MG Chemicals 832TC - Thermally Conductive Epoxy

Thermally Conductive Epoxy, Encapsulating & Potting Compound 832TC is a 2-part, black epoxy that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. It is designed for applications where thermal management is a concern. Its high thermal conductivity helps protect circuits by reducing the risk of heat buildup. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

Product Type: 2K (2 component) Sealant, Epoxy Sealant, Potting Compound

Compatible Substrates & Surfaces: Ceramic, Composites, Glass, Metal, Plastics

Chemical Family: Epoxy & Epoxy Derivatives

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Identification & Functionality

Features & Benefits

Labeling Claims
Key Attributes
  • Low exotherm
  • Convenient 1A:1B volume mix ratio
  • High compressive and tensile strength
  • Excellent adhesion to a wide variety of substrates including metals, composites, glass, ceramics, and many plastics
  • Excellent electrical insulating characteristics
  • Extreme resistance to water and humidity
  • Solvent-free
Recommended Preparation
Clean the substrate with Isopropyl Alcohol, MG #824, so the surface is free of oils, dust, and other residues.

Applications & Uses

Compatible Substrates & Surfaces

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Mix Ratio1:1Volume
Mix Ratio1.1:1Weight
Working Time2h
Cured Properties
ValueUnitsTest Method / Conditions
Breakdown Voltage48300V
Compressive Strength87N/mm2
CTE (After Tg)114ppm/˚C
CTE (Prior Tg)142ppm/˚C
Dielectric Strength386V/mil
Glass Transition Temperature (Tg)50°C
Hardness D81
Intermittent Temperature200˚C
Lap Shear (Aluminum)16N/mm2
Lap Shear (Stainless Steel)13N/mm2
Resistivity8.2 x 10¹²Ω·cm
Service Temperature Range-30 to 175˚C
Tensile Strength23N/mm2
Thermal Conductivity (at 25˚C)0.7W/(m·K)
Uncured Properties
ValueUnitsTest Method / Conditions
Mixed Density1.67g/mL
Viscosity (at 25 ˚C) ⁽ᵃ⁾33Pa·s
Viscosity (at 25 ˚C) ⁽ᵇ⁾12Pa·s
Cure Instructions

Allow to cure at room temperature for 24 hours, or cure in an oven at one of these time/temperature options:

Temperature 65 °C 80 °C 100 °C
Time 2 h 1 h 45 min

 

Regulatory & Compliance

Technical Details & Test Data

Mixing
  1. Scrape settled material free from the bottom and sides of the part A container; stir the contents until homogenous. Use a paint shaker if available.
  2. Measure 2 parts by volume of the part A and pour into the mixing container. Ensure all contents are transferred by scraping the container.
  3. Measure 1 part by volume of the part B and pour into the mixing container. Ensure all contents are transferred by scraping the container.
  4. Thoroughly and gently mix parts A and B together. Avoid introducing air bubbles.
  5. To de-air, let sit for 15 minutes or put in a vacuum chamber at 25 inHg for 2 minutes.
  6. If bubbles are present at the top, break them gently with the mixing paddle.
  7. Pour the mixture into a container holding the components to be protected.
  8. Close the part A and B containers tightly between uses to prevent skinning.
Viscosity vs. Temperature

MG Chemicals 832TC - Thermally Conductive Epoxy - Viscosity Vs. Temperature

Packaging & Availability

Packaging Type
Available Packaging
Cat. No. Packaging Net Vol. Net Wt.
832TC-450ML 2 Bottle kit 450 mL 751 g
832TC-2L 2 Can kit 1.7 L 2.83 kg
832TC-8L 2 Can kit 7.2 L 12.0 kg
832TC-40L 2 Pail kit 40 L 66.8 kg

Storage & Handling

Shelf Life
5 Years
Storage and Handling
Store between 16 and 27 ˚C in a dry area, away from sunlight (see SDS). Storage below 16 °C can result in crystallization.