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jER™ Epoxy

The Mitsubishi Chemical Group Brand

Brand Summary

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Identification & Functionality

Polymer Name
Epoxy Resins & Compounds
Chemical Family
Bisphenol A Type Epoxy,Bisphenol Epoxy Resins,Bisphenol F Type Epoxy,Epoxy & Epoxy Derivatives
Technologies
CASE Ingredients,Composite Materials,Plastics
Product Families
Polymers & Resins
Thermoset Resins
Thermoset Resins
Epoxies
Polymer Additives
Performance Additives,Surface Modifiers
Resins & Binders
Epoxies
Additives
Functional Additives
CASE Ingredients Functions
Adhesion Promoter,Binder & Resin,Coupling Agent,Flame Retardant,Plasticizer
Plastics & Elastomers Functions
Adhesion Promoter,Plasticizer,Resin
Composite Materials Functions
Adhesion Promoter,Impact Modifier,Resin, Binder & Matrix Material

Features & Benefits

Labeling Claims
High Purity

Applications & Uses

Markets
Adhesives & Sealants,Building & Construction,Consumer Goods,Electrical & Electronics,Paints & Coatings,Printing & Packaging
Applications
Applications
Appliances & Electronics
Industrial & Assembly Adhesives
Electronics Adhesives
Packaging & Assembly
Electronics Coatings,Adhesives & Sealants,Potting Compounds,Other Packaging & Assembly Applications
Parts & Components
Semiconductor Manufacturing,Printed Circuit Boards (PCBs)
Industrial Coatings
Metal Coatings
Specialty Coatings
Electronics Coatings
Packaging Coatings
Can Coatings
Packaging Coatings
Can Coatings
Devices & Assemblies
Consumer Electronics,Displays,Other Devices & Assemblies
Applications
Other Adhesives & Sealants Applications
Applications
Other Building & Construction Applications
Applications
Other Paints & Coatings Applications
Compatible Substrates & Surfaces
Aluminum,Ceramic,Concrete,Fibers & Fabrics,Glass,Metal,Plastics,Steel
Cure Method
Chemical Cure,Radiation Cure
Adhesive & Sealant Type
Underfill
Plastics & Elastomers End Uses
Semiconductor Applications
Coating Type
Base Coat,Conformal Coating,Powder Coating,Radiation Curable Coating

Brand Highlights

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Structure

Definition: Compounds having multiple epoxy groups

Characteristics

When an epoxy resin is allowed to react with various curing agents, an infusible, insoluble, three-dimensional, hardened material is formed. The features listed below indicate how this high-performance, multipurpose resin can be used for a wide variety of applications.

  • There is tremendous freedom to adapt the material properties to the specific application requirements by adding various modifying agents (fillers, flexibility agents, diluents.)
  • Curing shrinkage is small.  Dimensional stability is excellent.
  • Excellent adhesion to metal, porcelain, concrete, etc.
  • High mechanically strength.
  • Excellent as an electrical insulator.
  • Excellent flexibility.
  • Excellent heat resistance.
  • Excellent wear and abrasion resistance.
  • Excellent chemical resistance, and moisture (water) resistance.
Typical Reactions

<Reaction with Representative Hardeners>

<Self Polymerization>

Selection of Hardeners

Appropriate choice of Hardener for a desired curing temperature

General Ways to Use Epoxy
  • Epoxy resin forms 3D-crosslinked network structure
  • Abundant choices of Epoxy/Hardener combination

Types of Epoxy Resins

In addition to the basic bisphenol A resin mentioned above, other specialized resins are manufactured and sold to give the cured material specific property enhancements.

Following are the main specialized resins

  • Bisphenol F epoxy resin: Low viscosity makes it excellent to work with.
  • Multifunctional epoxy resin:  Cured material has outstanding thermal and chemical resistance.
  • Flexible epoxy resin:  The cured material's crack-resistance is improved.
  • High molecular weight epoxy resin (phenoxy resin): The cured coating has excellent machinery property.
  • Biphenyl epoxy resin:  The cured material has excellent heat resistance and low stress.

Either alone or in combination with bisphenol A epoxy resin, these special resins can give specific features to the cured product to satisfy application requirements.

Applications
  • Paints and coatings
  • Electrical insulation materials
  • Composite materials
  • Civil-engineering and construction materials
  • Adhesives
  • Tools
  • Other applications
Handling Precautions

A Japanese Ministry of Health, Labor, and Welfare toxicity study concluded that bisphenol A liquid epoxy resin and bisphenol F liquid epoxy resin are mutagenic. Therefore, when handling, it is necessary to follow the guidelines provided by the Ministry. In addition, as substances that can cause allergic dermatitis, official handling guidelines have been established by the Japanese Labor Standards Director and the Ministry of Health, Labor and Welfare. Similarly, precautions are needed in handling the curing agent. Especially amine-type curing agents can cause allergy-like dermatitis in people. In order to avoid direct contact, please use protective cream, gloves, goggles, and apron.  Avoid inhalation of vapor and particulates by working in a well-ventilated area and working upwind of the material.

In the event of skin contact, avoid use of solvents, wipe the affected area with a dry cloth, wash thoroughly with soap and water, and then apply hand cream.

In the event of eye contact, flush eyes with water for more than 15 minutes, and then seek medical attention.

Lineup / Specifications

Various requirements are addressed by changing the molecular weight and/or the basic structure of the epoxy resin.  A broad range of products are available in liquid, solid, or powder form, depending on the application.

  • Basic Liquid Type
  • Diluted Type
  • Basic Solid Type
  • Solution Type
  • Bis-F Liquid Type
  • Bis-F Solid Type
  • Phenoxy Type (Polymer Type Epoxy Resins)
  • Flame-retardant Type
  • Multifunction Type
  • Flexible Type
  • Special Function Type
  • Biphenyl Type
  • Emulsion Type (water-based epoxy resin)