SetWORX

EPOXIBOND™ EB-119M is a two component, low viscosity, heat cure epoxy designed for high temperature applications. It is especially well suited to fiber optic terminating, where optical fibers are "pot and polished" into connectors or ferrules.

EPOXIBOND™ EB-119SP is unfilled, low viscosity, heat curing, high temperature resistant epoxy adhesive. It maintains high lap shear strength up to 210°C and has excellent thermal and chemical resistance. It can be used for bonding, coating, and sealing applications where a thin film with high insulating resistance is required, particularly at elevated temperatures. It is recommended for bonding metals, glass, and ceramic substrates. It has long pot-life and has an amber color change upon cure.

EPOXIBOND™ EB-135 is a clear epoxy adhesive designed for electronic, optical, medical, and general applications and for casting of small electrical components. This epoxy system has 2 to 1 mixing ratio by volume & cure fast at moderate temperature. The cured adhesive gives high impact and bond strength. It can be used for bonding glass, metals, woods and some plastics

EPOXIBOND™ EB-135LP is a clear epoxy adhesive designed for electronic, optical, medical, and general applications and for casting of small electrical components. This epoxy system has 2 to 1 mixing ratio by volume & cure fast at moderate temperature. The cured adhesive gives high impact and bond strength. It can be used for bonding glass, metals, woods and some plastics.

EPOXIBOND™ EB-153 is unfilled, low viscosity, heat curing, high temperature resistant epoxy adhesive. It maintains high lap shear strength up to 210°C and has excellent thermal and chemical resistance. It can be used for bonding, coating, and sealing applications where a thin film with high insulating resistance is required, particularly at elevated temperatures. It is recommended for bonding metals, glass, and ceramic substrates. It has long pot-life and has an amber color change upon cure.

SetWORX™ U-47MP is a two component, urethane adhesive & encapsulating material which cures to a resilient polyurethane polymer. It finds use as an adhesive, potting and encapsulating material. U-47MP provides a sag resistent bead when dispensed and delivers excellent adhesion to many materials including metals, glass and engineering plastics.

SETWORX™ UV-35G is an epoxy adhesive and encapsulating compound designed for electronic, optical, medical, and general industrial applications Once mixed, UV-35G will polymerize and gel instantaneously upon exposure to UV light reducing fixture time to seconds. Once gelled, UV-35G will continue to cure at room temperature or at elevated temperature until fully cured. This epoxy system has 2 to 1 mixing ratio by volume and is available in easy to us dual cartridge systems.