MG Chemicals 9310 - 1 Part Epoxy Adhesive

9310 is a 1-part, fast curing, electrically insulative epoxy adhesive. It is a smooth, thixotropic paste that stays in place without tailing when dispensed. This surface mount adhesive is specially designed for die attach applications in electronics assembly operations. It can be readily used in manual, pneumatic and robotic dispensing processes. It can also be used as a general-purpose adhesive for household, industrial and manufacturing applications. It has an unlimited working life at room temperature and does not require mixing or frozen storage.

Product Type: 1K (1 component) Adhesive, Epoxy Adhesive

Application Area: Die/Chip Attach

Cure Method: Heat Cure

Application Method: Injection

Chemical Family: Epoxides

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Knowde Enhanced TDS

Identification & Functionality

Chemical Family

Features & Benefits

Key Attributes
  • Consistent dot profile
  • No mixing, unlimited working time at room temperature
  • Room temperature storage
  • Strong adhesion to a variety of substrates
  • Suitable for automated dispensing
  • Fast curing

Applications & Uses

Application Area
Application Method
Cure Method
Recommended Preparation

Clean the substrate with Isopropyl Alcohol, MG #824, so the surface is free of oils, dust, and other residues.

Syringe or Cartridge

  • For 10 mL size, twist and remove the cap from the syringe. Do not discard the cap.
  • For the 300 mL size, cut the end of the cartridge tip.
    • Screw the tip on the cartridge.
    • Insert the cartridge in a caulking gun.
  • Dispense the adhesive evenly to both surfaces.
  • To stop the flow, pull back on the plunger.
  • Clean nozzle to prevent contamination and material buildup.
  • Replace the cap on the cartridge or syringe.

Dispensing Accessories

9310-300ML cartridges are compatible with caulking guns that are readily available for purchase at local hardware stores.

Properties

Physical Form
Physical Properties
ValueUnitsTest Method / Conditions
Density1.15g/mL
Thermal Properties
ValueUnitsTest Method / Conditions
Thermal Conductivity (at 25 ˚C)0.2W/(m·K)
Typical Properties
ValueUnitsTest Method / Conditions
Viscosity (at 25 ˚C)87Pa·s
Cured Properties
ValueUnitsTest Method / Conditions
Breakdown Voltage41600V
Dielectric Strength220V/mil
Resistivity9.3 x 10¹²Ω·cm
Hardness Shore D84
Tensile Strength9.4N/mm2
Compressive Strength103N/mm2
Lap Shear (Stainless steel)8.5N/mm2
Lap Shear (Aluminum)6.2N/mm2
Glass Transition Temperature (Tg)113˚C
CTE Prior Tg56ppm/˚C
CTE After Tg185ppm/˚C
Service Temperature Range-55 to 140˚C

Regulatory & Compliance

Quality Standards

Technical Details & Test Data

Cure Instructions

The product will not cure at room temperature. Cure the adhesive in an oven at one of these time/ temperature options:

Temperature 100 °C 120 °C
Time 30 min 10 min
Usage Parameters
Working Time Unlimited

Packaging & Availability

Packaging Type
Available Packaging
Cat. No. Packaging Net Volume Net Weight
9310-10ML Syringe 10 mL 11.4 g
9310-300ML Cartridge 300 mL 344 g

Storage & Handling

Shelf Life
2 Years
Storage

Store between -10 and 27 ˚C in a dry area, away from sunlight (see SDS). To maximize shelf life, recap product firmly when not in use.