Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Technologies
Features & Benefits
Applications & Uses
- Applications
- Application Area
- Cure Method
- Features & Applications
- Semiconductor
- Wafer to wafer bonding
- MEMs devices
- Flip chip underfill
- Hybrid
- Fiber optic
- Hermetic seals and high temperature packaging sensors
- Fiber Optic
- Sealing fiber into ferrules
- Transmitting light in the optical pathway
- Fiber component packaging
- Adhesive for active alignment of optics
- Environmental seal of opto-package
- V-groove arrays
- Medical
- Potting fiber optic bundles into ferrules for light guides and endoscopes
- Capable of resisting several sterilization techniques
- Certified USP Class VI for Biocompatibility Standards
- Adhesive for catheter devices
- Electronics Assembly
- Used as dielectric layer in the fabrication of capacitors
- Laminating PZT ferroelectrics
- Impregnating windings in motors and inductor coils
- Bonding ferrite cores and magnets
- Structural adhesive for electronic components
- Semiconductor
- Instructions for Use
- Weigh each 10 grams of RESIN (PART-A) to 1 gram of Hardener (PART-B).
- Mix until uniform. Scrape the sides and bottom of container repeatedly during mixing.
- Apply to clean bonding surfaces and cure as recommended to achieve the desired properties.
- Typical cured properties were determined using recommended cure schedule.
Properties
- Typical Cured Properties
- Handling Properties
| Value | Units | Test Method / Conditions | |
| Specific Gravity | 1.18 | — | — |
| Hardness | 87 | Shore D | — |
| Refractive Index | 1.56 | — | — |
| Spectral Transmission (at 800-1000 nm) | min. 98 | % | — |
| Spectral Transmission (at 1100-1600 nm) | min. 95 | % | — |
| Lap Shear Strength to Aluminium | 2600 | psi | — |
| Die Shear Strength (at 25°C) | min. 5000 | psi | — |
| Service Temperature Range | -55 to 250 | °C | — |
| Glass Transition Temperature (Tg) | min. 115 | °C | — |
| Coefficient of Linear Thermal Expansion (Below Tg) | 54 | 10⁻⁶/°C | — |
| Coefficient of Linear Thermal Expansion (Above Tg) | 190 | 10⁻⁶/°C | — |
| Dielectric Strength | 380 | Volts/mil | — |
| Dielectric Constant (at 1 kHz) | 3.2 | — | — |
| Dissipation Factor (at 1 kHz) | 0.006 | — | — |
| Volume Resistivity | min. 1x10¹⁵ | ohm-cm | — |
| Value | Units | Test Method / Conditions | |
| Mix Ratio by Weight (Adhesive/Hardener) | 100/10 | — | — |
| Mixed Viscosity (at 25°C) | 3000 - 5000 | cps | — |
| Pot Life (at 25°C, 100 grams) | 5 - 6 | hours | — |
Regulatory & Compliance
- Certifications & Compliance
Technical Details & Test Data
- Curing Information
Cure Schedules: (Bondline Temperature):
- 1-2 minutes at 150°C
- 5-10minutes at 125°C
- 10-15 minutes at 100°C
- 30-50 minutes at 80°C
- Frozen Adhesive
Thaw premixed frozen adhesive at room temperature for 5-10 minutes. Dispense adhesive and cure at recommended schedules.
Safety & Health
- Safety Information
- For Industrial Use Only : Practices of good housekeeping, safety and cleanliness should be followed before, during and after use.
- Warning : Adequate ventilation of workplace and ovens is essential. These materials may cause injury to the skin following prolonged or repeated contact and dermatitis in susceptible individuals. In case of skin contact, wash thoroughly with soap and water. For eyes, flush immediately with plenty of water for at least 10 minutes and seek medical attention. Refer to Safety Data Sheet (SDS) for additional health and safety information.
Packaging & Availability
- Availability
- 2 parts Kit : Packaged in Pint, Quart, and 1-Gallon size
- Premixed and frozen : Packaged in 3cc, 5cc, 10cc and 30cc disposable syringes and ship in dry ice at -80°C.