jER Epoxy - YL983U - Mitsubishi Chemical

Knowde Enhanced TDS

Identification & Functionality

Chemical Family: Bisphenol Epoxy Resins,
Bisphenol F Type Epoxy,
Epoxy & Epoxy Derivatives
Polymer Name: Epoxy Resins & Compounds
CASE Ingredients Functions: Adhesion Promoter,
Binder & Resin,
Coupling Agent
Composite Materials Functions: Adhesion Promoter,
Resins, Binders & Matrix Materials
Plastics & Elastomers Functions: Resin
Technologies: CASE Ingredients,
Composite Materials,
Plastics
Product Families: CASE Ingredients — Additives
Functional Additives
Composite Materials — Polymers & Resins
Thermoset Resins
CASE Ingredients — Resins & Binders
Epoxies
Plastics — Thermoset Resins
Epoxies
Molecular Structure

Features & Benefits

CASE Ingredients Features: Abrasion Resistance,
Chemical Resistance,
Excellent Electrical Insulation,
Good Elastic Recovery,
Good Electrical Properties,
Good Mechanical Properties,
Heat Resistance,
Improved Dimensional Stability,
Improved Flexibility,
Low Chlorine Content,
Low Viscosity,
Reduced Wear,
Water Resistance
Materials Features: Chemical Resistant,
Electrically Insulating,
Good Elastic Recovery,
Heat Resistance,
Low Viscosity,
Water Resistant
Features: Highly adhesive to metal, porcelain, concrete

Excellent insulation property

High heat resistance

High chemical resistance

High water resistance
Product Highlights: Liquid type

Significantly low chlorine content (Total-Cl：below 500ppm)

Low viscosity

Applications & Uses

Markets: Adhesives & Sealants,
Building & Construction,
Consumer Goods,
Electrical & Electronics,
Paints & Coatings
Applications: Consumer Goods — Appliances & Electronics
Electrical & Electronics — Devices & Assemblies
Other Devices & Assemblies
Adhesives & Sealants — Industrial & Assembly Adhesives
Electronics Adhesives
Adhesives & Sealants — Other Adhesives & Sealants Applications
Building & Construction — Other Building & Construction Applications
Paints & Coatings — Other Paints & Coatings Applications
Electrical & Electronics — Packaging & Assembly
Adhesives & Sealants,
Other Packaging & Assembly Applications,
Potting Compounds
Electrical & Electronics — Parts & Components
Printed Circuit Boards (PCBs),
Semiconductor Manufacturing
Compatible Substrates & Surfaces: Aluminum,
Ceramic,
Concrete,
Fibers & Fabrics,
Glass,
Metal,
Plastics,
Steel
Adhesive & Sealant Type: Underfill
Plastics & Elastomers End Uses: Semiconductor Applications

Properties

	Value	Units	Test Method / Conditions
Density (at 25°C)	1.2	g/cm3	Density Meter (Vibration type)

	Value	Units	Test Method / Conditions
Epoxy Equivalent Weight (WPE)	165 - 175	g/eq	Potentiometric Titration
Harsh Hydrolyzable Chloride	max. 200	ppm	Potentiometric Titration
Saponificable Chloride	0 - 50	ppm	Potentiometric Titration
Viscosity (at 25°C)	30-60	P	Capillary Viscometer
Total Chloride Content	300	ppm	—

Technical Details & Test Data

Typical Reactions with Representative Hardeners
Typical Reactions with Self Polymerization
Selection of Hardeners: Appropriate choice of Hardener for a desired curing temperature
General Ways to Use Epoxy: Epoxy resin forms 3D crosslinked network structure

Abundant choices of Epoxy/Hardener combination

Packaging & Availability

Storage & Handling

Shelf Life: 3 months
Storage and Handling: Carefully read the SDS before using, handling, transporting, storing or disposing. jER™ YL983U should be stored in tightly closed containers under exclusion of humidity at gentle temperatures. Avoid exposure to direct sunlight. Under these storage conditions the product has a minimum shelf life of three months from date of delivery.