EpoxySet Inc. STG-40

STG-40 is a non-reactive, Silicone, Thermally Conductive Grease with a high thermal conductivity and low thermal resistance with a soft, non-flowable consistency. This product is formulated with specialty binding agents to achieve lowest amount of bleed and evaporations. It is designed for applications where a silicone thermal interface material is required and where the device may later need to be easily removed from the heat sink. This compound is ideally suited for use in thin cross-sectional thicknesses down to ≤1 mil.

Product Type: Conductive Grease

Application Area: Amplifiers, Coils, Electrical Components, Power Modules, Rectifiers, Relays, Semiconductors, TV Sets

Features: Good Thermal Conductivity, Low Flow, Low Vent Bleed, Non-Toxic, Soft, Thermally Conductive

Chemical Family: Silicones

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Chemical Family
Product Type

Features & Benefits

Key Features and Benefits
  • Good Thermal Performance-(0.80 W/m°k)
  • Low Interface Thermal Resistance. -(0.05 T-In W)
  • Thin Bond lines to ≤  mil
  • Low bleed and evaporation.
  • Non-Toxic.
  • Reworkable/Easy to Remove.
  • Easy to Apply by Dispensing or Screen Printing/Stencil.

Applications & Uses

Clean Up

Standard approved clean-up and disposal procedures should be followed in every situation. The use of disposable containers and utensils are recommended whenever possible to simplify and expedite clean-up. However, when disposable containers are impractical, STG-40 can be removed by cleaning solvents with such as Mineral Spirit (Paint Thinner), Heptane or Isopropyl Alcohol.

Typical Application

STG-40 Heat Sink Compound is applied to the base and mounting studs of transistors, diodes and silicone controlled rectifiers. In these situations, a small amount of the thermal grease is applied using either the dispensing of screen printing/stencil methods STG-40 can be used as a high- voltage corona suppressant/non-flammable coating, in connections for fly back transformers located in TV sets and similar design applications. It is also used in mounting semiconductor devices; thermoelectric modules; power transistors and diodes; coupling entire heat generating assemblies to chassis; heat transfer medium on ballasts; thermal joints; thermocouple wells; mounting power resistors; and for any devices where efficient cooling is required in major industries including, electronic (computer, appliance, wireless, etc.), automotive and electrical.

Standard silicone thermal grease. Direct Replacement of Dow Corning 340 and Wakefield 120.

 

Properties

Typical Properties
ValueUnitsTest Method / Conditions
ViscosityThixotropic Paste
Specific Gravity (at 25°C)2.2
Evaporation (at 200°C, 24 hrs) 0.5%wt
Bleed (at 200°C, 24 Hrs)0.5%/Wt
Thermal Conductivity0.8W/m °KASTM D5470
Thermal Resistance0.05°C-In/W
Dielectric Strength (0.05" gap)390Volts/milASTM D150
Dielectric Constant (at 25°C, 1000Hz)4.4ASTM D150
Dissipation Factor (at 25°C, 1000 Hz.)0.0021ASTM D150
Volume Resistivity2.8 x 10^14Ω-cmASTM D257
Operating Temperature Range-65 to 205°C

Regulatory & Compliance

Certifications & Compliance

Storage & Handling

Shelf Life
5 Years
Shelf Life

STG-40 has a shelf-life of 5 years at room temperature (25°C) in unopened containers. Slight settling of the filler may occur during long-term storage. In this case, it is recommended to re-disperse the filler by hand or mechanical mixing. Refrigerate material at 0-10°C to avoid any settling.