HexPly® M76 is a versatile curing toughened epoxy resin that can be cured from 275ºF (135ºC) to 350ºF (177ºC), depending on service temperature requirements. HexPly® M76 is formulated for lower temperature autoclave or press mold processing. The recommended lay-up procedure for HexPly® M76 is HSP-L4. The recommended cure procedures are HSP-C5 (275ºF) or HSP-C1 (350ºF).

Polymer Name: Epoxy Resins & Compounds

Functions: Prepreg

Processing Methods: Compression Molding, Prepreg Processing

Technical Data Sheet

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Identification & Functionality

Composite Materials Functions

Features & Benefits

Materials Features
Product Highlights
  • Toughened epoxy exhibiting “co-continuous” morphology
  • Excellent impact resistance
  • Versatile cure temp; 275ºF (135ºC) to 350ºF (177ºC)
  • Controlled flow
  • Available in a broad range of reinforcements for both tapes and fabrics
  • Autoclave or press mold processing
  • Low outgassing

Applications & Uses

Composites Processing Methods

Properties

Physical Form
Neat Resin Properties
ValueUnitsTest Method / Conditions
Flexural Modulus (121°C, Wet)0.44Msi
Flexural Strength (121°C, Wet)11.3ksi
RDS DMA Tg (9°F/min, Tan Delta)185°C
RDS DMA Tg (9°F/min, G'')173°C
RDS DMA Tg (9°F/min, G')165°C
K1C1.59Mpa-m½
Flexural Modulus (RT)0.57Msi
Flexural Strength (RT)22.4ksi
Compression Strength (RT)26ksi
G1C638J/m²
Density1.3g/cm³

Technical Details & Test Data

Technical Details

HexPly® M76 - Technical Details

HexPly® M76 - Technical Details - 1HexPly® M76 - Technical Details - 2

Storage & Handling

Storage Life
  • Out Life @ room temperature 14 days
  • Shelf Life @ 0°F (-18°C) 12 months (maximum, from date of manufacture)