- Applications:Industrial Manufacturing, Industrial Adhesives & Sealants, Stationery, Art & Office Supplies
- Product Families:Structural Adhesives, Adhesives & Sealants
- Chemical Family:Epoxy & Epoxy Derivatives
EPOXIBOND™ EB-119SP is unfilled, low viscosity, heat curing, high temperature resistant epoxy adhesive. It maintains high lap shear strength up to 210°C and has excellent thermal and chemical resistance. It can be used for bonding, coating, and sealing applications where a thin film with high insulating resistance is required, particularly at elevated temperatures. It is recommended for bonding metals, glass, and ceramic substrates. It has long pot-life and has an amber color change upon cure.