace
- Automotive
- Communications
- Ceramics
- Datacenters
- Manufacturing
- Marine
- Medical
- Military
- Oil & Gas
- Power Engineering
- Semiconductors
- Robotics
- Thermal Management Applications
- CPU / GPU / FPGA
- Electric Motors & Drive Trains
- Batteries
- Data Storage Transformers
- Hydraulics
- Optical & Laser Diodes
- Power Vacuum Tubes RF Amplifiers & Transmitters
- Electronics Immersion Cooling
- Ceramics Poling Thermal Runaway Suppression
- Pressure Compensation
- Hydrostatic Energy Transfer
- Typical Application
Outdoor and sealed system electronics cooling and insulation.
Properties
- Appearance
- Clear
- Fluid Behavior
- Non-Compressible, Isotropic, Newtonian
- Typical Properties
Value | Units | Test Method / Conditions | |
Biodegradability | min. 95 | % | — |
Coefficient of Thermal Expansion | 0.00067 | volume/°C | — |
Density (16°C) | 0.82 | g/cc | — |
Dielectric Constant | 2.08 | — | — |
Dielectric Strength | min. 60 | kV | — |
Flash Point | 193.0 | °C | — |
Global Warming Potential | 0.0 | — | — |
Particle Count | 10/10/2012 | — | ISO 4460 |
Kinematic Viscosity (0°C) | 43.1 | cSt | — |
Kinematic Viscosity (100°C) | 2.22 | cSt | — |
Kinematic Viscosity (40°C) | 8.11 | cSt | — |
Materials Compatibility Warranty | Yes | — | — |
Pour Point | -57.0 | °C | — |
Product Operational Warranties | 2000-05-10 | Years | — |
Refractive Index (nD²⁰) | 1.441 | — | — |
Resistivity | max. 1 x 10¹⁴ | ohm-cm | — |
Specific Heat (0°C) | 2.0608 | kJ/kg°C | — |
Specific Heat (100°C) | 2.439 | kJ/kg°C | — |
Specific Heat (40°C) | 2.2121 | kJ/kg°C | — |
Thermal Conductivity (0°C) | 0.1382 | W/mK | — |
Thermal Conductivity (100°C) | 0.1325 | W/mK | — |
Thermal Conductivity (40°C) | 0.1359 | W/mK | — |
Total Sulfur | 0.0 | ppm | — |
Regulatory & Compliance
- Certifications & Compliance
Storage & Handling
- Shelf Life
- 25 Years for a sealed original steel container.