Essentium 9085 is a high performance polyetherimide blend made with SABIC ULTEMTM 9085 resin. Essentium 9085 has excellent long term temperature performance and toughness. The base resin meets FAR 25.853 and OSU 65/65 for flammability, heat release, smoke density and toxicity. Parts printed from Essentium 9085 are ideal for aerospace, automotive, and industrial components that must meet strict requirements for strength, temperature performance, and flammability.

Polymer Name: Polyether Imide (PEI)

End Uses: Aerospace Applications, Military Applications, Prototyping, Tooling

Density: 1340.0 - 1340.0 kg/m³

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Identification & Functionality

Technologies

Features & Benefits

KEY FEATURES
  • Excellent temperature resistance
  • Excellent toughness
  • Great strength and stiffness
  • Inherently flame retardant
  • Environmental stress cracking resistance

Applications & Uses

Markets
APPLICATIONS INCLUDE

• Aerospace
• Defense
• Composite layup tooling
• Functional prototypes

Properties

Physical Form
Material Specific Properties
ValueUnitsTest Method / Conditions
Density1.34g/cm3ISO 1183
FAA Flammability (FAR 25.853 A/B)max. 5FAR 25.853
HDT (1.8 MPa)152˚CISO 75
Moist. Absorption (23°C / 50% RH)0.17%ISO 62
OSU Peak Heat Release (5 min.)36kW/m2FAR 25.853
OSU Total Heat Release (2 min.)16kW-min/m2FAR 25.853
Oxygen Index (LOI)49%ASTM D 2863
Vertical Burn (60 sec.)2secFAR 25.853

Storage & Handling

MATERIAL HANDLING AND DRYING

Essentium 9085 is a hygroscopic thermoplastic and will absorb moisture from humid air. Keep the material in the vacuum sealed packaging until you are ready to print with it. 9085 filament should always be fed to the printer in a dry container and stored in a dry cabinet. If the material does absorb more than 200 ppm moisture, it should be dried in a low dew point (< -40˚C) oven or vacuum oven at 120 – 130˚C for 4 – 6 hours. Avoid touching filament with bare fingers or introducing oils to the filament prior to printing.

RECOMMENDED HSE PRINT SETTINGS

0.4mm Hozzle

Extrusion Width, mm 0.4 – 0.5
Layer Height, mm 0.2 –0.25
Print Speed, mm/s 50 – 250
Infill, % 15 – 75
Hozzle Temperature, ˚C 310 – 480
Bed Temperature, ˚C 150 – 185
IR Temperature, ˚C 140 – 200
Fan Speed, % 0 – 20

0.8mm Hozzle

Extrusion Width, mm 0.7 – 0.9
Layer Height, mm 0.3 –0.35
Print Speed, mm/s 20 – 220
Infill, % 15 – 75
Hozzle Temperature, ˚C 310 – 480
Bed Temperature, ˚C 150 – 185
IR Temperature, ˚C 140 – 200
Fan Speed, % 0 – 20

RECOMMENDED FDM PRINT SETTINGS

Nozzle Temperature, ºC 360 – 390
Bed Temperature, ºC 120 – 140
Print Speed, mm/s 20 – 40
First Layer Speed, mm/s 20 – 25
Fan Speed, % 0 – 15
Bed Material G-11 or MIC-6 Aluminum
Bed Adhesion Method Magigoo® HT or VM Nano
Infill Density, % <80