EPOXIBOND

EpoxySet Inc. Brand

Products:17

EPOXIBOND optical adhesives are low viscosity, optically clear adhesives. Each product has been engineered for use in a variety of industries including fiber-optic, medical, and electronics industries. Epoxyset medical adhesives are designed for use in medical devices such as MRI devices, endoscopes, catheters, ultrasound probes etc. In addition to the products below, we custom manufacture adhesives for use in the medical device industry.

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EPOXIBOND™ EB-177

Ready to Use Product Type:Adhesive, 2K (2 component) Adhesive, Potting Compound
Application Area:Optical Applications, Medical Devices, Optoelectronics Devices, Medical Applications
Cure Method:Heat Cure
Chemical Family:Epoxy & Epoxy Derivatives

EPOXIBOND™ EB-107LY is a two-part, low viscosity, clear epoxy adhesive and encapsulating material. EB-107LY is a low yellowing version of EB-107LP-2. It is recommended for bonding and encapsulating where reduced yellowing is preferred. It is recommended for joining transparent materials, such as glass, and where a thin bond line is desired. EB-107LY can be used for bonding most metals, ceramics, and some plastics.

EPOXIBOND™ EB-119M

Applications:Semiconductor Manufacturing, Consumer Electronics, Appliances & Electronics
Product Families:Encapsulants, Adhesives & Sealants
Chemical Family:Epoxy & Epoxy Derivatives

EPOXIBOND™ EB-109M-11 is a flexible, two components, low viscosity, clear epoxy adhesive for optical, medical, and semiconductor applications. This long working life adhesive can be cured at room temperature or with moderate heat and provides excellent adhesion to glass, quartz, metals, wood and most plastics.

EPOXIBOND™ EB-119SP

Applications:Sensors & Actuators, Printed Circuit Boards (PCBs), Consumer Electronics
Product Families:Structural Adhesives, Encapsulants, Adhesives & Sealants
Chemical Family:Epoxy & Epoxy Derivatives

EPOXIBOND™ EB-116 is high strength, structural epoxy adhesive. This tough adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high-performance epoxy adhesive exhibits very good physical, thermal, and electrical insulation properties and is excellent for cryogenic applications. It is recommended for bonding glass, metal, ceramics, and engineering thermoplastics. Due to its low viscosity, it can be also used for potting and encapsulating electrical/electronic coponents

EPOXIBOND™ EB-116

Chemical Family:Epoxy & Epoxy Derivatives
Ready to Use Product Type:Potting Compound, 2K (2 component) Adhesive
Cure Method:Heat Cure, Air Dry
Application Area:Photonic Devices, Interconnect, Electrical Components, Semiconductors, Cryogenic Applications, Printed Electronics
Compatible Substrates & Surfaces:Metal, Glass, Plastics, Ceramic

EPOXIBOND™ EB-107LP-1 is a two component, room temperature curing epoxy featuring very low viscosity, and excellent optical-mechanical properties.

EPOXIBOND™ EB-135

Ready-to-Use Product Type:Adhesive, 2K (2 component) Adhesive
Application Area:Medical Applications, Optical Applications, Medical Devices, Automotive Lighting, Optoelectronics Devices
Compatible Substrates & Surfaces:Glass, Plastics, Metal
Cure Method:Air Dry, Heat Cure
Application Method:Gun
Chemical Family:Epoxy & Epoxy Derivatives

EPOXIBOND™ EB-107LP-2 is a two component - optical, medical, and semiconductor grade epoxy resin, with low viscosity, long pot-life, and good handling characteristics.

EPOXIBOND™ EB-109M-11

Applications:Equipment & Parts, Consumer Electronics, Appliances & Electronics
Product Families:Encapsulants, Adhesives & Sealants
Chemical Family:Epoxy & Epoxy Derivatives

EPOXIBOND™ EB-155 is an undiluted, unfilled, low viscosity clear epoxy system that exhibits exceptional resistance to impact and thermal shock. This system has low exotherm and long work life. Applications includes, high bond strength adhesive for most similar and dissimilar substrates; LED displays, any fiber optic application. It can also be used for making in-place laminates or for protective coating on metals etc. Also it can be used for semi-rigid, moisture proof, gas tight seals between plastic and metallic or other substrates. This is also recommended for potting devices such as connector shells from which rigid or flexible wires may protrude directly through the epoxy.

EPOXIBOND™ EB-107LP-1

Applications:Housewares, Consumer Electronics, Appliances & Electronics
Product Families:Encapsulants, Adhesives & Sealants
Chemical Family:Epoxy & Epoxy Derivatives

EPOXIBOND™ EB-177 is a low viscosity, high Tg, two part epoxy that can be used for potting, encapsulating, or bonding. It is used highly in the medical, optical, and semiconductor industries.EB-177 has excellent high temperature resistance at 300°C and excellent solvent, chemical, and moisture resistance including gamma rays, autoclave, and ETO. It is an excellent choice for semiconductor applications including capillary under fill or flipchip die attach.

