EPOXIBOND™ EB-155

1 of 27 products in this brand
EB-155 is an undiluted, unfilled, low viscosity clear epoxy system that exhibits exceptional resistance to impact and thermal shock. This system has low exotherm and long work life. Applications includes, high bond strength adhesive for most similar and dissimilar substrates; LED displays, any fiber optic application. It can also be used for making in-place laminates or for protective coating on metals etc. Also it can be used for semi-rigid, moisture proof, gas tight seals between plastic and metallic or other substrates. This is also recommended for potting devices such as connector shells from which rigid or flexible wires may protrude directly through the epoxy.

Chemical Family: Epoxy & Epoxy Derivatives

Product Type: Adhesive, Encapsulant, Epoxy Adhesive, Potting Compound

Cure Method: Air Dry, Heat Cure

Application Area: Electronic Components, Fiber Optic Cables, Medical Applications, Optoelectronics Devices

Compatible Substrates & Surfaces: Metal, Plastics

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Applications & Uses

Compatible Substrates & Surfaces
Instructions for Use
  • To use, mix at room temperature, 100 grams of EB-155 part A with 82 grams of Hardener Part B and vacuum degas.
  • Do not mix more than 200 grams mass due to violent exothermic reaction with evolution of fumes and smoke.
  • Apply to clean bonding surfaces and cure as recommended to achieve the desired properties.
  • Typical cured properties were determined using recommended cure schedule. Some difference in properties may occur with the alternate or other cure schedules.

Properties

Typical Cured Properties
ValueUnitsTest Method / Conditions
Specific Gravity1.15
Hardness80Shore D
Water Absorption (24 hours Submersion at 25°C)0.17%
Lap Shear Strength to Aluminium2700psi
Linear Shrinkage0.27%
Flexural Strength (Yield)13500psi
Flexural Modulus (Yield)3.2x10⁵psi
Service Temperature Range-55 to 120°C
Glass Transition Temperature (Tg)65°C
Coefficient of Linear Thermal Expansion (From -60°C to 25°C)5910⁻⁶/°C
Die Shear Strength (at 25°C)450psi
Dielectric Constant (at 1 kHz)4.14
Dissipation Factor (at 1 kHz)0.012
Volume Resistivity1.05x10¹¹ohm-cm
Handling Properties
ValueUnitsTest Method / Conditions
EpoxibondPart A
HardenerPart B
Mix Ratio by Weight (Resin/Hardener)100/82
Mix Ratio by Volume (Resin/Hardener)1:1
Mixed Viscosity (at 25°C)2000 - 3000cps
Pot Life (at 25°C, 100 grams)45 - 60minutes
Note

Typical Cured Properties After Recommended Cure : Tested at 25°C unless otherwise indicated
 

Regulatory & Compliance

Certifications & Compliance

Technical Details & Test Data

Curing Information
  • Recommended Cure : 1 hr at 65°C
  • Alternate Cure : 24 at 25°C
Frozen Adhesive

Thaw premixed frozen adhesive at room temperature for 5-10 minutes. Dispense adhesive and cure at recommended schedules.

Safety & Health

Safety Information
  • For Industrial Use Only : Practices of good housekeeping, safety and cleanliness should be followed before, during and after use.
  • Warning : Adequate ventilation of workplace and ovens is essential. These materials may cause injury to the skin following prolonged or repeated contact and dermatitis in susceptible individuals. In case of skin contact, wash thoroughly with soap and water. For eyes, flush immediately with plenty of water for at least 10 minutes and seek medical attention. Refer to Safety Data Sheet (SDS) for additional health and safety information.

Packaging & Availability

Availability
  • 2 parts Kit : Packaged in Pint, Quart, Gallon, and 5-Gallon size.
  • Premixed and frozen : Packaged in 3cc, 5cc, 10cc and 30cc disposable syringes and ship in dry ice at -80°C.