Inktec TEC-PA-088

Inktec TEC-PA-088 is a low consumption and has fine patterning less than 20μm line width, thin layer ≤5μm. It has a high density after curing because it has few or no gab between particles. That is why our ink can materialize fine pattern with high conductivity.

Application Area: Printed Electronics, RFID, Touch Panels (Smartglass)

Compatible Substrates & Surfaces: Glass, Paper, Plastics

Features: Conductive, Cost Effective, Excellent Substrate Adhesion, High Viscosity, Uniform Distribution

Application Method: Screen Coating

Chemical Family: Silver & Silver Compounds

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Patterning Method
Screen + Laser
Material Type
Conductive paste (High viscosity)
Main Components
Ag powder
Substrate
ITO, PET, Glass, Paper, ETC

Features & Benefits

Remark
For Ultra fine pattern
Features
  • Optimization in Fine Pattern & Thin Layer
  • Short Curing Time in a Low-temperature

Applications & Uses

Application Method
Compatible Substrates & Surfaces
Applications

Touch Panel, Solar Cell, Display, EMI Shielding, RFID and so on.

Applicables

TSP Bezel, Health care, Sensor, Display, Smart Label, Wearable, Membrane, etc.

Properties

Physical Form
Typical Properties
ValueUnitsTest Method / Conditions
Curing Temperature (Convection oven 20min)130.0°C
Layer Thickness (After curing)4.0-4.5μm
Volume Resistance (on ITO)max. 6.5×10^-5Ωcm
Available Line Widthmin. 15μm
Viscosity (at 20rpm)45000.0cps
Adhesion5 - 4B

Technical Details & Test Data

Laser Pattern : Microscope Image (Dark Field Mode)

TEC-PA088 (L/S=20 μm/20 μm)

Inktec TEC-PA-088 - Laser Pattern : Microscope Image (Dark Field Mode)