EPOXIBOND™ EB-107LP-2

Applications:Appliances & Electronics, Industrial Manufacturing, Industrial Adhesives & Sealants
Product Families:Structural Adhesives, Encapsulants, Adhesives & Sealants
Chemical Family:Epoxy & Epoxy Derivatives

FLASHBOND™ UV-3607HTis a 1-component, UV/Thermal cure adhesive & sealant. This material can cure under moderate intensity UV light as well as elevated temperatures for shadowed areas. Its low viscosity is ideal for coating, capillary action, and doming applications. Unlike traditional dual cure epoxy systems which need light + heat, UV-3607HT can cure either with UV/LED light or with heat.

EPOXIBOND™ EB-107LY

Ready-to-Use Product Type:2K (2 component) Adhesive
Compatible Substrates & Surfaces:Metal, Ceramic, Glass, Plastics
Cure Method:Air Dry, Heat Cure
Chemical Family:Epoxy & Epoxy Derivatives

EPOXIBOND™ EB-135LP

Applications:Semiconductor Manufacturing, Consumer Electronics, Appliances & Electronics
Product Families:Structural Adhesives, Adhesives & Sealants
Chemical Family:Epoxy & Epoxy Derivatives

FLASHBOND™ UV-3700F is a filled, low shrinkage, light curing epoxy adhesive that offers low CTE and high bonds strength. UV-3700F cures to a high Tg, rigid polymer with excellent adhesive to metals, ceramics, and glass. This filled system is excellent for when low viscosity systems are not ideal. Due to the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cure in the presence of visible light (400- 415nm).

EPOXIBOND™ EB-153

Applications:Semiconductor Manufacturing, Consumer Electronics, Appliances & Electronics
Product Families:Encapsulants, Structural Adhesives, Adhesives & Sealants
Chemical Family:Epoxy & Epoxy Derivatives

FLASHBOND™ UV-5402 is a low viscosity, flexible, light curing epoxy adhesive that offers excellent strenth and flexibility for reduced cracking. UV-5402 is low viscosity and high elongation. This product requires direct light exposure during cure. Because of the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cure in the presence of visible light (400-415nm) and can also cure down to 365nm.

EPOXIBOND™ EB-155

Applications:Consumer Electronics, Appliances & Electronics, Medical Devices & Assemblies
Product Families:Encapsulants, Structural Adhesives, Adhesives & Sealants
Chemical Family:Epoxy & Epoxy Derivatives

EB-155 is an undiluted, unfilled, low viscosity clear epoxy system that exhibits exceptional resistance to impact and thermal shock. This system has low exotherm and long work life. Applications includes, high bond strength adhesive for most similar and dissimilar substrates; LED displays, any fiber optic application. It can also be used for making in-place laminates or for protective coating on metals etc. Also it can be used for semi-rigid, moisture proof, gas tight seals between plastic and metallic or other substrates. This is also recommended for potting devices such as connector shells from which rigid or flexible wires may protrude directly through the epoxy.

Knowde Brand Summary

Identification

Chemical Family: Epoxy & Epoxy Derivatives
Product Type: 2K (2 component) Adhesive,
Adhesive,
Encapsulant,
Epoxy Adhesive,
Potting Compound,
Structural Adhesive
Technologies: Ready-to-Use Products
Product Families: Adhesives & Sealants
Conductive Adhesives,
Encapsulants,
Structural Adhesives

Features & Benefits

Labeling Claims: Biocompatible,
Non-Hazardous,
Non-Toxic

Applications & Uses

Markets: Adhesives & Sealants,
Automotive & Transportation,
Consumer Goods,
Electrical & Electronics,
Healthcare & Pharma,
Industrial
Applications: Appliances & Electronics
Automotive
Automotive Lighting
Bonding & Assembly
Body Shop & Repair,
Sealants,
Transportation Assembly
Chemical & Industrial Manufacturing
Equipment & Parts,
Industrial Adhesives & Sealants
Devices & Assemblies
Consumer Electronics
Housewares
Industrial & Assembly Adhesives
Industrial Manufacturing
Medical
Medical Devices & Assemblies
Packaging & Assembly
Adhesives & Sealants,
Potting Compounds
Parts & Components
Printed Circuit Boards (PCBs),
Semiconductor Manufacturing,
Sensors & Actuators
Wire & Cable
Optical Fiber & Telecom,
Power Transmission & Distribution
Application Area: Automotive Lighting,
Capacitor Bushings,
Capacitors,
Cryogenic Applications,
Electrical Components,
Electronic Components,
Fiber Optic Cables,
Integrated Circuits,
Interconnect,
Measuring Instruments,
Medical Applications,
Medical Devices,
Mirror,
Optical Applications,
Optoelectronics Devices,
Photonic Devices,
Power Transformers,
Printed Circuit Boards,
Printed Electronics,
Semiconductor Die Attach,
Semiconductors,
Sensors
Application Method: Gun
Compatible Polymers & Resins: Acrylics
Compatible Substrates & Surfaces: Ceramic,
Glass,
Metal,
Plastics,
Wood
Cure Method: Air Dry,
Heat Cure